Xilinx Inc., an Equal Opportunity Employer, always welcomes applications from candidates qualified for available positions.
Job Title: Senior Software Engineer
Job Description:
Responsible for designing and developing software tools and methodologies to test company FPGA (Field Programmable Gate Array) devices. Contribute to next generation DFT test technologies and mentor new people in the group. Prepare software design specification and functional specification.
Education:
Bachelor or foreign equivalent in Computer Science, Electrical Engineering or related field.
Experience:
5 years of progressive experience in position or related occupation such as Member of Technical Staff, Software Design Engineer, Engineer, Subject Matter Expert or related.
Special Requirements:
Experience with EDA software development including Verilog simulators such as NC-Sim, VCS, or ModelSim. Experience with C++, STL, BOOST libraries and object oriented software methodology. Experience with Verilog. Experience with UNIX/Linux environment. Experience with digital logic design.
This position is eligible for employee referral program benefits.
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Senior Packaging Engineer
Job Description:
Develop advanced assembly and packaging solutions for new product introduction using flip chip and 3D technologies on laminate BGA packages to meet established requirements. Develop recommendations and communicate the assembly design rules according to the nature of the product, cost limitations, legal requirements, and the type of protection required, taking into consideration the need for resistance to external variables. Use appropriate tools to produce timely and accurate analyses used to drive design, development, and supply chain decisions. Drive process development for new products by planning and executing various DOEs. Drive new assembly process technology qualifications and transfer the product/process to NPI group by successfully completing all the phase gate prerequisites. Up to 25% fully reimbursed international travel to customer locations for process review and audits.
Education:
Master’s degree or foreign equivalent in Mechanical Engineering, Materials Engineering, or related.
Experience:
3 years as a Packaging Engineer, New Product Development Engineer, Applications Engineer, or related position.
Special Requirements:
Experience with assembly process and material qualification for large die flip chip devices on both ceramic and organic substrates. Experience with various clean room assembly equipment including Chip Placement Machine, Reflow Furnace, Underfill Dispensing Machine, and Printing Machine. Experience performing Finite element simulations to predict the solder joint reliability utilizing knowledge of Physics of solder joint failure. Experience working on various FA and characterization techniques including Cross section, CSAM, XRAY, SEM, EDX, TEM, TGA, and DSC. Experience with statistical data analysis techniques and commercial statistical tools including Minitab and JMP. Experience working with various overseas customers and vendors and to drive projects involving team members across different continents.
This position is eligible for employee referral program benefits.
>> Apply Now
