Virtex-4 Customer Notices

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

The purpose of this notice is to communicate an increase of Shift Register delay for Virtex™-4 FX devices. This change applies to all Virtex-4 FX devices in -11 and -12 speed grades, except for FX12, and only affects designs that use the Shift Register.

This notice is to inform Virtex™-4 FX users of a revision to the PowerPC™ operating frequency for designs using the APU Controller.

A new thermal lid adhesive has been qualified for use on all flip-chip packages. The adhesion and thermal properties of the new material are comparable or better than the current thermal and lid attach adhesive.

Xilinx will be using the Stepping Methodology to enhance production offerings. The Virtex™-4 LX and SX families will be the first families to leverage the Stepping Methodology.

A package change in the XC4VLX60 FF1148 production devices.

Starting in 2005, Xilinx Corporation will begin shipping devices manufactured on a 90 nm process from Toshiba, giving Xilinx increased capacity to support Virtex-4 LX production devices.

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

The purpose of this notification is to announce qualification of new second source construction materials, and the addition of a second source supplier for Xilinx plastic flip-chip products. In addition, a mask set stepping introduction for select Virtex™-4 FX products.