Customer Notices

This notice describes two changes to the 8-Mbit, 16-Mbit, and 32-Mbit Platform Flash devices of the Xilinx In-System Programmable Configuration PROMs manufactured by ST Microelectronics; the assembly and finish plant location change for all TSOP48 packages, and the consolidation of mold compound material to ensure use of the same mold compound across all TSOP48 packages.

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

This notice is to inform XC1701 and XC17S40 family customers of a revision to the worst case ICCA active mode supply current specification. This revision will not require any changes to a customer's end system.

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

Xilinx is discontinuing certain low-volume HQ package products in the XC4000E, XC4000XL, and XC4000XLA product families. All speed grades and temperature grades of these product offerings are affected, including Xilinx Military.

The purpose of this notice is to communicate that Xilinx is discontinuing certain Q-grade extended temperature range products.

The purpose of this notice is to inform Xilinx Platform Flash PROM users of a change in the composition of the solder balls for the Pb-free 48TFBGA (FSG48) packages.

The purpose of this notice is to communicate an increase of Shift Register delay for Virtex™-4 FX devices. This change applies to all Virtex-4 FX devices in -11 and -12 speed grades, except for FX12, and only affects designs that use the Shift Register.

This notice is to inform Virtex™-4 FX users of a revision to the PowerPC™ operating frequency for designs using the APU Controller.

This notice is to inform Xilinx customers about the launch of the Pb-free version of the Platform Cable USB (HW-USB-G), and the conversion of the bill of materials (BOM) of the standard Platform Cable USB (HW-USB) to Pb-free.

Specific lots of wirebonded PBGA packages were found to exhibit bond lift failures through a single customer experience as of this date. An ongoing investigation of this issue points to specific lots of industry-standard mold compound in combination with industry-standard wirebond and molding process as the main contributors.

The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire bond (BGA) packages.

In this update (v2.0) of the Quality Alert, Xilinx has found an additional issue. The original alert notified Xilinx customers that Readback was not supported on some Spartan™-3E devices. In this updated alert, Block RAM Readback is not supported on additional Spartan-3E devices.

Xilinx is adding shipping trays produced by Kostat, Inc. for the new CS144/CSG144 and CS280/CSG280 Laminate packages.

A new thermal lid adhesive has been qualified for use on all flip-chip packages. The adhesion and thermal properties of the new material are comparable or better than the current thermal and lid attach adhesive.

Xilinx is discontinuing the standard (non Pb-free) System ACE Controller integrated circuit (part number XCCACE-TQ144I) as our supplier is no longer manufacturing this device.

Notification of an error in some SVF files generated by certain versions of iMPACT that can result in improper programming of CoolRunner™-II CPLDs.

This notice describes a mask change to the 8-Mbit and 16-Mbit devices of the Platform Flash™ family of Xilinx In-System Programmable Configuration PROMs manufactured by STMicroelectronics in Catania, Italy.

Xilinx is temporarily changing the MSL level on certain devices in the Pb-free FTG256 package from Level 3 to Level 5 per JEDEC STD-020C due to moisture-induced delamination failures.

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

Moisture-induced delamination on the bond fingers has been observed on the VOG8 package after MSL 1 pre-conditioning. The MSL of this package is therefore being re-classified from MSL 1 to MSL 3 per JEDEC STD-020C.

Xilinx will be using the Stepping Methodology to enhance production offerings. The Virtex™-4 LX and SX families will be the first families to leverage the Stepping Methodology.

Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families.

A package substrate change for Chip Scale (Tape) and lead-free Chip Scale (Tape).

The XC2C32 and XC2C64 CPLD devices are being discontinued and will be replaced by enhanced devices in the CoolRunner™-II CPLD family.

A package change in the XC4VLX60 FF1148 production devices.

The purpose of this notification is to communicate a change in the wafer fabrication facility for the XC95288XL and XC9536XL CPLD devices.

Notification for a 6-layer to 8-layer package change for some Virtex™-II Pro devices.

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

The MultiLINX download cable (ordering code HW-MUTILINX) is being discontinued. The Platform Cable USB, the Parallel Cable IV, and the MultiPRO Desktop Tool offer many of the same features and are alternatives to the MultiLINX cable.

The Spartan™-3 family of products will be manufactured at the UMC 300 mm wafer fabrication facility.

Starting in 2005, Xilinx Corporation will begin shipping devices manufactured on a 90 nm process from Toshiba, giving Xilinx increased capacity to support Virtex-4 LX production devices.

The XC95144XL and XC9572XL CPLD devices will transition from a 0.35mm four-layer metal Flash CMOS process at UMC, Taiwan to a 0.35mm four-layer metal Flash CMOS process at He Jian Technology Company, China.

Xilinx recommends updating the bitstream for all Spartan-3 FPGAs using the Xilinx ISE 6.3i, Service Pack 1 software or later. Bitstreams for the XC3S200 and XC3S400 are not affected by this change.

Xilinx is discontinuing certain members of the XC5200 product family.

Xilinx is discontinuing certain members of the XC3100A product family.

Xilinx is discontinuing certain members of the XC3000A product family.

PDN2004-01 announces the discontinuation of Low-Volume members of the Spartan™, Spartan™-XL, and Spartan™-II product families.

Discontinue SystemACE MPM (Multi-Package Module) Product Family

Initial Release of PDN2003-08 to discontinue the XCV2600E and XCV3200E

Discontinuance of all device/speed/package combinations of commercial and inductrial XC4000EXTM and XC4000XVTM product families.