3D PLUS S.A.
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Market Segments
- Aerospace & Defense
- Industrial Scientific Medical
Product Types
- Electronic Component
- Design Service
3D Plus is a worldwide supplier of advanced high density 3D microelectronic products and Die Stacking technologies meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. Our patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package We offer catalog products and more complex System-In-Package (SiP) solutions that bring breakthrough advantages to our customers’ electronic designs. We focus on the demand for high-reliability and high-performance for space-saving technology-driven applications in industrial, computing/telecommunications, security and defense, avionics, medical and space markets
Products and/or services provided by Alliance Program Members are sold or licensed solely by the Member and not Xilinx. Please be advised that Xilinx hereby disclaims any warranties, express or implied, including warranties of merchantability, fitness for a particular purpose, or noninfringement with respect to any such products and/or services.