XCU2001-02 - New Xilinx HW-130 Programmer Adapter for the XC17V16 and XC17V08 (PDF)
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|
1.0 |
20 KB |
03/29/2002 |
XCU2001-01 - Sample Availability Update for PCN2000-08 (PDF)
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|
1.2 |
133 KB |
02/26/2003 |
XCU2000-04 - XC9500XL Device Enhancement (PDF)
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|
1.0 |
16 KB |
10/05/2000 |
XCU2000-03 - Addition of PPT as a Substrate Supplier (PDF)
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|
1.0 |
22 KB |
11/14/2002 |
XCU2000-02 - Design Process Marginality on Virtex 32x1 Distributed SelectRAM (PDF)
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|
1.0 |
21 KB |
09/19/2000 |
XCU099602 - XC4000 Dual Layer Metal (DLM) to Triple Layer Metal (TLM) Design Considerations (PDF)
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|
1.0 |
18 KB |
09/27/1996 |
XCU099601 - Readback Specification Estabilished on XC4000/D/E (PDF)
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|
1.0 |
13 KB |
09/15/1996 |
XCU089902 - New Marking for Spartan Series Devices (PDF)
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|
1.0 |
15 KB |
08/30/1999 |
XCU019901 - Decision Not To Manufacture the XC4028XLA and the XC4036XLA in the HQ304 Package (PDF)
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|
1.0 |
15 KB |
01/15/1999 |
XCU019702 - Improving the Cost of Performance: XC3000 and XC3100A (PDF)
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|
1.0 |
43 KB |
01/30/1997 |
XCU019701 - Discontinuance of Low Volume XC3X00 Packages (PDF)
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|
1.0 |
38 KB |
01/30/1997 |
XCU010001 - New Marking for XC1800 Series Devices (PDF)
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|
1.0 |
20 KB |
01/14/2000 |
XCN07015 - Assembly Location and Mold Compound Change for Platform Flash TSOP48 Packages (PDF)
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This notice describes two changes to the 8-Mbit, 16-Mbit, and 32-Mbit Platform Flash devices of the Xilinx In-System Programmable Configuration PROMs manufactured by ST Microelectronics; the assembly and finish plant location change for all TSOP48 packages, and the consolidation of mold compound material to ensure use of the same mold compound across all TSOP48 packages.
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1.0.1 |
190 KB |
09/07/2007 |
XCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)
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Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product. Was this document helpful? Yes | No
|
1.0 |
164 KB |
07/16/2007 |
XCN07011 - Revised ICCA Specification for XC1701 and XC17S40 PROM Devices (PDF)
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This notice is to inform XC1701 and XC17S40 family customers of a revision to the worst case ICCA active
mode supply current specification. This revision will not require any changes to a customer's end system. Was this document helpful? Yes | No
|
1.0 |
39 KB |
07/09/2007 |
XCN07010 - Product Discontinuance Update (PDF)
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This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx. Was this document helpful? Yes | No
|
1.0 |
50 KB |
05/14/2007 |
XCN07003 - Discontinuation of Low-Volume HQ Packages in the XC4000E, XC4000XL, XC4000XLA Product Fam (PDF)
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Xilinx is discontinuing certain low-volume HQ package products in the XC4000E, XC4000XL, and XC4000XLA product families. All speed grades and temperature grades of these product offerings are affected, including Xilinx Military. Was this document helpful? Yes | No
|
1.0 |
34 KB |
02/19/2007 |
XCN06025 - Discontinuation of Certain Extended Temperature Devices (PDF)
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The purpose of this notice is to communicate that Xilinx is discontinuing certain Q-grade extended temperature range
products. Was this document helpful? Yes | No
|
1.0 |
41 KB |
01/01/2007 |
XCN06024 - Replacement of SAC+ Solder Balls By SACN Solder Balls for Platform Flash FBGA Devices (PDF)
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The purpose of this notice is to inform Xilinx Platform Flash PROM users of a change in the composition of the solder balls for the Pb-free 48TFBGA (FSG48) packages. Was this document helpful? Yes | No
|
1.0 |
25 KB |
01/01/2007 |
XCN06023 - Increase in Shift Register Delay for Virtex-4 FX Devices (-11 and -12 Speed Grades) (PDF)
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The purpose of this notice is to communicate an increase of Shift Register delay for Virtex™-4 FX devices. This change applies to all Virtex-4 FX devices in -11 and -12 speed grades, except for FX12, and only affects designs that use the Shift Register. Was this document helpful? Yes | No
|
1.0 |
40 KB |
12/11/2006 |
XCN06022 - Revised Frequency Specification When Using APU Controller & PowerPC in Virtex-4 FX Device (PDF)
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This notice is to inform Virtex™-4 FX users of a revision to the PowerPC™ operating frequency for designs using the APU Controller. Was this document helpful? Yes | No
|
1.0 |
34 KB |
11/13/2006 |
XCN06019 - Enhancement of the Standard Platform Cable USB to Pb-Free (PDF)
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This notice is to inform Xilinx customers about the launch of the Pb-free version of the Platform Cable USB (HW-USB-G), and the conversion of the bill of materials (BOM) of the standard Platform Cable USB (HW-USB) to Pb-free. Was this document helpful? Yes | No
|
1.0 |
163 KB |
08/21/2006 |
XCN06018 - Bond Lift on Wirebonded Plastic Ball Grid Array (PBGA) Packages (PDF)
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Specific lots of wirebonded PBGA packages were found to exhibit bond lift failures through a single customer experience as of this date. An ongoing investigation of this issue points to specific lots of industry-standard mold compound in combination with industry-standard wirebond and molding process as the main contributors. Was this document helpful? Yes | No
|
1.0 |
87 KB |
06/26/2006 |
XCN06016 - New Assembly Partner: STATS ChipPAC Singapore (SCS) (PDF)
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The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly
partner for Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire bond (BGA)
packages.
|
1.1 |
115 KB |
12/25/2006 |
XCN06015 - Readback Issue on Spartan-3E Devices (PDF)
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In this update (v2.0) of the Quality Alert, Xilinx has found an additional issue. The original alert notified Xilinx customers that Readback was not supported on some Spartan™-3E devices. In this updated alert, Block RAM Readback is not supported on additional Spartan-3E devices. Was this document helpful? Yes | No
|
2.0 |
54 KB |
10/23/2006 |
XCN06013 - Addition of Kostat Shipping Tray for CS144/CSG144 and CS280/CSG280 Laminate BGA Packages (PDF)
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Xilinx is adding shipping trays produced by Kostat, Inc. for the new CS144/CSG144 and CS280/CSG280 Laminate
packages. Was this document helpful? Yes | No
|
1.1 |
76 KB |
05/17/2006 |
XCN06012 - Additional Source for Thermal Adhesive in Flip-Chip Packages for Virtex-II/-II Pro/-4 (PDF)
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A new thermal lid adhesive has been qualified for use on all flip-chip packages. The adhesion and thermal properties of the new material are comparable or better than the current thermal and lid attach adhesive. Was this document helpful? Yes | No
|
1.0 |
192 KB |
05/01/2006 |
XCN06006 - Discontinuation of Non Pb-Free System ACE Controller (XCCACE-TQ144I) (PDF)
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Xilinx is discontinuing the standard (non Pb-free) System ACE Controller integrated circuit (part number XCCACE-TQ144I) as our supplier is no longer manufacturing this device. Was this document helpful? Yes | No
|
1.0 |
221 KB |
02/27/2006 |
XCN06005 - CoolRunner™-II CPLD OTF SVF Programming Issue (PDF)
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Notification of an error in some SVF files generated by certain versions of iMPACT that can result in improper programming of CoolRunner™-II CPLDs. Was this document helpful? Yes | No
|
1.0 |
38 KB |
01/30/2006 |
XCN06004 - Mask Set Modification for the XCF08P and XCF16P (PDF)
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This notice describes a mask change to the 8-Mbit and 16-Mbit devices of the Platform Flash™ family of Xilinx
In-System Programmable Configuration PROMs manufactured by STMicroelectronics in Catania, Italy.
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1.0 |
103 KB |
03/20/2006 |
XCN06003 - Spartan™-IIE and Spartan-3 FTG256 Pb-Free Moisture Sensitivity Level Change (PDF)
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Xilinx is temporarily changing the MSL level on certain devices in the Pb-free FTG256 package from Level 3 to Level 5 per JEDEC STD-020C due to moisture-induced delamination failures. Was this document helpful? Yes | No
|
1.0 |
57 KB |
01/30/2006 |
XCN06002 - Discontinuation of Certain Military and Radiation-Tolerant Devices (PDF)
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Xilinx is discontinuing certain low-demand military and radiation-tolerant products. Was this document helpful? Yes | No
|
1.0 |
52 KB |
01/30/2006 |
XCN06001 - Re-classification of VOG8 Moisture Sensitivity Level (PDF)
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Moisture-induced delamination on the bond fingers has been observed on the VOG8 package after MSL 1 pre-conditioning. The MSL of this package is therefore being re-classified from MSL 1 to MSL 3 per JEDEC STD-020C. Was this document helpful? Yes | No
|
1.1 |
53 KB |
03/02/2006 |
XCN05025 - Xilinx Stepping Methodology (PDF)
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Xilinx will be using the Stepping Methodology to enhance production offerings. The Virtex™-4 LX and SX families will be the first families to leverage the Stepping Methodology. Was this document helpful? Yes | No
|
1.1 |
71 KB |
12/09/2005 |
XCN05020 - Discontinue Low-Volume Members of the XC4000XL, XC4000E, XC9500XV, and XC3100A Families (PDF)
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Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families. Was this document helpful? Yes | No
|
1.1 |
143 KB |
03/10/2006 |
XCN05018 - Package Substrate Change for Chip Scale (Tape) and Lead-Free Chip Scale (Tape) (PDF)
|
1.0.1 |
130 KB |
12/21/2007 |
XCN05017 - Discontinuation of the XC2C32 and XC2C64 CPLDs (PDF)
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The XC2C32 and XC2C64 CPLD devices are being discontinued and will be replaced by enhanced devices in the CoolRunner™-II CPLD family. Was this document helpful? Yes | No
|
1.1 |
72 KB |
04/24/2006 |
XCN05016 - XC4VLX60 FF1148 Package Construction Change (PDF)
|
1.0 |
50 KB |
10/03/2005 |
XCN05015 - Change in Wafer Fabrication Facility for XC95288XL and XC9536XL CPLDs (PDF)
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The purpose of this notification is to communicate a change in the wafer fabrication facility for the XC95288XL and XC9536XL CPLD devices. Was this document helpful? Yes | No
|
1.0 |
84 KB |
10/03/2005 |
XCN05012 - Package Change for the Virtex-II Pro Devices (PDF)
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Notification for a 6-layer to 8-layer package change for some Virtex™-II Pro devices.
|
1.0 |
46 KB |
08/01/2005 |
XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion (PDF)
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This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.
|
2.0 |
60 KB |
08/07/2006 |
XCN05010 - Discontinue MultiLINX Cable (PDF)
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The MultiLINX download cable (ordering code HW-MUTILINX) is being discontinued. The Platform Cable USB, the Parallel Cable IV, and the MultiPRO Desktop Tool offer many of the same features and are alternatives to the MultiLINX cable. Was this document helpful? Yes | No
|
1.1 |
41 KB |
05/03/2005 |
XCN05009 - Addition of UMC 300 mm Wafer Fabrication for Spartan-3 Family (PDF)
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The Spartan™-3 family of products will be manufactured at the UMC 300 mm wafer fabrication facility.
|
1.0.1 |
121 KB |
05/13/2005 |
XCN05005 - Toshiba, A New Foundry (PDF)
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Starting in 2005, Xilinx Corporation will begin shipping devices manufactured on a 90 nm process from Toshiba, giving Xilinx increased capacity to support Virtex-4 LX production devices. Was this document helpful? Yes | No
|
1.1 |
45 KB |
03/09/2006 |
XCN05003 - Change in Wafer Fabrication Facility for XC95144XL and XC9572XL CPLDs (PDF)
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The XC95144XL and XC9572XL CPLD devices will transition from a 0.35mm four-layer metal Flash CMOS process at UMC, Taiwan to a 0.35mm four-layer metal Flash CMOS process at He Jian Technology Company, China. Was this document helpful? Yes | No
|
1.0 |
95 KB |
01/31/2005 |
XCN05001 - Bitstream Update Required for Specific Production Spartan-3 FPGAs (PDF)
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Xilinx recommends updating the bitstream for all Spartan-3 FPGAs using the Xilinx ISE 6.3i, Service Pack 1 software or later. Bitstreams for the XC3S200 and XC3S400 are not affected by this change. Was this document helpful? Yes | No
|
1.0 |
65 KB |
01/17/2005 |
PDN99007A - Withdrawal of certain commercial low-volume device/package combinations (PDF)
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|
1.0 |
38 KB |
01/30/2000 |
PDN99007 - Withdrawal of certain commercial low-volume device/package combinations (PDF)
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|
1.0 |
37 KB |
10/15/1999 |
PDN99005 - Discontinue certain technology versions (0.8u) of the XC3000, XC3000A, XC3100A (PDF)
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|
1.0 |
20 KB |
07/15/1999 |
PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families (PDF)
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|
1.0 |
24 KB |
07/01/1999 |
XC4000 devices available after PDN99003 (PDF)
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|
1.0 |
37 KB |
04/19/1999 |
PDN99003 - Discontinue certain members of the XC4000 commercial & industrial product line (PDF)
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|
1.0 |
44 KB |
04/19/1999 |
PDN99003 Data - XC4000 Devices which are NOT affected by PDN99003 (PDF)
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|
1.0 |
29 KB |
04/19/1999 |
PDN99001 - Discontinue certain speed grades of the XC3000 & XC4000 SMD & M-Grade (PDF)
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|
1.0 |
49 KB |
01/15/1999 |
PDN98006 - Discontinuation of the XC4003A M-grade and B-grade (SMD) Products (PDF)
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|
1.0 |
18 KB |
06/26/1998 |
PDN98005 - Discontinuation of the XC3100A M-grade and B-grade (SMD) Products (PDF)
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|
1.0 |
18 KB |
06/26/1998 |
PDN98004 - Discontinuation of the XC1718 Product (PDF)
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|
1.0 |
18 KB |
06/26/1998 |
PDN98001 - Discontinuation of the MQFP package option in some XC4000 products (PDF)
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|
1.0 |
21 KB |
06/15/1998 |
PDN97006 - Withdrawal of certain specific low volume device/package combinations (correction) (PDF)
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|
1.0 |
23 KB |
02/10/1998 |
PDN97005 - Withdrawal of certain specific low volume device/package combinations (PDF)
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|
1.0 |
18 KB |
01/30/1997 |
PDN97004 - Withdrawal of Commercial and Industrial XC3100A-5 Speed Grades, all packages (PDF)
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|
1.0 |
18 KB |
01/30/1997 |
PDN97003 - Withdrawal of Commercial and Industrial XC3000-70 Speed Grades, all packages (PDF)
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|
1.0 |
19 KB |
01/30/1997 |
PDN2004-22 - Discontinue Low-Volume Members of the XC5200 Product Family (PDF)
|
1.1 |
46 KB |
08/27/2004 |
PDN2004-21 - Discontinue Low-Volume Members of the XC4000XL, XC4000XLA, and XC4000E Product Families (PDF)
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|
1.1 |
245 KB |
11/15/2004 |
PDN2004-20 - Discontinue Low-Volume Members of the XC3100A Product Family (PDF)
|
1.0 |
62 KB |
08/23/2004 |
PDN2004-19 - Discontinue Low-Volume Members of the XC3000A Product Family (PDF)
|
1.0 |
40 KB |
08/23/2004 |
PDN2004-01: Low-Volume Members of the Spartan Product Families are Discontinued (PDF)
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PDN2004-01 announces the discontinuation of Low-Volume members of the Spartan™, Spartan™-XL, and Spartan™-II product families. Was this document helpful? Yes | No
|
1.0 |
46 KB |
03/05/2004 |
Product Discontinuation Notice PDN2003-09 (PDF)
|
1.0 |
65 KB |
11/10/2003 |
PDN2003-08 - Discontinue XCV2600E and XCV3200E (PDF)
|
1.0 |
26 KB |
07/31/2003 |
PDN2003-05 - Discontinue XC18V256 and I-Grade Ordering Codes for the XC18V00 Product Family (PDF)
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|
1.3 |
58 KB |
09/01/2004 |
Xilinx PDN2003-03 to discontinue XC3000 and XC3000L products (C-Grade & I-Grade) (PDF)
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|
1.2 |
53 KB |
02/12/2003 |
Xilinx PDN2003-02 - Discontinue HardWire Products (PDF)
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|
01 |
45 KB |
02/01/2003 |
PDN2003-01 - XC3020A, XC3042A, XC3090A Military Temperature Grade (PDF)
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|
1.0 |
20 KB |
01/17/2003 |
Supplemental List for PDN2002-03 (PDF)
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|
1.0 |
611 KB |
04/01/2002 |
PDN2002-03 - Discontinue certain members of the XC4000, XC4000E, and XC4000L families (PDF)
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|
1.1 |
76 KB |
04/01/2002 |
PDN2002-02 - Discontinuation of the XC4000XLT family (PDF)
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|
1.0 |
24 KB |
01/15/2002 |
PDN2002-01 - Discontinuation of the XC4000EX and XC4000XV families (PDF)
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Discontinuance of all device/speed/package combinations of commercial and inductrial XC4000EXTM and XC4000XVTM product families. Was this document helpful? Yes | No
|
1.0 |
32 KB |
01/15/2002 |
PDN2001-03 - Withdrawal of certain commercial low volume device-speed combinations (XC4000XL) (PDF)
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|
1.0 |
20 KB |
01/15/2001 |
PDN2001-02 - Withdrawal of certain commercial low volume device-package combinations (XC4000XL/XV) (PDF)
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|
1.0 |
136 KB |
01/15/2001 |
PDN2000-07: Products Affected (PDF)
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|
1.0 |
110 KB |
10/19/2000 |
PDN2000-07 - Discontinuation of certain XPLA CPLD Families (PDF)
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|
1.0 |
159 KB |
10/19/2000 |
PDN2000-05 - Discontinuation of Certain HardWire 1 Products (PDF)
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|
1.0 |
18 KB |
09/28/2000 |
PDN00001 - Low volume commercial device/package combinations (PDF)
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|
1.0 |
28 KB |
01/15/2000 |
PCN99008 - A change to the Icc Standby Specification of XC1702L and XC1704L products (PDF)
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|
1.0 |
19 KB |
10/01/1999 |
PCN99002 - Qualification Data for PCN99002 (wafer fabrication process change for XC4000XL) (PDF)
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|
1.0 |
50 KB |
05/24/1999 |
PCN99002: A change in the wafer fabrication process used to fabricate the XC4000XL (C & I Grade) (PDF)
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|
1.0 |
25 KB |
05/24/1999 |
PCN98008 - Discontinue XC3000/XC3000A product manufactured at Yamaha (PDF)
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|
1.0 |
20 KB |
08/30/1998 |
PCN98007 - A change in the mold compound and die attach epoxy for Xilinx PLCC and QFP packages (PDF)
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|
1.0 |
20 KB |
08/10/1998 |
PCN98007 Data - Package Qualification Testing Data for Mold Compound MP8000 (PDF)
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