Customer Notices

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Customer Notices

NameDoc VersionSizeDate
PDFXCN09018 - Product Discontinuation Notice AccelDSP Synthesis Tool (PDF)

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1.0.1 50 KB 07/31/2009
PDFXCN09015 - ISE Design Suite and LogiCORE IP Product Discontinuation Notice (PDF)

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2.0 249 KB 05/04/2009
PDFXCN09023 - Product Discontinuation Notice For Development Systems Products (PDF)

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1.0 59 KB 09/21/2009
PDFXCN07026 - Transition to Step 1 and New Package Substrate for Select Virtex-5 LXT and SXT FPGA Devices (PDF)

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Design Files: FAQ for XCN07026
Qualification Report
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1.0.3 67 KB 07/29/2009
PDFXCN09021 - Product Discontinuation Notice: Aerospace & Defense Customers (PDF)

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1.0 34 KB 08/17/2009
PDFXCN09027 - XA Spartan-3E Automotive FPGA Data Sheet Change (PDF)

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1.0 48 KB 11/09/2009
PDFXCN08009 - Fab Location Change for Platform Flash and XC18V00 PROMs Flash Memory Devices (PDF)

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1.1 68 KB 10/05/2009
PDFXCN09013 - Flip Chip Substrates BT-to-ABF Conversion for Select Virtex-II Pro FPGA and Virtex-4 FPGA Devices (PDF)

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1.0 42 KB 10/05/2009
PDFXCN09031 - Flip Chip Substrates BT to ABF Conversion for Selected Aerospace & Defense ‘XQ’ Virtex-4 FPGA Devices (PDF)

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1.0 42 KB 10/26/2009
PDFXCN09028 - Product Discontinuation Notice Virtex-4 LX25 FPGA FF(G)676 Devices (PDF)

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1.0 32 KB 10/19/2009
PDFXCN09029 - Platform Flash PROM Data Sheet (DS123) and User Guide (UG161) Revisions (PDF)

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1.0 50 KB 10/26/2009
PDFXCN09019 - Aerospace & Defense Test Site Transfer for all XQ I-grade and M-grade Devices (PDF)

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1.0 33 KB 10/19/2009
PDFXCN09002 - Product Discontinuation Notice (PDF)

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1.0 127 KB 11/23/2009
PDFXCN09001 - Product Discontinuation Notice (PDF)

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1.3 67 KB 11/23/2009
PDFXCN09030 - Product Discontinuation Notice: VO48 Pin Package in Platform Flash PROM Devices (PDF)

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1.0 38 KB 11/16/2009
PDFXCN05009 - Addition of UMC 300 mm Wafer Fabrication for Spartan-3 Family (PDF)

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Design Files: Qualification Report for XCN05009
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1.0.2 41 KB 10/08/2009
PDFXCN08022 - Product Discontinuation Notice For Development Systems Products (PDF)

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2.0 58 KB 01/12/2009
PDFXCN07016 - CPLD Part Number Changes: XC to XA for Automotive Customers (PDF)

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1.0.1 55 KB 10/06/2009
PDFXCN08011 - Product Discontinuation Notice (PDF)

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1.1.1 116 KB 06/01/2009
PDFXilinx PDN2003-02 - Discontinue HardWire Products (PDF)
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01 45 KB 02/01/2003
PDFPDN2003-01 - XC3020A, XC3042A, XC3090A Military Temperature Grade (PDF)
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1.0 20 KB 01/17/2003
PDFSupplemental List for PDN2002-03 (PDF)
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1.0 611 KB 04/01/2002
PDFPDN2002-03 - Discontinue certain members of the XC4000, XC4000E, and XC4000L families (PDF)
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1.1 76 KB 04/01/2002
PDFPDN2002-02 - Discontinuation of the XC4000XLT family (PDF)
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1.0 24 KB 01/15/2002
PDFPDN2002-01 - Discontinuation of the XC4000EX and XC4000XV families (PDF)

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1.0 32 KB 01/15/2002
PDFPDN2001-03 - Withdrawal of certain commercial low volume device-speed combinations (XC4000XL) (PDF)
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1.0 20 KB 01/15/2001
PDFPDN2001-02 - Withdrawal of certain commercial low volume device-package combinations (XC4000XL/XV) (PDF)
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1.0 136 KB 01/15/2001
PDFPDN2000-07: Products Affected (PDF)
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1.0 110 KB 10/19/2000
PDFPDN2000-07 - Discontinuation of certain XPLA CPLD Families (PDF)
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1.0 159 KB 10/19/2000
PDFPDN2000-05 - Discontinuation of Certain HardWire 1 Products (PDF)
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1.0 18 KB 09/28/2000
PDFPDN00001 - Low volume commercial device/package combinations (PDF)
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1.0 28 KB 01/15/2000
PDFPDN99003 Data - XC4000 Devices which are NOT affected by PDN99003 (PDF)
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1.0 29 KB 04/19/1999
PDFPDN99001 - Discontinue certain speed grades of the XC3000 & XC4000 SMD & M-Grade (PDF)
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1.0 49 KB 01/15/1999
PDFPDN98006 - Discontinuation of the XC4003A M-grade and B-grade (SMD) Products (PDF)
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1.0 18 KB 06/26/1998
PDFPDN98005 - Discontinuation of the XC3100A M-grade and B-grade (SMD) Products (PDF)
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1.0 18 KB 06/26/1998
PDFPDN98004 - Discontinuation of the XC1718 Product (PDF)
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1.0 18 KB 06/26/1998
PDFPDN98001 - Discontinuation of the MQFP package option in some XC4000 products (PDF)
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1.0 21 KB 06/15/1998
PDFPDN97006 - Withdrawal of certain specific low volume device/package combinations (correction) (PDF)
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1.0 23 KB 02/10/1998
PDFPDN97005 - Withdrawal of certain specific low volume device/package combinations (PDF)
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1.0 18 KB 01/30/1997
PDFPDN97004 - Withdrawal of Commercial and Industrial XC3100A-5 Speed Grades, all packages (PDF)
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1.0 18 KB 01/30/1997
PDFPDN97003 - Withdrawal of Commercial and Industrial XC3000-70 Speed Grades, all packages (PDF)
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1.0 19 KB 01/30/1997
PDFPDN2004-22 - Discontinue Low-Volume Members of the XC5200 Product Family (PDF)

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1.1 46 KB 08/27/2004
PDFPDN2004-21 - Discontinue Low-Volume Members of the XC4000XL, XC4000XLA, and XC4000E Product Families (PDF)
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1.1 245 KB 11/15/2004
PDFPDN2004-20 - Discontinue Low-Volume Members of the XC3100A Product Family (PDF)

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1.0 62 KB 08/23/2004
PDFPDN2004-19 - Discontinue Low-Volume Members of the XC3000A Product Family (PDF)

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1.0 40 KB 08/23/2004
PDFPDN2004-01: Low-Volume Members of the Spartan Product Families are Discontinued (PDF)

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1.0 46 KB 03/05/2004
PDFProduct Discontinuation Notice PDN2003-09 (PDF)

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1.0 65 KB 11/10/2003
PDFPDN2003-08 - Discontinue XCV2600E and XCV3200E (PDF)

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1.0 26 KB 07/31/2003
PDFPDN2003-05 - Discontinue XC18V256 and I-Grade Ordering Codes for the XC18V00 Product Family (PDF)
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1.3 58 KB 09/01/2004
PDFXilinx PDN2003-03 to discontinue XC3000 and XC3000L products (C-Grade & I-Grade) (PDF)
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1.2 53 KB 02/12/2003
PDFPCN99008 - A change to the Icc Standby Specification of XC1702L and XC1704L products (PDF)
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1.0 19 KB 10/01/1999
PDFPCN99002 - Qualification Data for PCN99002 (wafer fabrication process change for XC4000XL) (PDF)
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1.0 50 KB 05/24/1999
PDFPCN99002: A change in the wafer fabrication process used to fabricate the XC4000XL (C & I Grade) (PDF)
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1.0 25 KB 05/24/1999
PDFPCN98008 - Discontinue XC3000/XC3000A product manufactured at Yamaha (PDF)
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1.0 20 KB 08/30/1998
PDFPCN98007 - A change in the mold compound and die attach epoxy for Xilinx PLCC and QFP packages (PDF)
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1.0 20 KB 08/10/1998
PDFPCN98007 Data - Package Qualification Testing Data for Mold Compound MP8000 (PDF)
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1.0 18 KB 08/10/1998
PDFPCN98003 - The Xilinx XC9500 Product Family will be manufactured in the 0.5uM Flash Process at UMC (PDF)
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1.0 24 KB 07/24/1998
PDFPCN98003 Data - Qualification Test Data (PDF)
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1.0 34 KB 06/24/1998
PDFPCN98002A - Qualification of SPIL of Taiwan as an alternate Assembly Subcontractor (PDF)
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1.0 24 KB 06/30/1998
PDFPCN98002 - Qualification of SPIL of Taiwan as an alternate Assembly Subcontractor (PDF)
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1.0 24 KB 05/18/1998
PDFPCN98002 Data - Qualification Test Data for PCN98002 (SPIL Assembly) (PDF)
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1.0 24 KB 05/18/1998
PDFPCN97009A - A reissue of a minor enhancement to the Xilinx line of thermally enhanced quad flatpack (PDF)
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1.0 19 KB 10/29/1997
PDFPCN97009A Data(2) - Reliability Testing of the HQ240 Package (Insulated Heatsink) (PDF)
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1.0 13 KB 10/29/1997
PDFPCN97009A Data - Thermal Data for Thermally Enhanced Plastic Quad Flat Pack (PQFP) (PDF)
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1.0 13 KB 10/29/1997
PDFPCN97007 - Conversion of Xilinx MIL-STD-883 Military Products to QML (PDF)
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1.0 25 KB 04/15/1997
PDFPCN97007 Data - Cross Reference Listing (PDF)
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1.0 31 KB 04/15/1997
PDFPCN97002 - Additional Product Assembly Qualification of A.S.E. Taiwan (PDF)
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1.0 24 KB 02/15/1997
PDFPCN97002 Data - Qualification of ASE for BGA Packages (PDF)
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1.0 12 KB 02/15/1997
PDFPCN97001 - Qualification of ASTRA Microtronics Technology in Batam, Indonesia (PDF)
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1.0 24 KB 02/28/1997
PDFPCN97001 Data - Qualification Test Data (PDF)
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1.0 10 KB 02/28/1997
PDFPCN96011 - An evolutionary change in the Xilinx XC5200 fabrication process (PDF)
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1.0 23 KB 12/20/1996
PDFPCN96011 Data - Qualification Data (PDF)
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1.0 21 KB 12/20/1996
PDFPCN96009 - Discontinuation of the XC4000A and XC4000H Product Families (PDF)
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1.0 21 KB 10/01/1996
PDFPCN96008 - An evolutionary change in the Xilinx XC4000/D fabrication process (PDF)
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1.0 21 KB 10/01/1996
PDFPCN96005 - Qualification of A.S.E. Taiwan as a New Assembly Subcontractor (PDF)
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1.0 19 KB 06/28/1996
PDFPCN96004 - A New Wafer Foundry Partner United Microelectronics Corporation (UMC) (PDF)
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1.0 19 KB 05/15/1996
PDFPCN96003 - Obsolescence of Commercial and Military CQFP-100 ceramic packages (PDF)
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1.0 19 KB 05/03/1996
PDFPCN96001 - A change in the Xilinx XC3100 fabrication process (PDF)
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1.0 21 KB 04/19/1996
PDFPCN95013 - A minor change in the part marking methodology utilized for Xilinx Products (PDF)
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1.0 24 KB 12/26/1995
PDFPCN95010B - An update to PCN95010A (PDF)
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1.0 26 KB 07/01/1995
PDFPCN95010A - An update to PCN95010 (PDF)
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1.0 27 KB 06/28/1995
PDFPCN95010 - A New Manufacturer for the Xilinx Serial Configuration PROMs (PDF)
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1.0 25 KB 12/18/1995
PDFPCN95009 - Qualification of the Advanced Semiconductor Engineering, (PDF)
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1.0 17 KB 12/11/1995
PDFPCN95008 - Qualification of AAPI-1 Assembly Facility (PDF)
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1.0 17 KB 12/11/1995
PDFPCN95007 - Qualification of Integrated Packaging Assembly Corporation (PDF)
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1.0 17 KB 12/11/1995
PDFPCN95006 - A minor change to the electrical specifications of some Xilinx Ceramic Packaged Devices (PDF)
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1.0 14 KB 08/22/1995
PDFPCN95004 - Qualification of ASTRA Microtronics Technology as a new assembly subcontractor (PDF)
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1.0 17 KB 06/30/1995
PDFPCN95003 - Withdrawal of the XC1765DDD8R (Obsolete Device) (PDF)
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1.0 16 KB 04/17/1995
PDFPCN95002B - An evolutionary change in the Xilinx wafer fabrication process (PDF)
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1.0 18 KB 06/18/1995
PDFPCN95002A - An evolutionary change in the Xilinx wafer fabrication process (PDF)
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1.0 17 KB 08/11/1995
PDFXCN07002 - Discontinuation of Certain Military and Radiation-Tolerant Devices (PDF)

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1.0 41 KB 02/19/2007
PDFXCN06021 - Change in Test Facility for XQVR300 and XQVR600 QPro V Grade FPGAs (PDF)

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1.0 35 KB 10/23/2006
PDFPDN97008A - Discontinuation of the XC7000 Product Families (PDF)
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1.0 18 KB 04/15/1998
PDFPDN2002-09 - Discontinue M-Grade QPro XQ18V04 (PDF)
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2.0 45 KB 10/20/2008
PDFPCN96007 - Discontinuation of the XC8100 Antifuse Product Line (PDF)
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1.0 19 KB 04/09/1996
PDFPCN96002A - Product Availability Extension of XC7300 CPLD family at the tsmc Manufacturing Facility (PDF)
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1.0 23 KB 07/03/1996
PDFPCN95005 - An evolutionary change in the Xilinx XC7000 fabrication process (PDF)
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1.0 20 KB 08/10/1995
PDFXCN05019 - Mold Compound and Die Attach Epoxy Material Conversion For Military Products (PDF)

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1.0 157 KB 10/24/2005
PDFPDN97008 - Discontinuation of the XC7000 Product Families (PDF)
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1.0 23 KB 08/01/1997
PDFPCN96010 - Discontinuation of the XC2000 Product Families (PDF)
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1.0 18 KB 12/20/1996
PDFPCN96006 - XC73144 PQ160: Cin parameter change (PDF)
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1.0 23 KB 07/16/1996
PDFPCN96002 - Qualification of Seiko Epson as a Manufacturing Facility for the XC7300 (PDF)
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1.0 36 KB 04/02/1996
PDFXCN07021 - Data Sheet Pin-to-Pin Specification Change for the Virtex-5 Family (PDF)

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1.0 45 KB 12/24/2007
PDFXCN08003 - Product Discontinuation Notice (PDF)

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1.1 79 KB 06/19/2008
PDFXCN07020 - Addition of New Shipping Trays for VO48/VOG48 Packages (PDF)

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1.0.2 97 KB 05/23/2008
PDFXCN08015 - Power Supply Adapter Replacement on Certain Development Boards (PDF)

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1.0.1 208 KB 05/23/2008
PDFXCN09005 - Xilinx Product Discontinuation Notice for Development Systems Products (PDF)

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1.0 73 KB 02/23/2009
PDFXCN07025 - Package Substrate Change for Select Virtex-5 LX Devices (PDF)

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Design Files: FAQ for XCN07025
Qualification Report
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1.0.2 36 KB 06/15/2009
PDFXCN09016 - Product Discontinuation Notice For Development Systems Products (PDF)

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1.1 37 KB 06/15/2009
PDFXCN09017 - Product Discontinuation Notice for Development Systems Products (PDF)

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1.0 66 KB 06/22/2009
PDFPDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families (PDF)
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1.0 24 KB 07/01/1999
PDFXC4000 devices available after PDN99003 (PDF)
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1.0 37 KB 04/19/1999
PDFPDN99003 - Discontinue certain members of the XC4000 commercial & industrial product line (PDF)
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1.0 44 KB 04/19/1999
PDFPCN2000-06 - Minor Modification in Thermally Enhanced BG and FG Package Outline Specifications (PDF)
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1.0.1 41 KB 03/13/2007
PDFPCN1996-08 Data - Device Qualification Data (PDF)
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1.0 21 KB 10/01/1996
PDFPCN00003 - A Change in the die-attach material for all thermally enhanced BGA packages (PDF)
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1.0 20 KB 08/03/2000
PDFPCN00002a - A change in the assembly and test flows used to manufacture the Xilinx CoolRunner (PDF)
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1.0 35 KB 03/20/2000
PDFPCN00002A Data - Cross Reference List for PCN00002A (PDF)
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1.0 38 KB 03/28/2001
PDFPCN00002 - A change in the assembly and test flows used to manufacture the Xilinx CoolRunner (PDF)
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1.0 38 KB 01/30/2000
PDFPCN00002 Data - Cross Reference List for PCN00002 (PDF)
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1.0 38 KB 03/28/2001
PDFAdvisory 2003-10 - Flip-Chip Package Substrate Solder Issue (PDF)

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1.3 78 KB 01/19/2004
PDFCustomer Advisory: Intermittent Synch Word - XC18V00 (PDF)

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1.1 106 KB 03/11/2004
PDFCustomer Advisory 2003-07 Intermittent Synch Word - XCF01S, XCF02S, XCF04S (PDF)

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1.0 35 KB 12/16/2003
PDFAdvisory 2003-02 - Change in BGA Shipping Trays (PDF)

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1.0 43 KB 08/19/2003
PDFAdvisory 2003-01A - An update to Advisory 2003-01 (PDF)

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1.0 69 KB 11/10/2003
PDFAdvisory 2003-01 - Clarification of wafer foundry transition dates for the Virtex product family (PDF)
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1.1 37 KB 11/10/2003
PDFAdvisory2002-02 - Changes to PDN Policy (PDF)
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1.0 19 KB 03/08/2002
PDFAdvisory2001-04 - New Parallel Cable IV (PDF)
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1.0 18 KB 11/14/2001
PDFAdvisory2001-02 - CoolRunner CPLD Fitter Software Update Needed for the XCR3064XL-PC44 (PDF)
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1.0 20 KB 06/29/2001
PDFAdvisory2001-01 - JTAG Programmer Software Update Needed for XC9572XV and XC95288XV (PDF)
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1.0 19 KB 06/29/2001
PDFACN99001 - A change in the programming algorithm for XC9500XL Family (PDF)
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1.0 31 KB 08/23/1999
PDFACN2003-01 - A change in the programming algorithm for the C-grade members of the XC18V00 Family (PDF)
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1.1 80 KB 10/09/2003
PDFPCN95002 - An evolutionary change in the Xilinx XC4000 fabrication process (PDF)
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1.0 18 KB 04/06/1995
PDFPCN95001 - Addition of a new process for the Xilinx XC1718D, XC1736D, and XC1765D PROMs (PDF)
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1.0 20 KB 03/31/1995
PDFPCN2004-28 - Humidity Indicator Card (HIC) Change (PDF)

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1.0 161 KB 12/06/2004
PDFXilinx PCN2004-25 - Circuit Revision Change to the XC9500XL family of CPLD devices (PDF)

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1.1 85 KB 01/24/2005
PDFPCN2004-24 - Circuit Revision Change to the CoolRunner-II Family of CPLD Devices (PDF)

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1.2 44 KB 08/19/2005
PDFXilinx PCN2004-23: Circuit revision change to the XPLA3 family of CPLD devices (PDF)

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2.0 50 KB 11/08/2004
PDFPCN2004-18 - Design Enhancement for the Platform Flash Family of PROMs Manufactured at STMicro (PDF)
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1.1 129 KB 10/25/2004
PDFPCN2004-17 - Design Enhancement for the XC18V00 PROMs Manufactured at STMicroelectronics (PDF)
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1.1 182 KB 10/25/2004
PDFPCN2004-12 - Clarification on Handling Unconnected VCCINT Pins for Virtex Devices (PDF)

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1.0 44 KB 08/09/2004
PDFPCN2004-11 - Conversion of Spartan-IIE -7C and -6I Devices to Dual Marked -7C/-6I Devices (PDF)

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1.1 62 KB 08/31/2004
PDFPCN2004-05 - New Material Set and Part Marking for Chip Scale BGA Packages (PDF)
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1.1 72 KB 12/06/2004
PDFPCN2004-03 - Change to the Maximum CCLK Frequency for Virtex-II SelectMAP mode (PDF)

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1.2 31 KB 10/25/2004
PDFPCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material) (PDF)
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1.1 72 KB 12/06/2004
PDFPCN2003-10 - CoolRunner XCR3128XL CPLD Fab Change (PDF)

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1.0 116 KB 11/26/2003
PDFPCN2003-04A - Update to PCN2003-04 - Extend SCD0799 Availability (PDF)

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1.0 32 KB 02/12/2004
PDFPCN2003-04 - Additional Manufacturer for the XC18V00 Family of ISP Configuration PROMs (PDF)

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1.3 257 KB 02/12/2004
PDFXCN06019 - Enhancement of the Standard Platform Cable USB to Pb-Free (PDF)

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1.0 163 KB 08/21/2006
PDFXCN06018 - Bond Lift on Wirebonded Plastic Ball Grid Array (PBGA) Packages (PDF)

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1.0 87 KB 06/26/2006
PDFXCN06016 - New Assembly Partner: STATS ChipPAC Singapore (SCS) (PDF)

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Design Files: Qualification Report for XCN06016
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1.1 115 KB 12/25/2006
PDFXCN06015 - Readback Issue on Spartan-3E Devices (PDF)

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2.0 54 KB 10/23/2006
PDFXCN06013 - Addition of Kostat Shipping Tray for CS144/CSG144 and CS280/CSG280 Laminate BGA Packages (PDF)

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1.1 76 KB 05/17/2006
PDFXCN06012 - Additional Source for Thermal Adhesive in Flip-Chip Packages for Virtex-II/-II Pro/-4 (PDF)

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1.0 192 KB 05/01/2006
PDFXCN06006 - Discontinuation of Non Pb-Free System ACE Controller (XCCACE-TQ144I) (PDF)

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1.0 221 KB 02/27/2006
PDFXCN06005 - CoolRunner-II CPLD OTF SVF Programming Issue (PDF)

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1.0 38 KB 01/30/2006
PDFXCN06004 - Mask Set Modification for the XCF08P and XCF16P (PDF)

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Design Files: Qualification Report for XCN06004
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1.0 103 KB 03/20/2006
PDFXCN06003 - Spartan-IIE and Spartan-3 FTG256 Pb-Free Moisture Sensitivity Level Change (PDF)

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1.0 57 KB 01/30/2006
PDFXCN06002 - Discontinuation of Certain Military and Radiation-Tolerant Devices (PDF)

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1.0 52 KB 01/30/2006
PDFXCN06001 - Re-classification of VOG8 Moisture Sensitivity Level (PDF)

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1.1 53 KB 03/02/2006
PDFXCN05025 - Xilinx Stepping Methodology (PDF)

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1.1 71 KB 12/09/2005
PDFXCN05020 - Discontinue Low-Volume Members of the XC4000XL, XC4000E, XC9500XV, and XC3100A Families (PDF)

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1.1 143 KB 03/10/2006
PDFPCN2002-11 - CoolRunner XCR3256XL - Change in wafer fabrication facility (PDF)
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1.0 79 KB 11/08/2002
PDFPCN2002-10 - XC9500XL 3.3V CPLD - Device Transition (PDF)
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1.1 62 KB 09/12/2002
PDFPCN2002-08 - Change in shipping trays for CB packages (PDF)
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1.0 39 KB 06/11/2002
PDFPCN2002-07 - Virtex-E wafer fabrication update (PDF)
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1.1 368 KB 05/15/2002
PDFPCN2002-06 - Virtex-II Wafer Fabrication Update (PDF)

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1.1 130 KB 07/15/2005
PDFPCN2002-05 - Spartan-IIE wafer fabrication update (PDF)
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1.2 308 KB 05/15/2002
PDFPCN2002-04 - CoolRunner XCR3064XL change in wafer fabrication facility (PDF)
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1.2 246 KB 04/01/2002
PDFPCN2001-08 - Spartan-II Change in Fab Process Technology (PDF)
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1.0 53 KB 10/01/2001
PDFPCN2001-06 Data - Qualification Data (PDF)
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1.0 14 KB 03/16/2001
PDFPCN2001-06 - Additional equivalent wafer foundries for fabrication of Virtex-E commercial Family (PDF)
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1.0 19 KB 03/16/2001
PDFPCN2001-05 - Functionality of the distributed (LUT-based) SelectRAM when configured in a 32x1 mode (PDF)
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1.0 19 KB 01/31/2001
PDFPCN2000-08 Data - Qualification Data (PDF)
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1.0 11 KB 12/29/2000
PDFPCN2000-08 - Additional equivalent wafer foundries for Virtex (PDF)

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1.2 33 KB 11/25/2003
PDFXCN05018 - Package Substrate Change for Chip Scale (Tape) and Lead-Free Chip Scale (Tape) (PDF)

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Design Files: Qualification Report for XCN05018
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1.0.1 130 KB 12/21/2007
PDFXCN05017 - Discontinuation of the XC2C32 and XC2C64 CPLDs (PDF)

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1.1 72 KB 04/24/2006
PDFXCN05016 - XC4VLX60 FF1148 Package Construction Change (PDF)

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1.0 50 KB 10/03/2005
PDFXCN05015 - Change in Wafer Fabrication Facility for XC95288XL and XC9536XL CPLDs (PDF)

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1.0 84 KB 10/03/2005
PDFXCN05012 - Package Change for the Virtex-II Pro Devices (PDF)

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Design Files: Qualification Report for XCN05012
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1.0 46 KB 08/01/2005
PDFXCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion (PDF)

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Design Files: Qualification Report for XCN05011
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2.0 60 KB 08/07/2006
PDFXCN05010 - Discontinue MultiLINX Cable (PDF)

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1.1 41 KB 05/03/2005
PDFXCN05005 - Toshiba, A New Foundry (PDF)

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1.1 45 KB 03/09/2006
PDFXCN05003 - Change in Wafer Fabrication Facility for XC95144XL and XC9572XL CPLDs (PDF)

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1.0 95 KB 01/31/2005
PDFXCN05001 - Bitstream Update Required for Specific Production Spartan-3 FPGAs (PDF)

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1.0 65 KB 01/17/2005
PDFPDN99007A - Withdrawal of certain commercial low-volume device/package combinations (PDF)
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1.0 38 KB 01/30/2000
PDFPDN99007 - Withdrawal of certain commercial low-volume device/package combinations (PDF)
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1.0 37 KB 10/15/1999
PDFPDN99005 - Discontinue certain technology versions (0.8u) of the XC3000, XC3000A, XC3100A (PDF)
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1.0 20 KB 07/15/1999
PDFXCU2001-02 - New Xilinx HW-130 Programmer Adapter for the XC17V16 and XC17V08 (PDF)
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1.0 20 KB 03/29/2002
PDFXCU2001-01 - Sample Availability Update for PCN2000-08 (PDF)
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1.2 133 KB 02/26/2003
PDFXCU2000-04 - XC9500XL Device Enhancement (PDF)
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1.0 16 KB 10/05/2000
PDFXCU2000-03 - Addition of PPT as a Substrate Supplier (PDF)
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1.0 22 KB 11/14/2002
PDFXCU2000-02 - Design Process Marginality on Virtex 32x1 Distributed SelectRAM (PDF)
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1.0 21 KB 09/19/2000
PDFXCU099602 - XC4000 Dual Layer Metal (DLM) to Triple Layer Metal (TLM) Design Considerations (PDF)
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1.0 18 KB 09/27/1996
PDFXCU099601 - Readback Specification Estabilished on XC4000/D/E (PDF)
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1.0 13 KB 09/15/1996
PDFXCU089902 - New Marking for Spartan Series Devices (PDF)
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1.0 15 KB 08/30/1999
PDFXCU019901 - Decision Not To Manufacture the XC4028XLA and the XC4036XLA in the HQ304 Package (PDF)
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1.0 15 KB 01/15/1999
PDFXCU019702 - Improving the Cost of Performance: XC3000 and XC3100A (PDF)
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1.0 43 KB 01/30/1997
PDFXCU019701 - Discontinuance of Low Volume XC3X00 Packages (PDF)
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1.0 38 KB 01/30/1997
PDFXCU010001 - New Marking for XC1800 Series Devices (PDF)
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1.0 20 KB 01/14/2000
PDFXCN07015 - Assembly Location and Mold Compound Change for Platform Flash TSOP48 Packages (PDF)

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Design Files: Qualification Report for XCN07015
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1.0.1 190 KB 09/07/2007
PDFXCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)

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1.0 164 KB 07/16/2007
PDFXCN07011 - Revised ICCA Specification for XC1701 and XC17S40 PROM Devices (PDF)

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1.0 39 KB 07/09/2007
PDFXCN07010 - Product Discontinuance Update (PDF)

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1.0 50 KB 05/14/2007
PDFXCN07003 - Discontinuation of Low-Volume HQ Packages in the XC4000E, XC4000XL, XC4000XLA Product Fam (PDF)

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1.0 34 KB 02/19/2007
PDFXCN06025 - Discontinuation of Certain Extended Temperature Devices (PDF)

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1.0 41 KB 01/01/2007
PDFXCN06024 - Replacement of SAC+ Solder Balls By SACN Solder Balls for Platform Flash FBGA Devices (PDF)

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1.0 25 KB 01/01/2007
PDFXCN06023 - Increase in Shift Register Delay for Virtex-4 FX Devices (-11 and -12 Speed Grades) (PDF)

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1.0 40 KB 12/11/2006
PDFXCN06022 - Revised Frequency Specification When Using APU Controller & PowerPC in Virtex-4 FX Device (PDF)

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1.0 34 KB 11/13/2006
PDFXCN07024 - Spartan-3A/-3AN/-3A DSP Chip-Select Controlled SelectMAP and ICAP Data Loading (PDF)

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1.0 44 KB 11/26/2007
PDFXCN08020 - Adding Clear APET Vacuum Formed Tray Packing Media for BGA and QFP Packages (PDF)

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1.0 93 KB 08/11/2008
PDFXCN08006 - Mold Compound Second Source for BGA Packages (PDF)

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Design Files: Qualification Report for XCN08006
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1.0.1 74 KB 04/17/2008
PDFXCN09003 - Additional Test Site for Spartan-3 FPGA Automotive XA Devices (PDF)

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Design Files: Qualification Report for XCN09003
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1.0 48 KB 01/19/2009
PDFXCN07017 - Assembly Supplier and Material Changes for Xilinx Flip-Chip Products (PDF)

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1.0 126 KB 08/31/2007
PDFXCN07022 - Product Discontinuation Notice (PDF)

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1.0.2 75 KB 07/28/2008
PDFXCN08014 - Package Substrate Change for Spartan-3A and Spartan-3AN Devices (PDF)

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Design Files: Qualification Report for XCN08014
FAQ for XCN08014
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1.0 68 KB 10/20/2008
PDFXCN08005 - Test Location and Topside Marking Change for Platform Flash and XC18V Flash Memory Devices (PDF)

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Design Files: Qualification Report for XCN08005
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1.0 77 KB 02/16/2009
PDFXCN09012 - Consolidation of On-package Capacitors in Virtex-5 FXT FPGA FF(G)1738 and FF(G)1136 Packages (PDF)

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1.0 68 KB 03/23/2009
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