Small Form-Factor Package Solutions
The World's Smallest CPLD Package
Xilinx leads the way in advanced package innovation by offering two new, ultra small form-factor, Quad Flat no-lead (QF) packages to the popular full line-up of Chip Scale Packages (CP) already available in the CoolRunner™-II family. These new low cost QF packages offer the smallest form-factor packaging available today for a CPLD.
Learn more about Small Form Factor Packages
Press Release
Maximum
Board Space Savings
The lower cost QF32 package only requires 25mm2 of board space compared to the traditional low cost VQ44 package that requires 144mm2 almost six times larger.
By taking up less board space, lowering cost, simplifying board routing and allowing smaller overall end-products,
these advanced QF packages are the perfect solution for handheld and other space constrained applications that need 32 or 64 macrocell CPLDs in the smallest possible space.
If more I/O is required Chip Scale Packages are also available.
Figure 1
The QF32, CP56, QF48 and CP132 CoolRunner-II packages are required for portable, ASIC fix & other size constrained applications.
Broad Product Offering For Small Form-factor Packages
Small form-factor packages are offered in all Xilinx CPLD families from the low power CoolRunner-II (1.8V) and CoolRunner XPLA3 (3.3V) families to the three XC9500 families (5, 3.3 and 2.5V).
CoolRunner-II offers the newest 0.5mm pitch QF and CP packages for the broadest selection of low cost, small form-factor packages at 1.8 volts from 21 to 117 I/O. The low cost XC9500XL family offers 0.8mm pitch CS packages for space constrained applications needing low cost at 3.3 volts with from 36 to 192 I/O.
| CPLD Package Options |
Package
Size
|
CoolRunner-II
(1.8V,
low power) |
XC9500XL(3.3V)
XC9500XV(2.5V)
XC9500 (5.0V) |
CoolRunner
XPLA3
(3.3V,
low power) |
QF32
5 x 5mm |
XC2C32A (21) |
|
|
CP56
6 x 6mm |
XC2C32A (33)
XC2C64A (48) |
|
XCR3064XL (48) |
QF48
7 x 7mm |
XC2C64A (37) |
|
|
CS48
7 x 7mm |
|
XC9536XL (36)
XC9536XV (36)
XC9536 (34)
XC9572XL (38)
XC9572XV (38) |
XCR3032XL (36) XCR3064XL (40) |
CP132
8 x 8mm
|
XC2C128 (100)
XC2C256 (106) |
|
|
CS144
12 x 12 mm |
|
XC95144XL (117)
XC95144XV (117) |
XCR3128XL (108) |
CS280
16 x 16 mm
|
|
XC95288XL (192)
XC95288XV (192) |
XCR3256XL (164) |
Table 1
Max I/O is listed in parenthesis.
Xilinx Package Designations
QF = Quad Flat no-lead with 0.5mm pitch
CP = Chip Scale Package with 0.5mm pitch
CS = Chip Scale Package with 0.8mm pitch
Both Quad Flat no-lead and Chip Scale Packages are finding their way into high volume, space constrained application such as handsets, digital cameras, MP3 players and PCMCIA cards that all benefit from these low cost, small form-factor packages.
