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AR# 6612

Packaging - Does Xilinx utilize the TAB (tape automated bonding) process?


General Description: 

Does Xilinx utilize the TAB (tape automated bonding) process?


First, what exactly is "TAB"? 


It is a process in which silicon chips are joined to patterned metal traces (leads) on polymer tape to form inner lead bonds; subsequently, the leads are attached to the next level of the assembly -- typically a substrate or board -- to form outer lead bonds. TAB is the technique of interconnecting silicon with beam bonding (as opposed to wire bonding). 


Xilinx does not use a TAB process; we use wire bonding for all of our packages except Flip-Chip (FF and BF). For Flip-Chip, flip-chip bumping is used.


AR# 6612
Date Created 08/21/2007
Last Updated 05/14/2014
Status Archive
Type General Article