Virtex-5Q

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Virtex-5Q FPGA Data Sheets

Date	Name
03/22/2010	Virtex-5Q Family Overview(PDF, ver 2.0, 405 KB ) This document describes the Defense-grade Virtex®-5Q FPGAs. It contains the feature list, device summary, packaging options, and ordering information. Was this document helpful? Yes \| No
01/17/2011	Virtex-5Q FPGA Data Sheet: DC and Switching Characteristics(PDF, ver 2.2, 2.62 MB ) This data sheet specifies the electrical characteristics of Virtex®-5Q FPGAs, including absolute maximum ratings, recommended operating conditions, supply requirements, and switching characteristics. Was this document helpful? Yes \| No

Date	Name
12/09/2010	Virtex-5 FPGA Packaging and Pinout Specification(PDF, ver 4.8, 14.18 MB ) This user guide provides Virtex®-5 device pinouts, package specifications, pinout diagrams, PCB design rules, and thermal data. Was this document helpful? Yes \| No
01/17/2012	Virtex-5QV FPGA Packaging and Pinout Specification(PDF, ver 1.3, 2.64 MB ) This document provides complete packaging information for the radiation-hardened Virtex®-5QV FPGA in a 1.00 mm pitch ceramic flip-chip column grid array CF1752 package. The package is optimally designed for improved thermal cycle reliability. Was this document helpful? Yes \| No

Date	Name
05/26/2009	EF1153 - Package Drawing (1153 Ball Flip-Chip BGA)(PDF, ver 1.0, 129 KB ) Was this document helpful? Yes \| No
03/24/2008	FF323/FFG323 - Package Drawing (Standard BGA Flip-Chip)(PDF, ver 1.1, 75 KB ) Was this document helpful? Yes \| No
12/12/2007	FF323 - Material Declaration Data Sheet (Standard BGA Flip-Chip)(PDF, ver 1.0, 63 KB ) Design File(s): IPC-1752 Form Was this document helpful? Yes \| No
05/26/2009	EF1136 - Package Drawing (1136 Ball Flip-Chip BGA)(PDF, ver 1.0, 128 KB ) Was this document helpful? Yes \| No
05/26/2009	EF676 - Package Drawing (676 Ball Flip-Chip BGA)(PDF, ver 1.0, 129 KB ) Was this document helpful? Yes \| No
08/05/2009	EF665 - Package Drawing (665 Ball Flip-Chip BGA)(PDF, ver 1.1, 131 KB ) Was this document helpful? Yes \| No
10/11/2010	EF1738 - Package Drawing (1738 Ball Flip-Chip BGA)(PDF, ver 1.1, 142 KB ) Was this document helpful? Yes \| No