Defense QPro

Data sheet for the QPRO family of XC1700E configuration PROMs.

This data sheet describes the defense-grade version of the Platform Flash series of in-system programmable configuration PROMs, specifically the XQF32P.

This data sheet has four modules: Introduction and Overview, Functional Description, DC and Switching Characteristics, and Pinout Information. Some products covered in this data sheet are not recommended for new designs.

QPro Virtex-E Combined Data Sheet (all four modules).

Xilinx is adding a new second source molding compound for selected wirebond BGA packages.

Design File(s):

• Qualification Report for XCN08006

The mold compound and die-attach materials are moving to the same material set as used in our ROHS-compliant product. The ROHS-compliant material set is halogen-free, meets moisture sensitivity level (MSL) 3 per JEDEC standard J-STD-020C, and meets UL94 V-0 flammability requirements. The change in assembly materials does not affect the fit or function of the devices.

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

This notice is to communicate a change in the test facility used for the V grade QPro FPGA devices.

Xilinx is discontinuing certain low-volume HQ package products in the XC4000E, XC4000XL, and XC4000XLA product families. All speed grades and temperature grades of these product offerings are affected, including Xilinx Military.

Xilinx is adding new shipping trays produced by PCT Technology for the VO48/VOG48 TSOP packages.

The purpose of this notification is to announce qualification of new second source construction materials, and the addition of a second source supplier for Xilinx plastic flip-chip products. In addition, a mask set stepping introduction for select Virtex®-4 FX products.

Design File(s):

• Qualification Report for XCN07017
• Amkor Qualification Report for XCN07017
• Fujitsu Qualification Report for XCN07017

To announce conversion of substrate material changed from BT to ABF build-up for selected Aerospace & Defense "XQ" Virtex®-4 FPGA device/package.

To inform Xilinx customers of the removal of Xilinx support for Parity Checking for PowerPC®405 in all Virtex®-4 FX FPGAs for the "XC" Commercial "C", Industrial "I", and Aerospace/Defense "XQ" devices.

To communicate that Xilinx is discontinuing the XQ4036XL-3BG352N and the associated SMD part number for Aerospace and Defense products due to supplier discontinuance.

To communicate that Xilinx is discontinuing certain additional Aerospace and Defense SMD HQ240 package part numbers. This discontinuance is an extension to previous XCN09001.

To communicate a change in the wafer fabrication and sort facility for XQ18V04VQ44N flash memory configuration PROM device for Aerospace and Defense “XQ” products.

To announce that Xilinx has qualified a new bumping supplier for Virtex®-4QV FPGA space-grade devices in ceramic flip chip column grid array (CF) packages.

To announce the conversion of substrate material from BT to ABF build-up for two Aerospace and Defense ‘XQ” Virtex&-II Pro FPGA device/packages.

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products.

To announce that Xilinx is qualifying Siliconware Corp. (SPIL) as assembly supplier for Aerospace & Defense “XQ” PQ240 product.

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

To communicate that Xilinx is discontinuing certain Aerospace and Defense part numbers.

To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products.

To announce that Xilinx is qualifying a new vendor for the glass material that is used on the lid of the 44L Cerquad CC44 package.

To communicate an urgent Xilinx discontinuation of certain XC1700D Aerospace & Defense PROMs products.

To communicate that the Xilinx discontinuation of certain Virtex® (Virtex-E, Virtex-EM, Virtex-II and EasyPath™ Virtex-II families) and Spartan® (Spartan-IIE family) FPGA products has been retracted due to a two year extension of production capability.

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