Xilinx Press Release #0223

FOR IMMEDIATE RELEASE

Taichung, Taiwan, February 4th, 2002—Siliconware Precision Industries, Co., Ltd. (SPIL) (TAIEX: 2325, NASDAQ: SPIL) and Xilinx, Inc. (NASDAQ: XLNX) announced today that they have successfully co-developed 300mm wafer bumping technology and delivered prototypes of Xilinx Virtex™ FPGAs. Wafer bumping is the process of depositing a tiny array of solder bumps on the wafer to form the interconnect for flip chip packaging. A fully automated 300mm wafer bumping line has been operational at SPIL since October 2001, and is expected to be in production this quarter, with 6k wafers per month capacity. 

SPIL’s wafer bumping has been applied on 200 millimeter wafers as a turnkey solution together with its flip chip packages. SPIL’s 200 millimeter wafer bumping technology is now in production with yields above 99.5 percent. Leveraging SPIL’s 200mm wafer bumping technology licensed from Flip Chip Technology (now K&S), SPIL is extending that expertise, in conjunction with Xilinx, to 300 millimeter wafers.

“This is just another example of the strength of our partnership with SPIL, where SPIL’s engineering team collaborated with the Package Development Team at Xilinx to deliver the 300 millimeter bumping solution for flip chip packaging in record time,” said Alelie Funcell, Vice President of Supplier Management at Xilinx.

 “SPIL is now a world leader in providing advanced packaging solutions,” said C.Y. Lin, Executive Vice President of SPIL. “Wafer bumping technology will provide the best performance for the next generation of 300 millimeter silicon - and SPIL is proud to lead the development of this technology.”
“The Xilinx Virtex-II platform FPGA family continues a tradition of leadership at Xilinx in delivering the most advanced programmable solution for telecommunication, wireless, networking, video, and DSP applications,” said Vincent Tong, Vice President of Product Technology at Xilinx. “SPIL's state-of-the-art 300 millimeter wafer bumping technology enables us to rapidly bring the Virtex-II family into mass production to meet the fast growing demand. ” 

About Siliconware Precision Industries Ltd.
Siliconware Precision Industries Ltd. (“SPIL”) is a leading provider of comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all of its customers’ integrated circuit packaging and testing requirements, with turnkey solutions that covers from design consultations, modeling and simulations, wafer bumping, wafer probe and sort, package assembly, final test, burn-in, through drop ship. Products include advanced leadframe and substrate packages, which are widely used in personal computers, communications, Internet appliances, cellular phones, digital cameras, cable modems, personal digital assistants and LCD monitors. SPIL supplies services and support to fabless design houses, integrated device manufacturers and wafer foundries globally. For further information, visit SPIL’s web site at http://www.spil.com.tw/.

About Xilinx
Xilinx is the leading supplier of complete programmable logic solutions, including advanced integrated circuits, software design tools, predefined system functions delivered as intellectual property cores, and unparalleled field engineering support. Founded in 1984 and headquartered in San Jose, Calif., Xilinx invented the field programmable gate array (FPGA) and fulfills more than half of the world demand for these devices today. Xilinx solutions enable customers to reduce significantly the time required to develop products for the computer, peripheral, telecommunications, networking, industrial control, instrumentation, aerospace, defense, low-power portable and consumer markets. For more information, visit the Xilinx web site at www.xilinx.com. 

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Editorial Contact:
Ann Duft	Mr. C.Y. Lin
Xilinx, Inc.	SPIL
(408) 879-4726	011-886-3-579-5678
ann.duft@xilinx.com	cylin@spil.com.tw