Packaging Solution Center
Description
The Packaging Solution Center is available to address all questions related to Packaging. Whether you are starting with part selection, working on layout and design considerations, or even in the assembly process, use the Packaging Solution Center to guide you to the right information.
Solution
Packaging Design Assistant
To learn more about designing with Packaging, or to find help on debugging an issue you are currently encountering, see (Xilinx Answer 40688).
The Packaging Design Assistant walks you through the recommended design flow for Packaging while debugging commonly encountered issues such as simulation issues, calibration failures, and data errors. The Design Assistant not only provides useful design and troubleshoot information, but also points you to the exact documentation you need to read to help you design efficiently.
Packaging Documentation
To find all documentation related to Packaging including User Guides, Data Sheets, Applications Notes, and White Papers, see (Xilinx Answer 40692).
Packaging Design Advisory
Packaging information is contained in the following device-specific Design Advisories.
Design Advisory Answer Records are created for issues that are important to designs currently in progress. The Design Advisory can be selected to be included in the Xilinx Alert Notification:
(Xilinx Answer 34565) - Design Advisory for the Virtex-6 FPGA Master Answer Record
(Xilinx Answer 34856) - Design Advisory for the Spartan-6 FPGA Master Answer Record
To update your Xilinx Alert Notification Preferences, please go to:
http://www.xilinx.com/support/myalerts