 XCU019702 - Improving the Cost of Performance: XC3000 and XC3100A (PDF)
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1.0 |
43 KB |
01/30/1997 |
XCU019701 - Discontinuance of Low Volume XC3X00 Packages (PDF)
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|
1.0 |
38 KB |
01/30/1997 |
XCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)
 View Document Details
Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product. Was this document helpful? Yes | No
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1.0 |
164 KB |
07/16/2007 |
XCN07010 - Product Discontinuance Update (PDF)
View Document Details This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx. Was this document helpful? Yes | No
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1.0 |
50 KB |
05/14/2007 |
XCN05020 - Discontinue Low-Volume Members of the XC4000XL, XC4000E, XC9500XV, and XC3100A Families (PDF)
View Document Details Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families. Was this document helpful? Yes | No
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1.1 |
143 KB |
03/10/2006 |
XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion (PDF)
View Document Details This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.
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2.0 |
60 KB |
08/07/2006 |
PDN99007A - Withdrawal of certain commercial low-volume device/package combinations (PDF)
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1.0 |
38 KB |
01/30/2000 |
PDN99007 - Withdrawal of certain commercial low-volume device/package combinations (PDF)
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|
1.0 |
37 KB |
10/15/1999 |
PDN99005 - Discontinue certain technology versions (0.8u) of the XC3000, XC3000A, XC3100A (PDF)
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|
1.0 |
20 KB |
07/15/1999 |
PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families (PDF)
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1.0 |
24 KB |
07/01/1999 |
PDN99001 - Discontinue certain speed grades of the XC3000 & XC4000 SMD & M-Grade (PDF)
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1.0 |
49 KB |
01/15/1999 |
PDN98005 - Discontinuation of the XC3100A M-grade and B-grade (SMD) Products (PDF)
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1.0 |
18 KB |
06/26/1998 |
PDN97006 - Withdrawal of certain specific low volume device/package combinations (correction) (PDF)
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|
1.0 |
23 KB |
02/10/1998 |
PDN97005 - Withdrawal of certain specific low volume device/package combinations (PDF)
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|
1.0 |
18 KB |
01/30/1997 |
PDN97004 - Withdrawal of Commercial and Industrial XC3100A-5 Speed Grades, all packages (PDF)
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|
1.0 |
18 KB |
01/30/1997 |
PDN97003 - Withdrawal of Commercial and Industrial XC3000-70 Speed Grades, all packages (PDF)
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|
1.0 |
19 KB |
01/30/1997 |
PDN2004-20 - Discontinue Low-Volume Members of the XC3100A Product Family (PDF)
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1.0 |
62 KB |
08/23/2004 |
PDN2004-19 - Discontinue Low-Volume Members of the XC3000A Product Family (PDF)
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1.0 |
40 KB |
08/23/2004 |
Xilinx PDN2003-03 to discontinue XC3000 and XC3000L products (C-Grade & I-Grade) (PDF)
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|
1.2 |
53 KB |
02/12/2003 |
PDN2003-01 - XC3020A, XC3042A, XC3090A Military Temperature Grade (PDF)
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|
1.0 |
20 KB |
01/17/2003 |
PCN98008 - Discontinue XC3000/XC3000A product manufactured at Yamaha (PDF)
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|
1.0 |
20 KB |
08/30/1998 |
PCN98007 - A change in the mold compound and die attach epoxy for Xilinx PLCC and QFP packages (PDF)
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|
1.0 |
20 KB |
08/10/1998 |
PCN98007 Data - Package Qualification Testing Data for Mold Compound MP8000 (PDF)
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|
1.0 |
18 KB |
08/10/1998 |
PCN98002A - Qualification of SPIL of Taiwan as an alternate Assembly Subcontractor (PDF)
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|
1.0 |
24 KB |
06/30/1998 |
PCN97002 - Additional Product Assembly Qualification of A.S.E. Taiwan (PDF)
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|
1.0 |
24 KB |
02/15/1997 |
PCN97002 Data - Qualification of ASE for BGA Packages (PDF)
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|
1.0 |
12 KB |
02/15/1997 |
PCN97001 - Qualification of ASTRA Microtronics Technology in Batam, Indonesia (PDF)
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|
1.0 |
24 KB |
02/28/1997 |
PCN97001 Data - Qualification Test Data (PDF)
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|
1.0 |
10 KB |
02/28/1997 |
PCN96003 - Obsolescence of Commercial and Military CQFP-100 ceramic packages (PDF)
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|
1.0 |
19 KB |
05/03/1996 |
PCN96001 - A change in the Xilinx XC3100 fabrication process (PDF)
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|
1.0 |
21 KB |
04/19/1996 |
PCN95013 - A minor change in the part marking methodology utilized for Xilinx Products (PDF)
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|
1.0 |
24 KB |
12/26/1995 |
PCN95009 - Qualification of the Advanced Semiconductor Engineering, (PDF)
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|
1.0 |
17 KB |
12/11/1995 |
PCN95008 - Qualification of AAPI-1 Assembly Facility (PDF)
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|
1.0 |
17 KB |
12/11/1995 |
PCN95007 - Qualification of Integrated Packaging Assembly Corporation (PDF)
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|
1.0 |
17 KB |
12/11/1995 |
PCN95006 - A minor change to the electrical specifications of some Xilinx Ceramic Packaged Devices (PDF)
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|
1.0 |
14 KB |
08/22/1995 |
PCN95002B - An evolutionary change in the Xilinx wafer fabrication process (PDF)
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|
1.0 |
18 KB |
06/18/1995 |
PCN95002A - An evolutionary change in the Xilinx wafer fabrication process (PDF)
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|
1.0 |
17 KB |
08/11/1995 |
PCN95002 - An evolutionary change in the Xilinx XC4000 fabrication process (PDF)
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|
1.0 |
18 KB |
04/06/1995 |
PCN2004-28 - Humidity Indicator Card (HIC) Change (PDF)
View Document Details Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033. Was this document helpful? Yes | No
|
1.0 |
161 KB |
12/06/2004 |
PCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material) (PDF)
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|
1.1 |
72 KB |
12/06/2004 |
PCN2002-08 - Change in shipping trays for CB packages (PDF)
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|
1.0 |
39 KB |
06/11/2002 |
PCN2000-06 - Minor Modification in Thermally Enhanced BG and FG Package Outline Specifications (PDF)
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|
1.0.1 |
41 KB |
03/13/2007 |
Advisory 2003-02 - Change in BGA Shipping Trays (PDF)
View Document Details Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both
Daewon and Kostat. Was this document helpful? Yes | No
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1.0 |
43 KB |
08/19/2003 |
