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AR# 7830

Packaging - Does Xilinx support rework/reballing of BGA packages?


If a BGA package is removed from a board, can the package be reballed and remounted to the PCB?


Xilinx does not recommend any rework/reballing for BGAs. Once the part is removed from the board, Xilinx does not guarantee reliability of the part if it is remounted on the PCB.
A maximum of three reflow cycles (including initial assembly, rework and reballing) are allowed.
AR# 7830
Date Created 08/21/2007
Last Updated 07/30/2014
Status Active
Type General Article
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