Interconnect Systems, Inc.
Market Segments
- Automotive
- Aerospace & Defense
- Industrial Scientific Medical
- Broadcast
Product Types
- Board
- Design Service
ISI designs and manufactures a broad array of advanced electronics packaging and interconnect solutions. Capabilities include PCB/substrate design, advanced SMT, bare die assembly, and custom module interconnect, testing and inspection. Product categories include: Miniaturized FPGA systems, 3D Packaging, High Density Modules, Production BGA Socketing System, Molded Multi-Component Modules, Cost Reduction Modules, IC Footprint Conversion Adapters, Flex Circuit Assemblies, and Bare Die to PCB or Flex. ISI's subsidiary, Nallatech is the domain expert in accelerated FPGA computing solutions. Nallatech designs and manufactures high-performance FPGA products for High Performance Computing applications and Rugged Embedded Computing platforms. Customers benefit from lower costs, reduction in size, weight and power and improved performance. For further information please visit www.nallatech.com.
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