First to introduce All Programmable 3D ICs, Xilinx offers the world’s highest capacity homogeneous 3D FPGA as well as the only heterogeneous 3D FPGA. A homogeneous 3D IC stacks four FPGA logic slices side-by side while a heterogeneous 3D IC places 28G transceiver(s) alongside FPGA dice on a single silicon interposer. By combining several of these die in a single device, these devices can exceed the capacity and bandwidth of monolithic devices, but with manufacturing and time-to-volume advantages of smaller die.
To address the typical challenges of interconnecting multiple FPGAs, Xilinx 3D IC devices utilize Stacked Silicon Interconnect technology, enabling high-bandwidth connectivity between multiple die and providing a 100x improvement in inter-die bandwidth per watt compared to multi-chip approaches. It also imposes much lower latency and consumes dramatically lower power than either the multi-FPGA or multi-chip module approach, while enabling the integration of transceivers and on-chip resources within a single package. SSI technology leverages proven microbump technology combined with coarse pitch through-silicon vias (TSVs) on a passive (no transistors) 65nm silicon interposer to deliver high reliability interconnect without performance degradation on one FPGA device. This breakthrough technology provides the next level of advanced system integration for applications that require high logic density and tremendous computational performance.
Four devices in the industry-leading 28nm Virtex®-7 FPGA family employ SSI technology – thereby offering customers a broad range of resources and capabilities to match leading edge demands. The SSI-enabled devices shown below offer unprecedented FPGA capabilities. These devices provide up to:
Xilinx 3D IC devices are ideal for applications such as next-generation wired communications, high-performance computing, medical image processing, and ASIC prototyping/emulation.