Small form factor packaging

Xilinx leads the way in advanced package innovation by offering two new, ultra small form-factor, Quad Flat no-lead (QF) packages to the popular full line-up of Chip Scale Packages (CP).

  • Maximum board space savings
  • Lower cost QF32 package only requires 25mm2 of board space
  • Simplifies board routing and allowing smaller overall end-products
  • Perfect for handheld and other space constrained applications that need 32 or 64 macrocell CPLDs in the smallest possible space.

CoolRunner-II offers the newest 0.5mm pitch QF and CP packages for the broadest selection of low cost, small form-factor packages at 1.8 volts from 21 to 117 I/O.

 

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Figure 1: The QF32, CP56, QF48 and CP132 CoolRunner-II packages are required for portable, ASIC fix & other size constrained applications
cpld-package-options
Tabel 1: CPLD package options (Max I/O is listed in parenthesis)