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Xilinx 90nm Process Technology Drives Down Costs
IBM first foundry in the world to receive tape-out on 90nm devices from Xilinx
IBM and Xilinx are preparing for production of the first Xilinx 90nm chips on 300mm wafers. These next-generation FPGAs are planned for volume production in 2003, and will result in a 50-80% chip size reduction compared to any competing FPGA solution. These devices will use IBM's most advanced, copper-based 90nm semiconductor manufacturing process technology. They will be built at IBM's $2.5 billion, state-of-the-art 300mm facility in East Fishkill, N.Y.
"Our collaboration with IBM in developing leading edge manufacturing technologies is a vital component of our success as the market leader in programmable logic," said Wim Roelandts, Xilinx President & CEO. "Unlike other semiconductor companies - fabless or otherwise - we're moving aggressively toward 90nm to deliver even greater price/performance benefits to our customers, opening up entirely newe markets for programmable logic."
"What we have just accomplished with Xilinx is testament to the fact that we've got the most advanced semiconductor technology, chip design and manufacturing capabilities in the industry," said Michel Mayer, general manager, IBM Microelectronics Division. "Ultimately, this benefits our foundry customers because they leverage our expertise to get their high-performance chips to market as quickly and efficiently as possible."
Next generation FPGAs to deliver 1 million system gates for under $25
Xilinx has consistently delivered the lowest cost FPGAs in the industry. Continuing this trend, the company announced a major step toward the production of what could be the world's first 90nm chip: first tape out of a new Xilinx FPGA with IBM. The company's investment in the most advanced chip-making technology, with both IBM and UMC, will result in a 50-80% die size reduction for Xilinx FPGAs compared to any competing solution (shipping or announced). And, it will enable Xilinx to drive down FPGA pricing for one million system gates (approximately 17,000 logic cells)* to under $25, which represents a savings of 35-70% compared to any competitive offering.
The graph above shows how the cost of one million system gate FPGAs has been driven down steadily over time through migration to advanced process technologies.
UMC and Xilinx on Track to Manufacture 90nm Programmable Chips on 300mm Wafers in 2003
UMC is preparing to manufacture a new family of Xilinx field programmable gate arrays (FPGAs) at its 300mm fabrication facility and has produced an FPGA test chip. UMC's L90 process integrates nine layers of high-speed copper interconnect, 1.2V high performance transistors and low-k dielectric material into a single manufacturing process.
"UMC and Xilinx have worked together on the early introduction of FPGA products across many process generations, and we are happy to extend the cooperation down to 90nm," said John Hsuan, vice chairman and CEO of UMC. "Xilinx stands to gain the maximum cost advantages of manufacturing products on 300mm wafers using 90nm process technology, due to fundamental device architecture and die size of its FPGAs. We're looking forward to helping Xilinx bring to its customers the full benefits of this advanced manufacturing."
Xilinx Process Technology Leadership
Xilinx, one of the pioneers of the fabless semiconductor business model more than 18 years ago, continues to head the race to advanced manufacturing processes and has established an impressive track record of industry firsts - including first to 150nm in 2001 and first to 130nm in 2002. Currently, the company is also the highest volume purchaser of 300mm wafers globally.
* Projected pricing for 250,000 units at end 2004.