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RapidIO PowerPC Buffer

 

Xilinx is now shipping the world's first PowerPC processor with a tightly integrated RapidIO interface. The solution includes RapidIO 8-bit LVDS Physical Layer core and is fully compliant to the RapidIO Interconnect Specification v1.2 & Errata 1, and a reference design to hook up the endpoint to the PowerPC's CoreConnect™ PLB. The Xilinx RapidIO to PLB reference design and accompanying RapidIO to PLB application note is available as part of the Xilinx RapidIO 8-bit LVDS Physical Layer core and is accessible through the RapidIO PHY Layer Core Overview page

Key Benefits of the solution are:

  • Instant Deployment of RapidIO: System architects can now build their intelligent host controllers and peripherals based on the RapidIO interconnect
  • Optimum Performance: In a typical system, the processor spends most time waiting for data to come back from the interconnect. The tight integration between the PowerPC and the RapidIO interface allows balanced I/O and processor performance thereby improving throughput
  • Flexibility and System Integration: System architects can now build complete systems based on Virtex-II and Virtex-II Pro, the Platform for Programmable systems. For example, they can now integrate several components such as PCI chipsets, Gigabit Ethernet MAC/PHY chips, memory controllers for multiple applications such as high performance DSP, control plane processing and distributed computing
 
IBM PowerPC 405
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RapidIO Logical I/O & Transport Product
RapidIO & DSP Solution
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IP Evaluation
RapidIO Trade Association
Wireless Networking
ATCA Development Platform
Serial RapidIO PHY Datasheet
RapidIO LVDS PHY Datasheet
RapidIO Logical I/O & Transport Datasheet
RapidIO PowerPC Processor Buffer Datasheet
Xilinx ships Serial RapidIO Solution
Xilinx ships first PowerPC with RapidIO press release
Xilinx ships first DSP solution with RapidIO press release
Xilinx ships first PHY layer RapidIO core press release
Xilinx ships first RapidIO endpoint core press released
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