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Interconnect Systems, Inc.

Partner Information

ISI designs and manufactures a broad array of advanced electronics packaging and interconnect solutions. Capabilities include PCB/substrate design, advanced SMT, bare die assembly, and custom module interconnect, testing and inspection. Product categories include: Miniaturized FPGA systems, 3D Packaging, High Density Modules, IC Obsolescence, Production BGA Socketing System, Molded Multi-Component Modules, Cost Reduction Modules, IC Footprint Conversion Adapters, Flex Circuit Assemblies, and Bare Die to PCB or Flex.

ISI's subsidiary, Nallatech, is a leading provider of FPGA Network Processing Cards capable of addressing a range of latency-critical applications including encryption/decryption, network monitoring and security, deep packet Inspection, real-time image processing, and high frequency trading. Customers benefit from lower costs, reduction in size, weight and power and improved performance. For further information please visit www.nallatech.com.


Products and/or services provided by Alliance Program Members are sold or licensed solely by the Member and not Xilinx. Please be advised that Xilinx hereby disclaims any warranties, express or implied, including warranties of merchantability, fitness for a particular purpose, or noninfringement with respect to any such products and/or services.

Xilinx Design Experience

Program Member Since2009
Certified Engineers2
Approved Products Posted0

Products and Services

  • Design Service

Market Segments

  • Wired Comms & Networks
Interconnect Systems, Inc.

Program Tier:



Camarillo, CA US (Headquarters)
Bel Air, MD US (Branch Office)
Glasgow,  GB (Branch Office)
Bristol,  GB (Design Office)