Customer Notices

To communicate that Xilinx will not be enhancing the AccelDSP™ synthesis tool and starting with ISE® Design Suite 12.1 will be discontinuing the AccelDSP synthesis tool as part of the DSP Edition and System Edition of ISE Design Suite

To inform you of changes in relation to part numbers used to order Xilinx® ISE® Design Suite software and fee-based LogiCORE™ IP cores.

To communicate that Xilinx is discontinuing certain Development Systems Products.

The purpose of this notification is to communicate a transition to Step 1 and a 10-layer package substrate for select Virtex®-5 LXT and SXT FPGA devices.

Xilinx will discontinue certain XQR2V6000 products with specific grades and package combinations due to supplier sustainability of an older product line with inconsistent run rate.

To inform Xilinx automotive customers, having production part approval process (PPAP) documentation, about changes of the Xilinx Automotive (XA) Spartan®-3E Automotive FPGA data sheet.

To communicate a change in the wafer fabrication and sort facility for all devices in the Platform Flash (XCF) and XC18V00 families of flash memory configuration PROMs devices.

To announce conversion of substrate material changed from BT to ABF build-up for select Virtex®-II Pro FPGA and Virtex®-4 FPGA device/package.

To announce conversion of substrate material changed from BT to ABF build-up for selected Aerospace & Defense "XQ" Virtex®-4 FPGA device/package.

To communicate the discontinuance of the FF676 and FFG676 packages of the Virtex®-4 LX25 FPGA devices.

To communicate some revisions to the Platform Flash PROM DS123, v2.17, data sheet and UG161, v1.5, user guide.

This notification is to inform you of the Xilinx test site transfer of all Aerospace & Defense “XQ” I-grade and M-grade devices from Xilinx San Jose, California “XSJ” and/or Xilinx Dublin, Ireland “XIR” test sites to Xilinx Singapore “XAP” test site.

To communicate that Xilinx is discontinuing all remaining members in some mature product families including: XC4000E and XC4000XLA family FPGAs; and XC1700L, XC17S00, and XC17S00XL family PROM products.

To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products.

To communicate that Xilinx is discontinuing VO48 pin package in certain Platform Flash PROM devices due to supplier discontinuance.

The Spartan®-3 family of products will be manufactured at the UMC 300 mm wafer fabrication facility.

The purpose of this notification is to communicate that Xilinx is discontinuing certain Development Systems Products.

To communicate a part number change for certain I-Grade and Q-Grade products used by automotive customers for select XC9500XL and CoolRunner™-II products.

The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products.

Discontinuance of all device/speed/package combinations of commercial and inductrial XC4000EXTM and XC4000XVTM product families.

Xilinx is discontinuing certain members of the XC5200 product family.

Xilinx is discontinuing certain members of the XC3100A product family.

Xilinx is discontinuing certain members of the XC3000A product family.

PDN2004-01 announces the discontinuation of Low-Volume members of the Spartan™, Spartan™-XL, and Spartan™-II product families.

Discontinue SystemACE MPM (Multi-Package Module) Product Family

Initial Release of PDN2003-08 to discontinue the XCV2600E and XCV3200E

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

This notice is to communicate a change in the test facility used for the V grade QPro FPGA devices.

The mold compound and die-attach materials are moving to the same material set as used in our ROHS-compliant product. The ROHS-compliant material set is halogen-free, meets moisture sensitivity level (MSL) 3 per JEDEC standard J-STD-020C, and meets UL94 V-0 flammability requirements. The change in assembly materials does not affect the fit or function of the devices.

The purpose of this notification is to communicate a data sheet pin-to-pin specification change for the Virtex™-5 family.

The purpose of this notification is to communicate that Xilinx is discontinuing certain Development Systems Product Families.

Xilinx is adding new shipping trays produced by PCT Technology for the VO48/VOG48 TSOP packages.

The purpose of this alert is to communicate to customers that some development board shipments included power plug or adapters that might not meet European Union requirements.

To communicate that Xilinx is discontinuing certain Development Systems Products.

The purpose of this notification is to communicate a 10-layer package substrate change for select Virtex®-5 LX devices.

To communicate that Xilinx is discontinuing certain Development Systems Products.

This notice is to communicate that Xilinx is discontinuing certain Development Systems Products.

The purpose of this advisory is to communicate that some Xilinx FPGAs in flip-chip packaging were manufactured using solder material that might cause random upset of device configuration bits.

Advisory 2003-08: XC18V00 devices with the topmark "ART" are sensitive to noise when operated outside of the data sheet specification (DS026)

Advisory 2003-07: XCF01S, XCF02S, and XCF04S devices are sensitive to noise when operated outside of the data sheet specification (DS123).

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

Clarification of wafer foundry transition dates for the Virtex product family

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

This new circuit revision increases the tolerance of the configuration circuitry to non-monotonic power supply ramps and provides a more robust solution in customer applications.

This circuit revision increases the tolerance of the configuration circuitry to non-monotonic power supply ramps and provides a more robust solution in customer applications.

Updated availability dates: For XCR3032XL change from March 2005 to January 2005. For XCR3128XL change from December 2004 to January 2005.

Clarification on Handling Unconnected VCCINT Pins for Virtex Devices

Dual marking is being introduced for "-7C" and "-6I" Spartan-IIE devices, whereby these products will now have a "-7C/-6I" marking.

This notification describes a change in the specification of the maximum configuration clock (CCLK) frequency in the SelectMAP mode from 66 MHz to 50 MHz for Virtex-II™ devices.

PCN2003-10 announces a change in the wafer fabrication facility for the CoolRunner XCR3128XL

PCN2003-04A announces the extension of availability for the XC18V00 family of In-System Programmable Configuration PROMs manufactured at UMC, Taiwan.

This notification is to inform you of an additional wafer fabrication facility for the C-grade members of the XC18V00 family of In-System Programmable Configuration PROMs.

This notice is to inform Xilinx customers about the launch of the Pb-free version of the Platform Cable USB (HW-USB-G), and the conversion of the bill of materials (BOM) of the standard Platform Cable USB (HW-USB) to Pb-free.

Specific lots of wirebonded PBGA packages were found to exhibit bond lift failures through a single customer experience as of this date. An ongoing investigation of this issue points to specific lots of industry-standard mold compound in combination with industry-standard wirebond and molding process as the main contributors.

The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire bond (BGA) packages.

In this update (v2.0) of the Quality Alert, Xilinx has found an additional issue. The original alert notified Xilinx customers that Readback was not supported on some Spartan™-3E devices. In this updated alert, Block RAM Readback is not supported on additional Spartan-3E devices.

Xilinx is adding shipping trays produced by Kostat, Inc. for the new CS144/CSG144 and CS280/CSG280 Laminate packages.

A new thermal lid adhesive has been qualified for use on all flip-chip packages. The adhesion and thermal properties of the new material are comparable or better than the current thermal and lid attach adhesive.

Xilinx is discontinuing the standard (non Pb-free) System ACE Controller integrated circuit (part number XCCACE-TQ144I) as our supplier is no longer manufacturing this device.

Notification of an error in some SVF files generated by certain versions of iMPACT that can result in improper programming of CoolRunner™-II CPLDs.

This notice describes a mask change to the 8-Mbit and 16-Mbit devices of the Platform Flash™ family of Xilinx In-System Programmable Configuration PROMs manufactured by STMicroelectronics in Catania, Italy.

Xilinx is temporarily changing the MSL level on certain devices in the Pb-free FTG256 package from Level 3 to Level 5 per JEDEC STD-020C due to moisture-induced delamination failures.

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

Moisture-induced delamination on the bond fingers has been observed on the VOG8 package after MSL 1 pre-conditioning. The MSL of this package is therefore being re-classified from MSL 1 to MSL 3 per JEDEC STD-020C.

Xilinx will be using the Stepping Methodology to enhance production offerings. The Virtex™-4 LX and SX families will be the first families to leverage the Stepping Methodology.

Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families.

Updates include: corrected cross-ship date and indicated continued availability of ordering code SCD0765; removed references to 8-inch wafer ordering code SCD0769 (this SCD is now obsolete); clarified the bitstream programming file length paragraph; added traceability information; and modified Response and Contact Section.

PCN2000-08: Additional equivalent wafer foundries for fabrication of the Virtex commercial (C-grade and I-grade) product family

A package substrate change for Chip Scale (Tape) and lead-free Chip Scale (Tape).

The XC2C32 and XC2C64 CPLD devices are being discontinued and will be replaced by enhanced devices in the CoolRunner™-II CPLD family.

A package change in the XC4VLX60 FF1148 production devices.

The purpose of this notification is to communicate a change in the wafer fabrication facility for the XC95288XL and XC9536XL CPLD devices.

Notification for a 6-layer to 8-layer package change for some Virtex™-II Pro devices.

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

The MultiLINX download cable (ordering code HW-MUTILINX) is being discontinued. The Platform Cable USB, the Parallel Cable IV, and the MultiPRO Desktop Tool offer many of the same features and are alternatives to the MultiLINX cable.

Starting in 2005, Xilinx Corporation will begin shipping devices manufactured on a 90 nm process from Toshiba, giving Xilinx increased capacity to support Virtex-4 LX production devices.

The XC95144XL and XC9572XL CPLD devices will transition from a 0.35mm four-layer metal Flash CMOS process at UMC, Taiwan to a 0.35mm four-layer metal Flash CMOS process at He Jian Technology Company, China.

Xilinx recommends updating the bitstream for all Spartan-3 FPGAs using the Xilinx ISE 6.3i, Service Pack 1 software or later. Bitstreams for the XC3S200 and XC3S400 are not affected by this change.

This notice describes two changes to the 8-Mbit, 16-Mbit, and 32-Mbit Platform Flash devices of the Xilinx In-System Programmable Configuration PROMs manufactured by ST Microelectronics; the assembly and finish plant location change for all TSOP48 packages, and the consolidation of mold compound material to ensure use of the same mold compound across all TSOP48 packages.

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

This notice is to inform XC1701 and XC17S40 family customers of a revision to the worst case ICCA active mode supply current specification. This revision will not require any changes to a customer's end system.

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

Xilinx is discontinuing certain low-volume HQ package products in the XC4000E, XC4000XL, and XC4000XLA product families. All speed grades and temperature grades of these product offerings are affected, including Xilinx Military.

The purpose of this notice is to communicate that Xilinx is discontinuing certain Q-grade extended temperature range products.

The purpose of this notice is to inform Xilinx Platform Flash PROM users of a change in the composition of the solder balls for the Pb-free 48TFBGA (FSG48) packages.

The purpose of this notice is to communicate an increase of Shift Register delay for Virtex™-4 FX devices. This change applies to all Virtex-4 FX devices in -11 and -12 speed grades, except for FX12, and only affects designs that use the Shift Register.

This notice is to inform Virtex™-4 FX users of a revision to the PowerPC™ operating frequency for designs using the APU Controller.

The purpose of this Quality Alert is to communicate that the Non-continuous Slave Parallel (SelectMAP) or ICAP_SPARTAN3A data loading via de-asserting CSI_B does not function as expected, and is not a supported feature of these devices.

This notice is to communicate the addition of a Vacuum Formed Tray packing media for use with new pack multiple methodology for small quantity FCBGA, BGA, and QFP shipments.

Xilinx is adding a new second source molding compound for selected wirebond BGA packages.

The purpose of this notification is to add Xilinx Singapore “XAP” test site, as an additional test site for Spartan®-3 FPGA Automotive XA devices.

The purpose of this notification is to announce qualification of new second source construction materials, and the addition of a second source supplier for Xilinx plastic flip-chip products. In addition, a mask set stepping introduction for select Virtex®-4 FX products.

Xilinx is discontinuing certain Spartan®, XC4000XL, CoolRunner™, and Programming Solution products.

This notice is to announce the standardization of remaining Spartan®-3A devices to the current 2-layer substrate for the FT256 and FTG256 packages.

This notice is to communicate a change in the test equipment/location for all devices and the topside part marking for many devices in the Platform Flash (XCF) and XC18V families of flash memory configuration devices.

The purpose of this document is to inform the customer of a standardization effort for on-package capacitors used in Virtex®-5 FXT FPGA FF(G)1738 and FF(G)1136 packages for the prefix “XC” Commercial “C” and Industrial “I” devices.