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AR# 12911

Packaging - Are the heatsinks on the Ball Grid Array (BGA) packages floating or grounded?


General Description:

Are the heatsinks on the Ball Grid Array (BG, FG) packages floating or grounded?


The heatsink on any Xilinx Metal BGA is considered "grounded" when the part is fully assembled. This may be labeled on the drawing (as in the case of the BG560), or the polarity information might not be on the drawing.

Unless specifically stated to be floating, the heatsinks in these packages are considered to be grounded.

AR# 12911
Date Created 08/29/2007
Last Updated 12/15/2012
Status Active
Type General Article