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When Xilinx set out to design a high-performance
and dense PROM that
could configure a wide variety of FPGAs
at a low cost, they needed to think “out
of the box” to meet the monetary, device
complexity, and schedule requirements.
They also had several important requirements
for a partner: world-class Flash
Memory technology, system-level and
silicon design expertise, and worldwide
high-volume production.
After evaluating potential partners,
Xilinx chose to collaborate with ST
Microelectronics™ to design a new
series of feature-rich, high-performance
Platform Flash configuration PROMs
(Table 1).
Table 1 – Platform Flash PROM family
| | XCF01S |
XCF02S | XCF04S | XCF08P | XCF16P | XCF32P |
| Density | 1 Mb | 2 Mb | 4 Mb | 8 Mb | 16 Mb | 32 Mb |
| JTAG Prog | • | • | • | • | • | • |
| Serial Config |
• |
• |
• | • | • |
• |
| SelectMap Config | | |
|
• | • |
• |
| Compression | | |
|
• | • |
• |
| VCC (V) | 3.3 | 3.3 | 3.3 | 1.8 | 1.8 | 1.8 |
| VCCO (V) | 1.8 - 3.3 | 1.8 - 3.3 | 1.8 - 3.3 | 1.5 - 3.3 | 1.5 - 3.3 | 1.5 - 3.3 |
| Clock (MHz) | 33 | 33 | 33 | 40 | 40 | 40 |
| Package | VO20 | VO20 | VO20 | FS48, VO48 | FS48, VO48 | FS48, VO48 |
The Benefits of Partnership
The advantages of designing a complex
device with a knowledgeable partner
include:
- Reducing schedule timeframes and
risk. Platform Flash PROMs use ST
Microelectronics’ state-of-the-art 0.15
micron flash technology. They were
developed by a seasoned team of system-on-chip system and IC designers.
- Taking advantage of the core competencies
and experience of each partner.
Xilinx brought more than 20 years of
FPGA configuration management
expertise to the challenge of designing
the Platform Flash configuration PROM.
The new device includes multiple modes
of configuration (serial, JTAG, and parallel)
as well as the ability to easily manage
multiple bitstreams and unique features
like bitstream compression.
- Designing and producing the right
product for the market. With its
extensive worldwide FAE force and
design centers, Xilinx worked closely
with FPGA users to define a PROM
that meets the needs of sophisticated
system designers.
Platform Flash PROMs are cost-competitive
products that have both the
required baseline features as well as new
capabilities to make FPGA systems
more attractive and flexible.
- Taking advantage of sophisticated flexible
worldwide manufacturing expertise.
ST Microelectronics has the manufacturing
capacity to produce PROMs in high
volumes, along with extensive experience
in very small form factor packages.
The Platform Flash PROM offers
designers the smallest package board space
area per megabit in the industry, such as
the VO20 TSSOP (6.4 mm x 6.5 mm) for
1, 2, and 4 Mb density PROMs. Because
board space (horizontal as well as vertical
spacing) is always at a premium, larger
Platform Flash devices with 8, 16, and 32
Mb densities come in small (8 mm x 9
mm) thin flat ball grid array packages.
During the product definition process
for Platform Flash PROMs, several multiple
chip packaging and stacked die
approaches were carefully examined. None
appeared to be competitive because the
goal was to produce a configuration
PROM with the highest reliability, lowest
cost, and minimum board space. The result
is among the world’s most flexible, cost-effective
configuration PROMs.
Compression
Higher density Platform Flash PROMs
(Figure 1) employ an advanced bitstream
compression technology from Xilinx.
Compression allows you to store more
information in the same memory space,
thus reducing cost and board space.
Bitstream file(s) are compressed using
Xilinx’s ISE design software. The compressed
file(s) are then programmed into
the Platform Flash PROM, just like any
other bitstream file.
The Platform Flash PROM has a built-in
decompressor that automatically senses
when a compressed file is stored, and
decompresses compressed bitstream information
on the fly.
Typically, you can get 50% more bits
using this advanced compression technology,
fitting, for example, a 48 Mb FPGA design
(such as a Virtex-II™ 2VP100 design) into
a 32 Mb Platform Flash PROM.
Upgrade Management
You can accomplish in-system programming
and upgrades via the JTAG port
using the industry-standard four-wire Test
Access Port interface (IEEE 1149.1).
Platform Flash PROMs are IEEE 1532-compliant, adding to the flexibility and
total system integration that allows them to
be used with other Xilinx IEEE 1532-compliant
devices such as CoolRunner™-II
CPLDs and Virtex-II Pro™ FPGAs.
The Platform Flash PROM architecture
integrates unique controls that give it
the ability to store multiple bitstreams (Figure 2). A microprocessor or other configuration
engine can then activate a bitstream
at any time, allowing system
administrators to access previous versions
of system configuration in the event that a
problem with a newly transmitted configuration
arises.
Safe updates can be achieved with the
ability to store multiple bitstreams.
Updated bitstreams can be programmed
into the free memory blocks of the
Platform Flash PROM without losing the
original bitstream.
Conclusion
Developed jointly with ST Microelectronics,
the Platform Flash family of configuration
PROMs offers users the ultimate in low-cost,
feature-rich system options, including
compression and bitstream upgrade
management.
For more information about the
new Platform Flash PROMs, visit www.xilinx.com/xlnx/xil_prodcat_product.jsp?title=PFP.
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