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AR# 53177

14.3 - XPS I/O Module - XPS I/O Module is not addressable when exported to SDK

Description

In XPS projects using the LMB I/O Module IP from the IP Catalog, the I/O Module is not addressable as shown below:

unaddressed_ip.jpg
unaddressed_ip.jpg




When exported to SDK this is preventing the I/O Module being addressable, thus not showing up.

How can I fix this?

Solution

This issue is only seen in the XPS version of the I/O Module, the I/O Module used with the MicroBlaze MCS (Micro Control System) does not show this addressing issue.

Follow the steps below to workaround this issue in XPS:

Step 1: Make the IP local.

In System Assembly view, under the Bus Interfaces tab, right-click on the I/O Module IP:

make_io_module_local.jpg
make_io_module_local.jpg

Step 2:Open theMPD file.

In System Assembly View, under the Bus Interfaces tab, right-click and select View MPD:
view_mpd_file_iomodule.jpg
view_mpd_file_iomodule.jpg

Step 3: Modify the MPD file.
Modify lines 85 and 86, as highlighted below and save:
mod_mpd_iomodule.jpg
mod_mpd_iomodule.jpg

Step 4: Rescan the User Repositories.

To rescan the User Repositories, go to Project -> Rescan User Repositories:

rescan_user_repos_14_3.jpg
rescan_user_repos_14_3.jpg

Step 4: Verify the I/O Module is mapped correctly.

In System Assembly View, under theAddresses tab right-click andverify that the addresses are all mapped:
updated_addresses_iomodule.jpg
updated_addresses_iomodule.jpg

Now, re-export to SDK and the I/O Module should show up in the SDK.
AR# 53177
Date Created 11/30/2012
Last Updated 11/30/2012
Status Active
Type General Article
Tools
  • EDK - 14.1
  • EDK - 14.2
  • EDK - 14.3