XC4000

Features, Introduction, Detailed Functional Description, Pin Descriptions, Configuration, Configuration Timing

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

Xilinx is discontinuing certain low-volume HQ package products in the XC4000E, XC4000XL, and XC4000XLA product families. All speed grades and temperature grades of these product offerings are affected, including Xilinx Military.

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

Design File(s):

• Qualification Report for XCN05011

Discontinuance of all device/speed/package combinations of commercial and inductrial XC4000EXTM and XC4000XVTM product families.

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

Xilinx is discontinuing certain low-demand military and radiation-tolerant products.

Xilinx is discontinuing certain Spartan®, XC4000XL, CoolRunner™, and Programming Solution products.

Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families.

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products.

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products.

To communicate that Xilinx is discontinuing all remaining members in some mature product families including: XC4000E and XC4000XLA family FPGAs; and XC1700L, XC17S00, and XC17S00XL family PROM products. Xilinx is also extending Final order and Final delivery dates for the XC1700E and XC1700EL family PROM products.

To communicate the addition of new supply sources for wire bond BGA package core and prepreg material for Spartan®/-XL/-II/-IIE/-3/-3E/-3A/-3AN/-3ADSP/-6, XC95XXX, XC95XXXXL, Virtex®, Virtex®-E, Virtex®-II/-ll Pro, and CoolRunner™ and CoolRunner™-II product.

Guided place-and-route (PAR) can help you reduce runtimes when incremental changes are made to a design, such as for an Engineering Change Order (ECO). By making only small changes to a design along with optimizing only the changed block or blocks, you allow guided PAR to perform at its best, preserving timing and reducing PAR runtimes. To localize the design changes without affecting the remainder of your design, either a top-down preserving hierarchy or a bottom-up methodology must be used.

Design File(s):

• xapp165.zip
• xapp165.tar.z

Guided place-and-route (PAR) can help you reduce runtimes when incremental changes are made to a design, such as for an Engineering Change Order (ECO). By making only small changes to a design along with optimizing only the changed block(s), you allow guided PAR to perform at its best, preserving timing and reducing PAR runtimes. To localize the design changes without affecting the remainder of your design, either a top-down preserving hierarchy or a bottom-up methodology must be used.

Design File(s):

• xapp164.zip
• xapp164.tar.z

These typical curves describe the output sink and source current for average processing, nominal supply voltage and room temperature. (For Virtex™ FPGAs, see XAPP135.) For additional data, see the Xilinx™ IBIS files.

This paper describes design practices to synthesize high density designs (i.e., over 100,000 gates), composed of large functional blocks, for today's larger Xilinx FPGA devices using the Synopsys FPGA Compiler. The Synopsys FPGA Compiler version 1998.02, Alliance Series 1.5, and the XC4000X family were used in preparing the material for this application note.

This application note covers several related subjects: How does a Xilinx FPGA power up, and how does it react to power supply glitches? What can be done to maintain configuration during loss of primary power? What can be done to secure a design against illegal reverse engineering?

Xilinx FPGAs can be configured in a common daisy chain structure, where the lead device generates CCLK pulses and feeds serial configuration information into the next downstream device, which in turn feeds data into the next downstream device, etc. There is no limit to the number of devices in a daisy chain, and XC3000™, XC4000™, Spartan™, and XC5200™-series devices can be mixed freely with only one constraint: the lead device must be a member of the highest order family used in the chain.

These guidelines describe the configuration process for all members of the XC3000™, XC4000™, XC5200™, and Spartan™ FPGA devices and their derivatives. The average user need not understand or remember all these details, but should refer to the debugging hints when problems occur.

Data sheets describe I/O parameters in digital terms, providing tested and guaranteed worst-case values. This application note describes XC4000XL/XLA and Spartan™-XL I/O parameters in analog terms, giving the designer a better understanding of the circuit behavior. However, such parameters are not production-tested and are, therefore, not guaranteed.

Shift registers longer than eight bits can be efficiently implemented in XC4000™ or Spartan™ series SelectRAM memory. Using Linear Feedback Shift Register (LFSR) counters to address the RAM makes the design even simpler. This application note describes 4- and 5-bit universal LFSR counters, very efficient RAM-based 32-bit and 100-bit shift registers, and pseudo-random sequence generators with repetition rates of thousands and even trillions of years, useful for testing and encryption purposes. The appropriate taps for maximum-length LFSR counters of up to 168 bits are listed.

This application note describes RAM-based FIFO designs using the dual-port RAM in XC4000™ Series devices. Synchronous designs with a common read/write clock are described, as well as asynchronous designs with independent read and write clocks. Emphasis is on the fast, efficient and reliable generation of the handshake signals FULL and EMPTY, which determine design performance.

This application note contains additional information that may be of use when designing with XC4000™ Series devices. This information supplements the product descriptions and specifications, and is provided for guidance only.

XC4000/XC5200/Spartan FPGA devices contain boundary scan facilities that are compatible with IEEE Standard 1149.1. This application note describes those facilities in detail, and explains how boundary scan is incorporated into an FPGA design.

This application note describes the XC4000/Spartan™ Readback capability and its use. Topics include: initialization of the Readback feature, format of the configuration and Readback bitstreams, timing considerations, software support for reading back FPGA devices, and Cyclic Redundancy Check (CRC).

The Xilinx high-performance CPLD, FPGA, and configuration PROM families provide in-system programmability, reliable pin locking, and JTAG boundary-scan test capability. This powerful combination of features allows designers to make significant changes and still keep the original device pin-outs, which eliminates the need to re-tool PC boards.

Design File(s):

• xapp058.zip

The use of the internal IOB 3-state control register can significantly improve output enable and disable time. This application note illustrates the use of hard macros to implement this register in both HDL and schematic-based designs.

Design File(s):

• xapp123_make_macro.zip
• xapp123_make_macro.tar.z

Design File(s):

• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

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• IPC-1752 Form

100% Material Declaration Data Sheet for VQ100 package

Design File(s):

• IPC-1752 Form

BG560 - Material Declaration Data Sheet (Standard Metal BGA)

Design File(s):

• IPC-1752 Form

VQG100 - Material Declaration Data Sheet (Pb-free VQFP)

Design File(s):

• IPC-1752 Form