XC3000

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

Design File(s):

• Qualification Report for XCN05011

Xilinx is discontinuing certain members of the XC3100A product family.

Xilinx is discontinuing certain members of the XC3000A product family.

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families.

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products.

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

This application note covers several related subjects: How does a Xilinx FPGA power up, and how does it react to power supply glitches? What can be done to maintain configuration during loss of primary power? What can be done to secure a design against illegal reverse engineering?

Xilinx FPGAs can be configured in a common daisy chain structure, where the lead device generates CCLK pulses and feeds serial configuration information into the next downstream device, which in turn feeds data into the next downstream device, etc. There is no limit to the number of devices in a daisy chain, and XC3000™, XC4000™, Spartan™, and XC5200™-series devices can be mixed freely with only one constraint: the lead device must be a member of the highest order family used in the chain.

These guidelines describe the configuration process for all members of the XC3000™, XC4000™, XC5200™, and Spartan™ FPGA devices and their derivatives. The average user need not understand or remember all these details, but should refer to the debugging hints when problems occur.

This application note contains additional information for designing with the XC3000™ series of FPGA devices. This information supplements the data sheets, and is provided for guidance only.

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

Design File(s):

• IPC-1752 Form

100% Material Data Declaration Sheet (Pb-free PLCC)

Design File(s):

• IPC-1752 Form

100% Material Declaration Data Sheet for VQ64 package

Design File(s):

• IPC-1752 Form

VQG64 - Material Declaration Data Sheet (Pb-free VQFP)

Design File(s):

• IPC-1752 Form

VQG100 - Material Declaration Data Sheet (Pb-free VQFP)

Design File(s):

• IPC-1752 Form