Defense QPro

Xilinx is adding a new second source molding compound for selected wirebond BGA packages.

The mold compound and die-attach materials are moving to the same material set as used in our ROHS-compliant product. The ROHS-compliant material set is halogen-free, meets moisture sensitivity level (MSL) 3 per JEDEC standard J-STD-020C, and meets UL94 V-0 flammability requirements. The change in assembly materials does not affect the fit or function of the devices.

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

This notice is to communicate a change in the test facility used for the V grade QPro FPGA devices.

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

Xilinx is discontinuing certain low-volume HQ package products in the XC4000E, XC4000XL, and XC4000XLA product families. All speed grades and temperature grades of these product offerings are affected, including Xilinx Military.

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

The purpose of this notification is to announce qualification of new second source construction materials, and the addition of a second source supplier for Xilinx plastic flip-chip products. In addition, a mask set stepping introduction for select Virtex®-4 FX products.

Xilinx is adding new shipping trays produced by PCT Technology for the VO48/VOG48 TSOP packages.

The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products.

To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products.