SAN JOSE, Calif., Nov. 11, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device. Xilinx UltraScale™ devices deliver an ASIC-class advantage with the industry's only ASIC-class programmable architecture coupled with the Vivado® ASIC-strength design suite and recently introduced UltraFast™ design methodology. The UltraScale devices enable 1.5X – 2X more realizable system-level performance and integration for customers, equivalent to a generation ahead of the competition.
"This announcement underscores our first-to-market leadership commitment of delivering
high-performance FPGAs," said Victor Peng, senior vice president and general manager of products at Xilinx. "The next generation starts now with the shipment of our new UltraScale devices, building upon the tremendous momentum we have established with our 7 series."
"The delivery of UltraScale devices on TSMC's 20nm process technology marks a new juncture for the semiconductor industry," said TSMC vice president of R&D, Dr. Y.J. Mii. "We are happy to see Xilinx continue to break new ground and deliver 20nm silicon to its customers."
Xilinx UltraScale devices enable next generation smarter systems with new high-performance architectural requirements for applications such as 400G OTN, packet processing and traffic management, 4X4 Mixed Mode LTE, WCDMA Radio, 4K2K and 8K displays, Intelligence Surveillance and Reconnaissance (ISR), and high-performance computing applications for the data center.
Initial UltraScale device samples are shipping now. General sampling begins in Q12014.
Vivado Design Suite early access supporting UltraScale devices is now available. Customers interested in the UltraScale early access program can contact their local Xilinx representative. For more information, please visit: www.xilinx.com/ultrascale.
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs, and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
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Silvia E. Gianelli
SOURCE Xilinx, Inc.