Spartan-3E

Spartan™-3E FPGA Family Data Sheet (all four modules). See the Spartan-3 Generation User Guides for additional information.

Comma-delimited ASCII text files and Excel spreadsheet maps for each package type

Describes the configuration features of the Spartan®-3 Generation FPGAs. Includes the Spartan-3A, Spartan-3AN, Spartan-3A DSP, Spartan-3E, and Spartan-3 FPGA families.

Functional description of the Spartan®-3 generation FPGA architecture and how to use it. Includes the Spartan-3A, Spartan-3AN, Spartan-3A DSP, Spartan-3E, and Spartan-3 platforms.

Summary of the reliability test data and results for Xilinx devices updated four times per year.

See “Production Stepping” section in the data sheet for additional information.

See “Production Stepping” section in the data sheet for additional information.

See “Production Stepping” section in the data sheet for additional information.

All errata items previously described in earlier revisions of this notice were integrated into the Spartan™-3E data sheet as the Stepping 0 production device. See “Production Stepping” section in the data sheet for additional information.

All errata items previously described in earlier revisions of this notice were integrated into the Spartan™-3E data sheet as the Stepping 0 production device. See “Production Stepping” section in the data sheet for additional information.

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

Specific lots of wirebonded PBGA packages were found to exhibit bond lift failures through a single customer experience as of this date. An ongoing investigation of this issue points to specific lots of industry-standard mold compound in combination with industry-standard wirebond and molding process as the main contributors.

The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire bond (BGA) packages.

Design File(s):

• Qualification Report for XCN06016

In this update (v2.0) of the Quality Alert, Xilinx has found an additional issue. The original alert notified Xilinx customers that Readback was not supported on some Spartan™-3E devices. In this updated alert, Block RAM Readback is not supported on additional Spartan-3E devices.

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

Design File(s):

• Qualification Report for XCN05011

This notice is to communicate that Xilinx is discontinuing certain Development Systems Products.

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

To communicate the addition of new supply sources for wire bond BGA package core and prepreg material for Spartan®/-XL/-II/-IIE/-3/-3E/-3A/-3AN/-3ADSP/-6, XC95XXX, XC95XXXXL, Virtex®, Virtex®-E, Virtex®-II/-ll Pro, and CoolRunner™ and CoolRunner™-II product.

To announce the transitioning of all wire bond package types for Spartan®-3, Spartan-3E and Spartan-3A FPGA products from gold (Au) to copper (Cu) wire.

This notification is to communicate that Xilinx is discontinuing certain Development Systems products.

To communicate that Xilinx is discontinuing certain Development Systems products

This application note describes how to build a system that can be used for determining the optimal phase shift for a DDR memory feedback clock. In this system, the DDR memory is controlled by a controller that attaches to either the OPB or PLB and is used in an embedded microprocessor application. This reference system also uses a DCM that is configured so that the phase of its output clock can be changed while the system is running and a GPIO core that controls that phase shift. The GPIO output is controlled by a software application that can be run on a PPC or MicroBlaze™ microprocessor

Design File(s):

• xapp806_MB_ph_shift.zip
• xapp806_PPC_ph_shift.zip

This application note discusses the configuration and programming options for Xilinx Complex Programmable Logic Device (CPLD), Field Programmable Gate Array (FPGA), and PROM families and demonstrates some of the most popular configuration methods used for each family. This document includes configuration quick start guidelines for the Virtex™, Spartan™, XPLA3, XC9500, and XC18V00 families.

Differential signals, such as LVDS or LVPECL, can be difficult to route on simple, four-layer or six-layer PCBs without excessive use of vias. This application note shows how Spartan™-3 Generation FPGAs, with just the inclusion of an inverter in the datapath, can avoid excessive use of vias and fix accidental PCB trace swapping without requiring a PCB respin.

Design File(s):

• xapp491.zip
• xapp491.zip

XAPP482 describes a working MicroBlaze™ system that stores software code, user data, and configuration data in non-volatile Platform Flash PROMs, simplifying system design and reducing cost. It provides a portable hardware design, software design, and additional script utilities to be used during the implementation flow.

Design File(s):

• xapp482.zip
• xapp482.zip

For the latest version of this application note, see the BSDL chapter in User Guide UG331, Spartan™-3 Generation FPGA User Guide.

For the latest version of this application note, see the Multiplexers chapter in User Guide UG331, Spartan™-3 Generation FPGA User Guide.

Design File(s):

• xapp466_vhdl.zip
• xapp466_verilog.zip

For the latest version of this application note, see the SRL16 chapter in User Guide UG331, Spartan™-3 Generation FPGA User Guide.

Design File(s):

• xapp465_vhdl.zip
• xapp465_verilog.zip

For the latest version of this application note, see the Distributed RAM chapter in User Guide UG331, Spartan™-3 Generation FPGA User Guide.

Design File(s):

• xapp464_vhdl.zip
• xapp464_verilog.zip

For the latest version of this application note, see the Block RAM chapter in User Guide UG331, Spartan™-3 Generation FPGA User Guide.

Design File(s):

• xapp463_verilog.zip
• xapp463_vhdl.zip

For the latest version of this application note, see the DCM chapter in User Guide UG331, Spartan™-3 Generation FPGA User Guide.

Design File(s):

• xapp462_verilog.zip
• xapp462_vhdl.zip

The PCI specification defines two I/O timing budgets for use with 33 MHz and 66 MHz operation. In embedded designs, custom timing budgets enable the following: • Reduce total system cost by using less expensive devices • Achieve higher data transfer rates than allowed by specification • Add more loads to the bus to accommodate additional devices and connectors • Increase the physical length of the bus to accommodate novel bus topologies The information presented in this application note is applicable to any embedded PCI implementation using Xilinx FPGA devices.

This application note describes how memories wider than 36 bits can be efficiently implemented in the Virtex™-II and Spartan™-3 architectures. The clock-doubling method used is similar to the method described for quad-port memories in XAPP228. The resulting memories are used in either dual-port or single-port mode.

Design File(s):

• xapp229.zip
• xapp229.zip

When designing digital systems, there is often a requirement to synchronize incoming data and clock signals with an internal system clock, i.e., the internal and external clock are at exactly the same frequency, but due to variable backplane, board, or application-specific standard product (ASSP) delays, the phase relationship is not known. The circuit described in this application note addresses this issue for both single traces and data buses up to 210 MHz in a Virtex®-II -5 device. The speed limitation is imposed by the maximum frequency that can be accepted by the Digital Clock Manager (DCM), in a mode where it is capable of providing both a new clock and a new clock shifted by 90 degrees.

Design File(s):

• xapp225.zip

Data recovery is a mechanism that allows a receiver to extract embedded clock data from an incoming data stream. The receiver usually extracts this information from the data stream concerned, but sometimes the receiver’s clock is used for data transmission. The circuit described in this application note provides a partial solution at data rates up to 160 Mb/s in a Virtex™-E -7 device, a Spartan™-IIE -6 device, or a Spartan-3 -4 device, and up to 420Mb/s in a Virtex-II -5 device or a Virtex-II Pro™ -6 device. The solution is partial in the sense that no clock is actually recovered, but the data arriving is fully extracted. The speed is limited by the maximum frequency that can be accepted by the Delay Locked Loop (DLL), in a mode where the DLL is capable of providing both a new clock, and another clock shifted by 90 degrees.

Design File(s):

• xapp224.zip
• xapp224.zip

This application note describes an approach to the 3.3V configuration of Spartan®-3 FPGAs. It provides a set of proven connection diagrams for each configuration mode. The same approach can be applied to the Spartan-3E family.

This application note addresses low-cost, four- to six-layer, high-volume printed circuit board (PCB) layout for a Spartan™-3E FPGA in the FT256 1 mm BGA package. Intended for design engineers, managers, and PCB layout staff, who are already familiar with SI related design issues. The general guidelines can be used to optimize board layout for other devices and packages.

Design File(s):

• xapp489.zip
• xapp489.zip

This application note describes techniques for remote reconfiguration of FPGAs through an Ethernet port.

Design File(s):

• xapp441_designfiles.zip
• xapp441_designfiles.zip

Hot-swapping or hot insertion describes a potentially dangerous method of inserting an unpowered board into a power-on (hot) running system. There are several concerns: the insertion must not cause physical harm or permanent damage to the system or the inserted board, and the insertion must not cause data corruption or any transient system upsets. This application note describes the physical aspects of hot-inserting a Virtex™-II based card into a system or system backplane, using sequenced connectors, where VCC and GND mate well before any signal pins can mate. The dangers of using normal non-sequenced connectors are described in Hot Plug-In. Not addressed in this application note are system issues including detecting the presence or absence of a card, or how the card is accepted in the system.

Using and Creating Flash Files for MicroBlaze™.

This is a reference design for the Spartan™-3E Display Development Kit to assist in developing display panel products. The display solution FPGA design consists of a Video Input interface, Color Temperature Correction, Precise Gamma Correction, Image Dithering Engine, and an output interface.

Design File(s):

• xapp928.zip

This application note discusses the use of Partitions in the Incremental Design Flow. It is recommended that module instances with high logic density, timing critical paths, or timing critical module instances be designated Partitions.

This application note describes the implementation of a two-dimensional Rank Order filter. The reference design includes the RTL VHDL implementation of an efficient sorting algorithm.

Design File(s):

• xapp953.zip

Ground bounce must be controlled to ensure proper operation of high performance FPGA devices. Particular attention must be applied to minimizing board-level inductance during PCB layout. This document describes calculations that help to ensure that a design meets input undershoot and logic-low voltage requirements for devices receiving signals from an FPGA.

Design File(s):

• xapp689.zip

This application note describes how to connect Virtex™-II, Virtex-II Pro, Virtex-4, Virtex-5, Spartan™-3, and Spartan-3E devices to 3.3V or 5V PCI buses. The design responds to customer demand for a general solution for applications with a Virtex-II device and a 5V PCI bus, as well as for applications with a Virtex-II Pro, Virtex-4, Virtex-5, Spartan-3, or Spartan-3E device and a 3.3V or 5V PCI bus.

This document provides information for debugging board level problems by using ChipScope™ Pro with Endpoint for PCI Express designs using Virtex™-4, Virtex-5, Virtex-II Pro FPGAs, the Endpoint PIPE for PCIe core using Spartan™-3/-3E/-3A FPGAs, and in the Endpoint Block Plus for PCIe core with Virtex-5 devices.

Design File(s):

• xapp1002.zip

This application note describes how to interface 3.3V differential Low-Voltage Positive Emitter Coupled Logic (LVPECL) drivers with Xilinx® 2.5V differential receivers, including Virtex®-II Pro, Virtex-II Pro X, Virtex-4, Virtex-5, Spartan®-3E, and Spartan-3 FPGA 2.5V LVPECL and Low Voltage Differential Signaling (LVDS). Several interface modifications are presented with supporting IBIS simulation results.

This document details the design aspects of digital PLLs implemented in Virtex® and Spartan® FPGAs for telecommunications applications. PLL performance and loop stability are evaluated.

Design File(s):

• xapp868.zip

Describes how Extended Spartan®-3A family and Spartan-3E FPGAs work in spread-spectrum applications.

The Xilinx high-performance CPLD, FPGA, and configuration PROM families provide in-system programmability, reliable pin locking, and JTAG boundary-scan test capability. This powerful combination of features allows designers to make significant changes and still keep the original device pin-outs, which eliminates the need to re-tool PC boards.

Design File(s):

• xapp058.zip

This Application Note describes the feature of Platform Flash PROMs that allows the user to Multiple-Boot or dynamically reconfigure from up to four Design Revisions.

Design File(s):

• xapp483.zip

The J Drive programming engine provides immediate and direct in-system configuration (ISC) support for IEEE Standard 1532 programmable logic devices (PLDs). To configure an in-system device, the programming engine uses the configuration algorithm information from a 1532 Boundary Scan Description Language (BSDL) file to apply configuration data from the 1532 data file through the IEEE Standard 1149.1 test access port (TAP). The J Drive executable, source code, and a programming example are available in a download package from the Xilinx website. The J Drive programming engine can be used for the following Xilinx families: CoolRunner-II CPLDs, XC9500/XL/XV CPLDs, Spartan-3 Generation FPGAs, and Virtex-II (and later) series FPGAs.

Design File(s):

• xapp500.zip

The PCI™ Local Bus Specification defines a number of power and reset requirements. When considered in an FPGA implementation, these create several challenges that must be addressed for long term reliability and broad interoperability. This application note applies to compliant PCI applications using Spartan™-3 Generation FPGAs, and is relevant to other Xilinx FPGA families, as well as related PCI applications.

Design File(s):

• xapp457.zip

This application note describes how the existing dual-port block memories in the Spartan®-II and Virtex® families can be used as Quad-Port memories. This essentially involves a data access time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the block memory in terms of bits per second will remain the same.

Design File(s):

• xapp228.zip

The block memories in the Virtex®-II architecture are capable of supporting data bus widths of up to 36-bits. A self-addressing FIFO reference design uses these block memories to store both data and address information in a single memory location. This application note describes FIFO designs where no external counters are required. Only flag and status information logic is used. The resulting FIFOs are not fast (around 150 MHz). Their advantage is in using only one clock load. In addition, the status mechanism is very simple making FIFOs are more suitable for data throttling in continuous data systems instead of the full or empty detection required in frame-based data systems.

Design File(s):

• xapp291.zip

This application note provides users with a general understanding of the SVF and XSVF file formats as they apply to Xilinx® devices. Some familiarity with IEEE STD 1149.1 (JTAG) is assumed. For information on using Serial Vector Format (SVF) and Xilinx Serial Vector Format (XSVF) files in embedded programming applications, refer to Xilinx Application Note XAPP058.

In embedded systems, designers can reduce component count and increase flexibility by using a microprocessor to configure an FPGA. C code illustrates the use of either Slave Serial or SelectMAP mode. CPLD design files illustrate a synchronous interface between processor and FPGA.

Design File(s):

• xapp502.zip

This application note describes how to use Spartan®-3E FPGAs to implement various serial digital video interfaces commonly used in the professional video broadcast industry.

Design File(s):

• xapp1015.zip

This application note describes the implementation of a YCrCb color space to an RGB Color space conversion circuit necessary in many video designs.

Design File(s):

• xapp931.zip

This application note discusses using the provided Memory Endpoint Test (MET) demonstration driver to exercise the Programmed Input/Output (PIO) design that is delivered with all Xilinx solutions for PCI Express®.

Design File(s):

• xapp1022.zip

This application note contains guidelines on reflow soldering, inspection, and rework process for Pb-free packages.

This application note describes a cost-optimized copy protection scheme that helps protect an FPGA against cloning. The design leverages an external secure serial EEPROM. The included reference design uses an optimized PicoBlaze™ 8-bit microcontroller. This application note provides a hardware design with associated PicoBlaze software code. The code loads a secret key into the secure EEPROM and authenticates the user system with the secure EEPROM.

Design File(s):

• xapp780.zip

This application note targets Spartan®-3E/3A devices in applications that require 4-bit or 5-bit receive data bus widths and operate at rates up to 666 Mbps per line with a clock at 1/7th the bit rate. This type of interface is commonly used in flat panel displays and automotive applications.

Design File(s):

• xapp485.zip

This application note targets Spartan™-3E devices in applications that require 4-bit or 5-bit transmit data bus widths and operate at rates up to 666 Mbps per line with a forwarded clock at 1/7th the bit rate. This type of interface is commonly used in flat panel displays and automotive applications.

Design File(s):

• xapp486.zip
• xapp486.zip

This application note describes the implementation of six circuits necessary to perform commonly used conversions between various chroma formats. It is accompanied by reference designs which include Generic RTL VHDL code.

Design File(s):

• xapp932.zip

This application note describes solutions to receive large-swing signals by design. In one solution (and in the general case of severe positive and/or negative overshoot), parasitic leakage current between User I/Os in differential pin pairs may occur, even though the User I/O pins are configured with single-ended I/O standards. This application note addresses parasitic leakage current behavior.

This application note discusses how to design and implement a Bus Master design using Xilinx® Endpoint PCI Express® solutions. A performance demonstration reference design using Bus Mastering is included with this application note. The reference design can be used to gauge achievable performance in various systems and act as a starting point for an application-specific Bus Master Direct Memory Access (DMA). The reference design includes all files necessary to target the Integrated Blocks for PCI Express on the Virtex®-6 and Spartan®-6 FPGAs, the Endpoint Block Plus Wrapper Core for PCI Express using the Virtex-5 FPGA Integrated Block for PCI Express, and the Endpoint PIPE for PCI Express targeting the Xilinx Spartan®-3 family of devices.

Design File(s):

• xapp1052.zip

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG400 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FG484 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A CPG132 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A PQG208 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A TGQ144 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A TQ144 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A CPQ208 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/3E/3A CP132 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan -3/-3E/-3A FGG900 (Cu Wire) Packages

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FG900 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG484 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG400 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for VQ100 package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG320 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

VQG100 - Material Declaration Data Sheet (Pb-free VQFP)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A VQ100 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A VQG100 (Cu Wire)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG320 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

FGG320 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA)

Design File(s):

• IPC-1752 Form

FG320 - Material Declaration Data Sheet (Standard Fine-Pitch BGA)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FT256 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FTG256 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG676 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FG676 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FG1156 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG1156 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FG456 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for Spartan®-3/-3E/-3A FGG456 (Cu Wire) Package

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Report summarizes the results of the reliability stress tests performed to qualify copper wire for use in wire-bonded packages.

This white paper discusses the various memory interface controller design challenges and Xilinx solutions, including how to use the Xilinx software tools and hardware-verified reference designs to build a complete memory interface solution for your own application, from low-cost DDR SDRAM applications to higher-performance interfaces like the 667Mb/s DDR2 SDRAMs.

This white paper reviews the potential inaccuracies associated with the traditional one-resistor approach to selecting heatsinks, and suggests a more accurate two-resistor (2-R) approach based on both theta-jc and theta-jb from the device datasheet.

This paper focuses on how Xilinx Platform Flash PROMs simplify FPGA configuration design for system and board designers.

The M2C-Accelerator extends the Xilinx AccelDSP™ Model-Based Design solution by converting floating-point MATLAB to fixed-point C++ for accelerated MBD verification eliminating a potential bottleneck.

AccelDSP™ Synthesis Tool with IP-Explorer technology eliminates the trial-and-error from using IP blocks by allowing the tool automatically to select from various macro-architectures.

Custom DSP algorithms are best modeled mathematically using MATLAB®, while complete systems are best modeled cycle-accurately using Simulink. The marriage of these two modeling domains provides an efficient means to design DSP systems into FPGAs.

This document provides a concise overview of the subset of the MATLAB language, including operators, as well as built-in and toolbox functions supported by AccelDSP™ Synthesis Tool for algorithmic synthesis targeting Xilinx FPGAs.

This paper discusses the overall purpose of OFFSET constraints, the specific paths that are covered by OFFSET constraints, and the differences between the OFFSET IN and OFFSET OUT constraints.

This document focuses on creating HDL code that maps efficiently onto the targeted device. The paper presents coding styles and tips to accelerate design performance. Proper FPGA coding practices are reiterated, and the lesser known techniques directly applicable to the latest Xilinx FPGA architectures are presented.

The Physical Synthesis and Optimization tools in the Xilinx ISE software have been created to reexamine the structure of your FPGA design during the packing and placement phases of implementation.

This white paper compares and contrasts FPGA and microprocessor system design and development flows with the aim of helping the designer and definer of state-of-the-art electronics systems to make a considered and well informed architecture decision.

This white paper discusses the FPD market and looks in closer detail at Plasma Display Panels and Liquid Crystal Displays in particular. An overview of where Xilinx devices fit in digital video systems is followed by a market overview of the flat panel display industry. The value proposition for Xilinx devices is presented, followed by a detailed discussion of the relationship of product features and resources to FPD system requirements.

This white paper describes a rarely noticed design technique that can make a difference in the size and the performance of your FPGA design. Control signals on FPGA flip-flops have a built-in priority. If you can learn to write code that is sympathetic to the priorities, the results will be rewarding. This white paper provides some simple VHDL and Verilog examples to explain key points.

Using Xilinx Spartan™-3E and Spartan-3A FPGAs, a National Semiconductor PHY, and a Xilinx video processing stack provides a very cost-effective and flexible approach to the challenges of multi-rate broadcast.

FPGAs can be configured with test applications during the development and production test stage. This white paper explores efficient options to help in product development and accelerate testing on the production line.

Applying a global reset to your FPGA designs is not a very good idea and should be avoided. This is a controversial issue, so this white paper looks at the reasons why such a design policy should be considered.

This white paper considers a variety of ways in which multiplexers can be implemented within Xilinx FPGA devices, including some alternative techniques that can lead to more efficient and lower cost implementations.

Operating logic at a higher rate than the processing rate allows operations to be achieved sequentially. As with a processor, logic is timeshared over multiple clock cycles. Memory holds values not being used on a given clock cycle. The FPGA can be considered to be a three-dimensional volume to be filled. "Performance + Time = Memory" is a strange formula, but when understood, it can often result in significantly lower cost implementations with Xilinx devices.

This white paper discusses signal analysis requirements and methods for printed circuit board design for Xilinx® FPGAs.

This white paper examines the causes of jitter, jitter measurement techniques, and methods of managing jitter in digital systems.

This white paper defines IBIS models and describes how to use them to model I/O characteristics for Xilinx® FPGAs.

This white paper defines the use and limitations of bit error ratio measurements when analyzing the performance of communications links.

This white paper describes design techniques that improve signal integrity in Xilinx® FPGAs.

This White Paper describes how Spartan®-3 FPGAs can reduce total system cost by up to 50% compared to competing FPGAs.

This white paper provides examples to help your understanding of the capabilities and use of the SRL16E to improve the performance and lower the cost of your designs by as much as an order of magnitude.

This white paper examines alternate uses of available block RAM in Virtex® and Spartan® FPGAs.

This white paper describes methods for expanding the natural bit-width capability of dedicated multipliers in a way that will make best use of the complete FPGA resources.

This white paper examines how to remove the DC content from a digitally sampled waveform using DSP without complicated mathematics.

This white paper describes the steps necessary to analyze your design's power requirements using the Xilinx® Power Estimator.

This notice is to communicate that Xilinx is discontinuing certain Development Systems Products.

This user guide describes the components and operation of the Spartan®-3E FPGA Starter Kit Board. The Starter Kit provides a low-cost, easy-to-use development and evaluation platform for Spartan-3E FPGA designs.

Design File(s):

• S3E_Starter_Schematic.pdf
• Reference Designs
• s3e_starter_gerbers.pdf
• S3E_SK_BOM_RevD.xls

Tutorial for CoolRunner™-II Evaluation Board.

This user guide provides basic information on the MicroBlaze™ Development Kit board capabilities, functions, and design, and general information on how to use the various peripheral functions included on the board.

Design File(s):

• Spartan-3E 1600E MicroBlaze Schematics
• S3E-1600_A_list.pdf
• S3E-1600_A.zip

User guide for getting started with the MicroBlaze™ Development Kit using the Spartan™-3E 1600E.

Design File(s):

• ug258.zip