Virtex-E

Provides the architectural description of the Virtex-E 1.8V FPGA.

Provides the architectural description of the Virtex-E 1.8V FPGA.

All package files are ASCII files in zip format.

Summary of the reliability test data and results for Xilinx devices updated four times per year.

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

Xilinx is adding shipping trays produced by Kostat, Inc. for the new CS144/CSG144 and CS280/CSG280 Laminate packages.

A package substrate change for Chip Scale (Tape) and lead-free Chip Scale (Tape).

Design File(s):

• Qualification Report for XCN05018

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

Design File(s):

• Qualification Report for XCN05011

Initial Release of PDN2003-08 to discontinue the XCV2600E and XCV3200E

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products.

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products.

To communicate the addition of new supply sources for wire bond BGA package core and prepreg material for Spartan®/-XL/-II/-IIE/-3/-3E/-3A/-3AN/-3ADSP/-6, XC95XXX, XC95XXXXL, Virtex®, Virtex®-E, Virtex®-II/-ll Pro, and CoolRunner™ and CoolRunner™-II product.

To communicate that the Xilinx discontinuation of certain Virtex® (Virtex-E, Virtex-EM, Virtex-II and EasyPath™ Virtex-II families) and Spartan® (Spartan-IIE family) FPGA products has been retracted due to a two year extension of production capability.

Ground bounce must be controlled to ensure proper operation of high performance FPGA devices. Particular attention must be applied to minimizing board-level inductance during PCB layout. This document describes calculations that help to ensure that a design meets input undershoot and logic-low voltage requirements for devices receiving signals from an FPGA.

Design File(s):

• xapp689.zip

This application note discusses the configuration and programming options for Xilinx Complex Programmable Logic Device (CPLD), Field Programmable Gate Array (FPGA), and PROM families and demonstrates some of the most popular configuration methods used for each family. This document includes configuration quick start guidelines for the Virtex™, Spartan™, XPLA3, XC9500, and XC18V00 families.

XAPP482 describes a working MicroBlaze™ system that stores software code, user data, and configuration data in non-volatile Platform Flash PROMs, simplifying system design and reducing cost. It provides a portable hardware design, software design, and additional script utilities to be used during the implementation flow.

Design File(s):

• xapp482.zip
• xapp482.zip

This application note describes techniques for remote reconfiguration of FPGAs through an Ethernet port.

Design File(s):

• xapp441_designfiles.zip
• xapp441_designfiles.zip

This application note describes difference-based partial reconfiguration. This type of reconfiguration is used when making small changes to design parameters including logic equations, filter parameters, and I/O standards.

When designing digital systems, there is often a requirement to synchronize incoming data and clock signals with an internal system clock, i.e., the internal and external clock are at exactly the same frequency, but due to variable backplane, board, or application-specific standard product (ASSP) delays, the phase relationship is not known. The circuit described in this application note addresses this issue for both single traces and data buses up to 210 MHz in a Virtex®-II -5 device. The speed limitation is imposed by the maximum frequency that can be accepted by the Digital Clock Manager (DCM), in a mode where it is capable of providing both a new clock and a new clock shifted by 90 degrees.

Design File(s):

• xapp225.zip

Data recovery is a mechanism that allows a receiver to extract embedded clock data from an incoming data stream. The receiver usually extracts this information from the data stream concerned, but sometimes the receiver’s clock is used for data transmission. The circuit described in this application note provides a partial solution at data rates up to 160 Mb/s in a Virtex™-E -7 device, a Spartan™-IIE -6 device, or a Spartan-3 -4 device, and up to 420Mb/s in a Virtex-II -5 device or a Virtex-II Pro™ -6 device. The solution is partial in the sense that no clock is actually recovered, but the data arriving is fully extracted. The speed is limited by the maximum frequency that can be accepted by the Delay Locked Loop (DLL), in a mode where the DLL is capable of providing both a new clock, and another clock shifted by 90 degrees.

Design File(s):

• xapp224.zip
• xapp224.zip

This application note describes highly optimized UART transmitter and receiver macros for Xilinx Virtex®, Virtex-E, and Spartan®-II devices. The UART_TX and UART_RX macros are fully compatible with the standard Universal Asynchronous Receiver Transmitter (UART) communication protocols used for connecting to devices, such as PCs or microcontrollers.

Design File(s):

• xapp223.zip

Power consumption in Xilinx FPGAs depends upon the number of internal logic transitions and is proportional to the operating clock frequency. As device size increases, so does power consumption. Without an accurate thermal analysis, the heat generated could easily exceed the maximum allowable junction temperature. Power supply requirements, including initial conditions, transient behavior, turn-on, and turn-off are also important. Bypassing or decoupling the power supplies at the device, in the context of the device’s application, requires careful attention. All these aspects of the power supply must be considered to achieve successful designs.

Most Xilinx CPLDs, PROMs, and FPGAs have an IEEE Standard 1149.1 (JTAG) port. Xilinx devices with a JTAG port are in-system programmable (ISP) through the JTAG port. The ISP feature is beneficial for fast prototype development. This application note describes a short list of considerations needed to get the best performance from your ISP designs.

The Xilinx high-performance CPLD, FPGA, and configuration PROM families provide in-system programmability, reliable pin locking, and JTAG boundary-scan test capability. This powerful combination of features allows designers to make significant changes and still keep the original device pin-outs, which eliminates the need to re-tool PC boards.

Design File(s):

• xapp058.zip

This application note describes how the existing dual-port block memories in the Spartan®-II and Virtex® families can be used as Quad-Port memories. This essentially involves a data access time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the block memory in terms of bits per second will remain the same.

Design File(s):

• xapp228.zip

In embedded systems, designers can reduce component count and increase flexibility by using a microprocessor to configure an FPGA. C code illustrates the use of either Slave Serial or SelectMAP mode. CPLD design files illustrate a synchronous interface between processor and FPGA.

Design File(s):

• xapp502.zip

Flexible CAMs (Content Addressable Memory) are implemented in Virtex™ devices by taking advantage of the reprogrammability of the basic LUT as a Shift Register or a SelectRAM™ memory and the fast carry logic chain. Although CAMs are also feasible in Spartan™ and XC4000X™ devices, this application note concentrates on Virtex devices.

This application note describes the implementation of R’G’B’ Color Space to Y’CbCr Color Space conversion necessary in many video designs. The tick marks on red, green, blue, and Luma, assume the components are in the gamma-corrected space. No gamma correction is applied to color difference signals Cr and Cb. This product is not recommended for new designs.

Design File(s):

• xapp637.zip

MicroBlaze™ has the ability to use its dedicated FSL bus interface to integrate a customized IP core into a MicroBlaze soft processor-based system. This document describes possible methods to include customized IP cores into an SCP-based design. This product is not recommended for new designs.

Design File(s):

• xapp529_6_1.zip
• xapp529_6_2.zip

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Package Drawing.

BG560 - Material Declaration Data Sheet (Standard Metal BGA)

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

This paper discusses the overall purpose of OFFSET constraints, the specific paths that are covered by OFFSET constraints, and the differences between the OFFSET IN and OFFSET OUT constraints.

Surface Mount Technology (SMT) packages include the leaded family packages (Quad Flat Pack (QFP) and Plastic Leaded Chip Carrier (PLCC)) and the Ball Grid Array (BGA) packages. SMT rework can be necessary for any of the following reasons: assembly related defects, such as shorts, opens, wrong orientation, and solder ball defects; device/package related defects/failure analysis; and engineering change or system upgrade.

This white paper describes a rarely noticed design technique that can make a difference in the size and the performance of your FPGA design. Control signals on FPGA flip-flops have a built-in priority. If you can learn to write code that is sympathetic to the priorities, the results will be rewarding. This white paper provides some simple VHDL and Verilog examples to explain key points.

The Xilinx Prototype board allows experimentation with Virtex™ devices prior to committing to using them for specific applications. It allows designers to try Virtex features such as block RAM, DLLs, and the SelectI/O resource, with an off-the-shelf resource. The Xilinx Prototype board also facilitates learning the entire design flow from schematic capture or HDL to programming and verification of designs.