XC4000

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XC4000 Data Sheets

NameDoc VersionSizeDate
PDFXC4000XLA FPGAs Pinout Tables (PDF)
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1.4 228 KB 06/01/2001
PDFXC4000XLA FPGAs Description (PDF)
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1.3 136 KB 10/18/1999
PDFXC4000XLA FPGAs Electrical Characteristics (PDF)
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1.3 72 KB 10/01/1999
PDFXC4000E/XL FPGAs Description (PDF)

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1.6 476 KB 05/14/1999
PDFXC4000E FPGAs Electrical Characteristics (PDF)
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1.8 76 KB 02/11/2000
PDFXC4000XL FPGAs Electrical Characteristics (PDF)
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1.8 72 KB 10/18/1999
PDFXC4000E/XL FPGAs Pinout Tables (PDF)
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1.7 216 KB 10/01/1999
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XC4000 User Guides

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XC4000 Errata

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XC4000 Customer Notices

NameDoc VersionSizeDate
PDFXCU099602 - XC4000 Dual Layer Metal (DLM) to Triple Layer Metal (TLM) Design Considerations (PDF)
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1.0 18 KB 09/27/1996
PDFXCU099601 - Readback Specification Estabilished on XC4000/D/E (PDF)
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1.0 13 KB 09/15/1996
PDFXCU019901 - Decision Not To Manufacture the XC4028XLA and the XC4036XLA in the HQ304 Package (PDF)
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1.0 15 KB 01/15/1999
PDFXCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)

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1.0 164 KB 07/16/2007
PDFXCN07010 - Product Discontinuance Update (PDF)

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1.0 50 KB 05/14/2007
PDFXCN07003 - Discontinuation of Low-Volume HQ Packages in the XC4000E, XC4000XL, XC4000XLA Product Fam (PDF)

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1.0 34 KB 02/19/2007
PDFXCN05020 - Discontinue Low-Volume Members of the XC4000XL, XC4000E, XC9500XV, and XC3100A Families (PDF)

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1.1 143 KB 03/10/2006
PDFXCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion (PDF)

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Design Files: Qualification Report for XCN05011
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2.0 60 KB 08/07/2006
PDFPDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families (PDF)
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1.0 24 KB 07/01/1999
PDFXC4000 devices available after PDN99003 (PDF)
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1.0 37 KB 04/19/1999
PDFPDN99003 - Discontinue certain members of the XC4000 commercial & industrial product line (PDF)
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1.0 44 KB 04/19/1999
PDFPDN99003 Data - XC4000 Devices which are NOT affected by PDN99003 (PDF)
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1.0 29 KB 04/19/1999
PDFPDN99001 - Discontinue certain speed grades of the XC3000 & XC4000 SMD & M-Grade (PDF)
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1.0 49 KB 01/15/1999
PDFPDN98006 - Discontinuation of the XC4003A M-grade and B-grade (SMD) Products (PDF)
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1.0 18 KB 06/26/1998
PDFPDN98001 - Discontinuation of the MQFP package option in some XC4000 products (PDF)
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1.0 21 KB 06/15/1998
PDFPDN2004-21 - Discontinue Low-Volume Members of the XC4000XL, XC4000XLA, and XC4000E Product Families (PDF)
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1.1 245 KB 11/15/2004
PDFSupplemental List for PDN2002-03 (PDF)
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1.0 611 KB 04/01/2002
PDFPDN2002-03 - Discontinue certain members of the XC4000, XC4000E, and XC4000L families (PDF)
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1.1 76 KB 04/01/2002
PDFPDN2002-02 - Discontinuation of the XC4000XLT family (PDF)
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1.0 24 KB 01/15/2002
PDFPDN2002-01 - Discontinuation of the XC4000EX and XC4000XV families (PDF)

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1.0 32 KB 01/15/2002
PDFPDN2001-03 - Withdrawal of certain commercial low volume device-speed combinations (XC4000XL) (PDF)
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1.0 20 KB 01/15/2001
PDFPDN2001-02 - Withdrawal of certain commercial low volume device-package combinations (XC4000XL/XV) (PDF)
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1.0 136 KB 01/15/2001
PDFPDN00001 - Low volume commercial device/package combinations (PDF)
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1.0 28 KB 01/15/2000
PDFPCN99002 - Qualification Data for PCN99002 (wafer fabrication process change for XC4000XL) (PDF)
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1.0 50 KB 05/24/1999
PDFPCN99002: A change in the wafer fabrication process used to fabricate the XC4000XL (C & I Grade) (PDF)
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1.0 25 KB 05/24/1999
PDFPCN98007 - A change in the mold compound and die attach epoxy for Xilinx PLCC and QFP packages (PDF)
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1.0 20 KB 08/10/1998
PDFPCN98007 Data - Package Qualification Testing Data for Mold Compound MP8000 (PDF)
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1.0 18 KB 08/10/1998
PDFPCN98002A - Qualification of SPIL of Taiwan as an alternate Assembly Subcontractor (PDF)
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1.0 24 KB 06/30/1998
PDFPCN98002 - Qualification of SPIL of Taiwan as an alternate Assembly Subcontractor (PDF)
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1.0 24 KB 05/18/1998
PDFPCN98002 Data - Qualification Test Data for PCN98002 (SPIL Assembly) (PDF)
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1.0 24 KB 05/18/1998
PDFPCN97009A - A reissue of a minor enhancement to the Xilinx line of thermally enhanced quad flatpack (PDF)
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1.0 19 KB 10/29/1997
PDFPCN97009A Data(2) - Reliability Testing of the HQ240 Package (Insulated Heatsink) (PDF)
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1.0 13 KB 10/29/1997
PDFPCN97009A Data - Thermal Data for Thermally Enhanced Plastic Quad Flat Pack (PQFP) (PDF)
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1.0 13 KB 10/29/1997
PDFPCN97007 - Conversion of Xilinx MIL-STD-883 Military Products to QML (PDF)
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1.0 25 KB 04/15/1997
PDFPCN97007 Data - Cross Reference Listing (PDF)
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1.0 31 KB 04/15/1997
PDFPCN97002 - Additional Product Assembly Qualification of A.S.E. Taiwan (PDF)
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1.0 24 KB 02/15/1997
PDFPCN97002 Data - Qualification of ASE for BGA Packages (PDF)
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1.0 12 KB 02/15/1997
PDFPCN97001 - Qualification of ASTRA Microtronics Technology in Batam, Indonesia (PDF)
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1.0 24 KB 02/28/1997
PDFPCN97001 Data - Qualification Test Data (PDF)
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1.0 10 KB 02/28/1997
PDFPCN96009 - Discontinuation of the XC4000A and XC4000H Product Families (PDF)
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1.0 21 KB 10/01/1996
PDFPCN96008 - An evolutionary change in the Xilinx XC4000/D fabrication process (PDF)
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1.0 21 KB 10/01/1996
PDFPCN96004 - A New Wafer Foundry Partner United Microelectronics Corporation (UMC) (PDF)
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1.0 19 KB 05/15/1996
PDFPCN95013 - A minor change in the part marking methodology utilized for Xilinx Products (PDF)
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1.0 24 KB 12/26/1995
PDFPCN95002B - An evolutionary change in the Xilinx wafer fabrication process (PDF)
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1.0 18 KB 06/18/1995
PDFPCN95002A - An evolutionary change in the Xilinx wafer fabrication process (PDF)
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1.0 17 KB 08/11/1995
PDFPCN95002 - An evolutionary change in the Xilinx XC4000 fabrication process (PDF)
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1.0 18 KB 04/06/1995
PDFPCN2004-28 - Humidity Indicator Card (HIC) Change (PDF)

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1.0 161 KB 12/06/2004
PDFPCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material) (PDF)
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1.1 72 KB 12/06/2004
PDFPCN2002-08 - Change in shipping trays for CB packages (PDF)
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1.0 39 KB 06/11/2002
PDFPCN2000-06 - Minor Modification in Thermally Enhanced BG and FG Package Outline Specifications (PDF)
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1.0.1 41 KB 03/13/2007
PDFPCN1996-08 Data - Device Qualification Data (PDF)
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1.0 21 KB 10/01/1996
PDFPCN00003 - A Change in the die-attach material for all thermally enhanced BGA packages (PDF)
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1.0 20 KB 08/03/2000
PDFAdvisory 2003-02 - Change in BGA Shipping Trays (PDF)

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1.0 43 KB 08/19/2003
PDFXCN06002 - Discontinuation of Certain Military and Radiation-Tolerant Devices (PDF)

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1.0 52 KB 01/30/2006
PDFXCN07022 - Product Discontinuation Notice (PDF)

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1.0.2 75 KB 07/28/2008
PDFPCN95006 - A minor change to the electrical specifications of some Xilinx Ceramic Packaged Devices (PDF)
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1.0 14 KB 08/22/1995
PDFPCN95007 - Qualification of Integrated Packaging Assembly Corporation (PDF)
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1.0 17 KB 12/11/1995
PDFPCN95008 - Qualification of AAPI-1 Assembly Facility (PDF)
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1.0 17 KB 12/11/1995
PDFPCN95009 - Qualification of the Advanced Semiconductor Engineering, (PDF)
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1.0 17 KB 12/11/1995
PDFXCN09001 - Product Discontinuation Notice (PDF)

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1.2 63 KB 06/15/2009
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XC4000 Application Notes

NameDoc VersionSizeDate
PDFXAPP165 - Using Xilinx and Exemplar for Incremental Designing (ECO) (PDF)

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Design Files: xapp165.zip
xapp165.tar.z
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1.0 79 KB 08/09/1999
PDFXAPP164 - Using Xilinx and Synplify for Incremental Designing (ECO) (PDF)

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Design Files: xapp164.zip
xapp164.tar.z
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1.0 52 KB 08/06/1999
PDFXAPP150 - I/V Curves for Various Device Families (PDF)

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1.1 138 KB 05/15/2001
PDFXAPP107 - Synopsys/Xilinx High Density Design Methodology Using FPGA Compiler (PDF)

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1.0 250 KB 08/06/1998
PDFXAPP092 - Configuration Issues: Power-up, Volatility, Security, Battery Back-up (PDF)

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1.1 31 KB 11/24/1997
PDFXAPP091 - Configuring Mixed FPGA Daisy Chains (PDF)

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1.0 26 KB 11/24/1997
PDFXAPP090 - FPGA Configuration Guidelines (PDF)

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1.1 58 KB 11/24/1997
PDFXAPP088 - I/O Characteristics of XL FPGAs (PDF)

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1.0 30 KB 11/24/1997
PDFXAPP052 - Efficient Shift Registers, LFSR Counters, and Long Pseudo-Random Sequence Generators (PDF)

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1.1 101 KB 07/07/1996
PDFXAPP051 - Synchronous and Asynchronous FIFO Designs (PDF)

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2.0 106 KB 09/17/1996
PDFXAPP045 - XC4000 Series Technical Information (PDF)

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1.1 30 KB 11/24/1997
PDFXAPP017 - Boundary Scan in XC4000/XC5200 Device (PDF)

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3.0 214 KB 11/16/1999
PDFXAPP015 - Using the XC4000 Readback Capability (PDF)

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1.0 58 KB 11/01/1995
PDFXAPP058 - Xilinx In-System Programming Using an Embedded Microcontroller (PDF)

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Design Files: xapp058.zip
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4.1 641 KB 03/06/2009
PDFXAPP123 - Using 3-State Enable Registers in XLA, XV, and Spartan-XL FPGAs  (PDF)

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Design Files: xapp123_make_macro.zip
xapp123_make_macro.tar.z
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2.0 171 KB 01/16/2002
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XC4000 Package Specifications

NameDoc VersionSizeDate
PDFBGG432 - Material Declaration Data Sheet (Pb-free Metal BGA Cavity Down) (PDF)
Design Files: IPC-1752 Form
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1.0.1 87 KB 01/08/2007
PDFBG432 - Material Declaration Data Sheet (Standard Metal BGA Cavity Down) (PDF)
Design Files: IPC-1752 Form
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1.0.1 81 KB 01/08/2007
PDFBGG352 - Material Declaration Data Sheet (Pb-free Metal BGA Cavity Down) (PDF)
Design Files: IPC-1752 Form
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1.0.1 83 KB 01/08/2007
PDFBG352 - Material Declaration Data Sheet (Standard Metal BGA Cavity Down) (PDF)
Design Files: IPC-1752 Form
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1.0.1 81 KB 01/08/2007
PDFVQ100 - Material Declaration Data Sheet (Standard VQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 10/05/2006
PDFTQ176 - Material Declaration Data Sheet (Standard TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 78 KB 10/05/2006
PDFTQ144 - Material Declaration Data Sheet (Standard TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 10/03/2006
PDFPQ240 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 84 KB 10/19/2006
PDFPQ208 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 109 KB 10/19/2006
PDFPQ160 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 81 KB 10/19/2006
PDFPQ100 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.3.1 82 KB 10/19/2006
PDFHQ240 - Material Declaration Data Sheet (Standard Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 82 KB 10/03/2006
PDFHQ208 - Material Declaration Data Sheet (Standard Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 85 KB 10/03/2006
PDFPC84 - Material Declaration Data Sheet (Standard PLCC) (PDF)
Design Files: IPC-1752 Form
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1.2 87 KB 10/05/2006
PDFVQ100/VQG100 - Package Drawing (VQFP) (PDF)
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1.2.1 99 KB 02/26/2007
PDFTQ176/TQG176 - Package Drawing (TQFP) (PDF)
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1.2 148 KB 06/18/2004
PDFPQ240/PQG240 - Package Drawing (PQFP) (PDF)
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1.2 154 KB 06/18/2004
PDFPQ208/PQG208 - Package Drawing (PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFPQ160/PQG160 - Package Drawing (PQFP) (PDF)
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1.2 154 KB 06/18/2004
PDFPQ100 - Package Drawing (Standard PQFP) (PDF)
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1.2 73 KB 10/17/2002
PDFBGG560 - Material Declaration Data Sheet (Pb-Free Metal BGA) (PDF)
Design Files: IPC-1752 Form
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1.0 86 KB 02/20/2007
PDFHQ304 - Material Declaration Data Sheet (Standard Heat Sink QFP) (PDF)
Design Files: IPC-1752 Form
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1.0 81 KB 10/18/2006
PDFBG560 - Material Declaration Data Sheet (Standard Metal BGA) (PDF)
Design Files: IPC-1752 Form
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1.2.1 95 KB 01/08/2007
PDFBG225 - Material Declaration Data Sheet (Standard Plastic BGA) (PDF)
Design Files: IPC-1752 Form
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1.2.1 72 KB 01/08/2007
PDFVQG100 - Material Declaration Data Sheet (Pb-free VQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 80 KB 09/29/2006
PDFTQG176 - Material Declaration Data Sheet (Pb-free TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 76 KB 09/28/2006
PDFPQG240 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 83 KB 10/19/2006
PDFPQG208 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 80 KB 10/19/2006
PDFPQG160 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 81 KB 10/19/2006
PDFPQG100 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.3.1 81 KB 10/19/2006
PDFHQG240 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 09/28/2006
PDFHQG208 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 83 KB 09/28/2006
PDFPCG84 - Material Declaration Data Sheet (Pb-free PLCC) (PDF)
Design Files: IPC-1752 Form
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1.2 88 KB 09/28/2006
PDFHT176/HTG176 - Package Drawing (Heat Sink TQFP) (PDF)
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1.2 148 KB 06/18/2004
PDFHT144/HTG144 - Package Drawing (Heat Sink TQFP) (PDF)
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1.2 148 KB 06/18/2004
PDFHQ304 - Package Drawing (Standard Heat Sink QFP) (PDF)
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1.1 66 KB 10/17/2002
PDFHQ240/HQG240 - Package Drawing (Heat Sink PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFHQ208/HQG208 - Package Drawing (Heat Sink PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFHQ160/HQG160 - Package Drawing (Heat Sink PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFPG559 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.1 130 KB 04/06/2001
PDFPG475 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.1 117 KB 04/06/2001
PDFPG411 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.1 63 KB 04/06/2001
PDFPG299 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.0 116 KB 06/01/2000
PDFPG223 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.0 104 KB 06/01/2000
PDFPG191 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.1 47 KB 04/06/2001
PDFPG156 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.1 47 KB 04/06/2001
PDFPG120 - Package Drawing (Standard Ceramic PGA) (PDF)
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1.1 47 KB 04/06/2001
PDFPC84/PCG84 - Package Drawing (PLCC) (PDF)
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1.2 91 KB 06/18/2004
PDFBG560 - Package Drawing (Standard Metal BGA) (PDF)
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1.1 54 KB 04/06/2001
PDFBG432 - Package Drawing (Standard Metal BGA Cavity Down) (PDF)
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1.1 54 KB 04/06/2001
PDFBG352 - Package Drawing (Standard Metal BGA Cavity Down) (PDF)
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1.1 50 KB 04/06/2001
PDFBG225 - Package Drawing (Standard Plastic BGA) (PDF)
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1.1 32 KB 04/06/2001
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XC4000 Characterization Reports

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XC4000 White Papers

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XC4000 Board and Kit Documentation

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