Stacked Silicon Interconnect
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Agile Mixed Signal DSP Embedded Processing Connectivity Memory Solutions Power Signal Integrity Transceivers Configuration Solutions Design Security Stacked Silicon InterconnectKey Documents
- WP380 - Xilinx Stacked Silicon Interconnect Technology Delivers Breakthrough FPGA Capacity, Bandwidth, and Power Efficiency
- Technical Viability of Stacked Silicon Interconnect Technology by IBS Research
- WP312 - Xilinx Next Generation 28 nm FPGA Technology Overview
- Virtex-7 FPGAs Data Sheet: DC and Switching Characteristics
Xilinx’s revolutionary Stacked Silicon Interconnect (SSI) technology allows multiple die to be combined in a single chip and provides a 100x improvement in inter-die bandwidth per watt compared to multi-chip approaches. SSI leverages proven microbump technology combined with coarse pitch through-silicon vias (TSVs) on a passive (no transistors) 65nm silicon interposer to deliver high reliability interconnect without performance degradation on one FPGA device. This breakthrough technology provides the next level of advanced system integration for applications that require high logic density and tremendous computational performance.
Stacked Silicon Interconnect technology enables the highest capacity FPGAs at least a full process generation sooner than traditional approaches. Additionally SSI enables Xilinx to release ultra-high capacity FPGAs at the beginning of the family rollout. FPGAs utilizing stacked silicon interconnect are ideal for applications such as next-generation wired communications, high-performance computing, medical image processing and ASIC prototyping and emulation.
Virtex-7 2000T Utilizing SSI Technology
Virtex-7 FPGA Devices Utilizing Stacked Silicon Interconnect Technology
| Virtex-7 FPGAs | |||
|---|---|---|---|
| Virtex-7 T | 7V1500T | 7V2000T - Now Shipping | |
| Virtex-7 XT | 7VX1140T | ||
| Virtex-7 HT | 7VH290T | 7VH580T | 7VH870T |
Virtex-7 T Family
The world’s first SSI enabled device – the Virtex®-7 2000T – is now shipping. Never before has a single FPGA device delivered the magnitude of programmable resources (logic, memory, serial transceivers and DSP elements) that are available in the Virtex-7 2000T FPGA. With over 6.8 billion transistors enabling 2 million logic cells, the Virtex-7 2000T device is the undisputed largest FPGA in the world.
Virtex-7 XT Family
Xilinx Virtex-7 XT FPGAs offer the highest processing bandwidth with high performance transceivers, DSP and BRAM. The Virtex-7 1140XT device integrates an unprecedented 96 10G Base KR backplane capable serial transceivers, 5.3 TMACs of DSP, 67 Mbits of internal memory and >1M logic cells.
Virtex-7 HT Family
Xilinx Virtex-7 HT FPGAs will be the first product to leverage Stacked Silicon Interconnect technology to integrate non-homogeneous die in a single device. Virtex-7 HT FPGAs will utilize SSI to combine feature-rich 28nm FPGA die with integrated 28Gbps transceivers to deliver the industry’s highest bandwidth platform. These devices offer the largest single-FPGA solution for 100G-400G line cards for next-generation communication systems.