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Home : Documentation : Xcell Journal Online : Article
High-Speed PCB Design Resources



by Suresh Sivasubramaniam, Senior Design Engineer, Xilinx, Inc.
suresh.subramaniam@xilinx.com

Philippe Garrault, Technical Marketing Engineer, Xilinx, Inc.
philippe.garrault@xilinx.com (3/25/04)

If you’ve read up to this point in the series, you’re probably thirsty for additional information about the tools and methods discussed. Thus, we’ve compiled different sources of information available from the Xilinx website and design and education services. We’ve also included references to partner software development tools, hardware development platforms, and literature from renowned personalities.

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Xilinx Website Resources

Signal Integrity Central
www.xilinx.com/xlnx/xil_prodcat_landingpage.jsp?title=Signal+Integrity This Xilinx portal has everything you need to achieve reliable PCB designs on the first pass. It covers signal integrity fundamentals, power supply and bypassing, simulation tools, PCB design and thermal considerations, and multi-gigabit signaling, with a variety of documents, FAQs, and links.

White Papers and Application Notes
White Paper WP174, “Methodologies for Efficient FPGA Integration into PCBs,” describes how PCB design considerations play a major role in obtaining the expected performance from FPGAs. It then focuses on early analysis and simulation methodologies as a way of performing a guided implementation.

Application Note XAPP623, “Power Distribution System (PDS) Design: Using Bypass/Decoupling Capacitors,” details Virtex™ power supply requirements and techniques for designing power distribution systems using bypass/decoupling capacitors.

Application Note XAPP689, “Managing Ground Bounce in Large FPGAs,” explains the ground bounce effect, with calculations to help you derive an FPGA pinout that meets input undershoot and logic-low voltage requirements for devices receiving signals from an FPGA.

Application Note XAPP609, “Local Clocking Resources in Virtex-II™ Devices,” describes the different local clocking resources available in the Virtex-II architecture. Along with a reference design, this application note explores local clocking resources in source-synchronous applications.

Xilinx and Partner Software Resources
www.support.xilinx.com/support/software_manuals.htm
The ISE software tool suite includes helpful tools like the pin assignment constraints editor (PACE) to help you during the I/O planning and pinout assignment phases. Another helpful tool is Xpower, which allows you to plan and estimate your FPGA power requirements.

AllianceEDA
www.xilinx.com/xlnx/xil_prodcat_landingpage.jsp?title=Alliance+EDA+Program
Visit this website to learn more about the tools mentioned in the Xcell SI series. This page provides information on all third-party tools interfacing with Xilinx software.

Education Courses
www.xilinx.com/support/education-home.htm
Xilinx offers courses about PCB considerations when designing with high-performance FPGAs. The “High-Speed Signal Integrity Design” course, for example, teaches how signal integrity techniques are applicable to highspeed interfaces between Xilinx FPGAs and semiconductor memories.

The course covers high-speed bus and clock design, including transmission line termination, loading, and jitter. For additional details, visit the education services website.

Design Services
www.xilinx.com/xds/
Xilinx provides a comprehensive service offering that includes education services, support services, and design services to accelerate time to knowledge and time to market. To effectively design new multi-gigabit serial systems, it is imperative to understand the complete channel. Xilinx services leverage new techniques, relying on in-house expertise and state-of-the-art tools to create accurate models, evaluation platforms, and production backplanes. Xilinx helps companies to design, simulate, and characterize every aspect of the channel from 1 Gbps to more than 10 Gbps.

RocketIO Multi-Gigabit Serial Transceivers

RocketIO Resources
www.xilinx.com/serialsolution/
The Serial Tsunami Solutions portal provides you with a wealth of information on RocketIO™ transceivers, with access to transceiver data sheets, characterization data, protocols, articles, white papers, and a gateway to the Serial Backplane Simulator tool.

The Serial Backplane Simulator
www.xilinx.com/products/xaw/hsd/simulator.htm
The Serial Backplane Simulator provides signal integrity simulations for more than 300 situations when using Virtex-II Pro™ devices to drive signals across backplanes and line cards. The analyzer covers several different backplane materials, speed, pre-emphasis, lengths, peak-to-peak differential swings, number of connectors, and connector types.

RocketLabs
www.xilinx.com/rocketlabs/
With 15 locations around the world, RocketLabs is the first network of labs to provide system designers with free access to high-speed equipment, multiple hardware evaluation boards, application expertise, signal integrity simulation tools, and presentations and specialized training.

RocketIO Design Kits
www.xilinx.com/support/software/spice/spice-request.htm
From the SPICE suite, you can download RocketIO SPICE models and design kits. The kits have comprehensive documentation and examples that will jumpstart the simulations process and get you to the simulation results analysis phase faster and easier.

Reference Books

  • “Computer Circuits Electrical Design” by Ron K. Poon
  • “Digital Systems Engineering” by William J. Daly and John W. Poulton
  • “High-Frequency Characterization of Electronic Packaging” by Luc Martens
  • “Signal Integrity – Simplified” by Eric Bogatin
  • “High-Speed Digital Design: A Handbook of Black Magic” by Howard Johnson
  • “High Speed Signal Propagation: Advanced Black Magic” by Howard W. Johnson
  • “Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages” by Brian Young
  • “MECL System Design Handbook,” Motorola Semiconductor Products, Inc.
  • “High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices” by Stephen H. Hall, Garrett W. Hall, and James A. McCall

Other Resources

Conclusion
We hope that you enjoyed reading this special SI series and that you feel better informed in dealing with signal and power integrity issues in your current and future high-speed PCB designs.

If you have any comments or feedback about the topics discussed, please e-mail us at si_xcell@xilinx.com.

Printable PDF version of this article with graphics. PDF logo (3/29/04) 170 KB

 
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