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XC5200

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XC5200 Data Sheets

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11/05/1998 XC5200 FPGAs (PDF, ver 5.2, 1.15 MB )
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XC5200 User Guides

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XC5200 Errata

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XC5200 Customer Notices

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07/16/2007 XCN07012 - License Plate Number (LPN) Added to All Customer Labels(PDF, ver 1.0, 164 KB )

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

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08/07/2006 XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion(PDF, ver 2.0, 60 KB )

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

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01/30/2000 PDN99007A - Withdrawal of certain commercial low-volume device/package combinations(PDF, ver 1.0, 38 KB )
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10/15/1999 PDN99007 - Withdrawal of certain commercial low-volume device/package combinations(PDF, ver 1.0, 37 KB )
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07/01/1999 PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families(PDF, ver 1.0, 24 KB )
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08/27/2004 PDN2004-22 - Discontinue Low-Volume Members of the XC5200 Product Family(PDF, ver 1.1, 46 KB )

Xilinx is discontinuing certain members of the XC5200 product family.

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02/15/1997 PCN97002 - Additional Product Assembly Qualification of A.S.E. Taiwan(PDF, ver 1.0, 24 KB )
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02/15/1997 PCN97002 Data - Qualification of ASE for BGA Packages(PDF, ver 1.0, 12 KB )
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02/28/1997 PCN97001 - Qualification of ASTRA Microtronics Technology in Batam, Indonesia(PDF, ver 1.0, 24 KB )
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02/28/1997 PCN97001 Data - Qualification Test Data(PDF, ver 1.0, 10 KB )
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12/20/1996 PCN96011 - An evolutionary change in the Xilinx XC5200 fabrication process(PDF, ver 1.0, 23 KB )
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12/20/1996 PCN96011 Data - Qualification Data(PDF, ver 1.0, 21 KB )
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06/28/1996 PCN96005 - Qualification of A.S.E. Taiwan as a New Assembly Subcontractor(PDF, ver 1.0, 19 KB )
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06/30/1995 PCN95004 - Qualification of ASTRA Microtronics Technology as a new assembly subcontractor(PDF, ver 1.0, 17 KB )
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12/06/2004 PCN2004-28 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 161 KB )

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

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12/06/2004 PCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material)(PDF, ver 1.1, 72 KB )
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03/13/2007 PCN2000-06 - Minor Modification in Thermally Enhanced BG and FG Package Outline Specifications(PDF, ver 1.0.1, 41 KB )
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04/26/2010 XCN10017 - Adding SUNRISE Plastics Industry Shipping Tray for 28mm x 28mm QFP Packages and 31mm x 31mm BGA Packages(PDF, ver 1.1, 213 KB )

To advice customers that Xilinx has added alternate shipping tray for 28mm x 28mm QFP packages and 31mm x 31mm BGA packages.

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04/27/2010 XCN08011 - Product Discontinuation Notice(PDF, ver 1.2, 155 KB )

The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products.

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12/07/2009 XCN09033 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 67 KB )

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

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07/19/2010 XCN09001 - Product Discontinuation Notice(PDF, ver 1.4.2, 259 KB )

To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products.

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XC5200 Application Notes

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11/24/1997 XAPP092 - Configuration Issues: Power-up, Volatility, Security, Battery Back-up(PDF, ver 1.1, 31 KB )

This application note covers several related subjects: How does a Xilinx FPGA power up, and how does it react to power supply glitches? What can be done to maintain configuration during loss of primary power? What can be done to secure a design against illegal reverse engineering?

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11/24/1997 XAPP091 - Configuring Mixed FPGA Daisy Chains(PDF, ver 1.0, 26 KB )

Xilinx FPGAs can be configured in a common daisy chain structure, where the lead device generates CCLK pulses and feeds serial configuration information into the next downstream device, which in turn feeds data into the next downstream device, etc. There is no limit to the number of devices in a daisy chain, and XC3000™, XC4000™, Spartan™, and XC5200™-series devices can be mixed freely with only one constraint: the lead device must be a member of the highest order family used in the chain.

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11/24/1997 XAPP090 - FPGA Configuration Guidelines(PDF, ver 1.1, 58 KB )

These guidelines describe the configuration process for all members of the XC3000™, XC4000™, XC5200™, and Spartan™ FPGA devices and their derivatives. The average user need not understand or remember all these details, but should refer to the debugging hints when problems occur.

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11/16/1999 XAPP017 - Boundary Scan in XC4000/XC5200 Device(PDF, ver 3.0, 214 KB )

XC4000/XC5200/Spartan FPGA devices contain boundary scan facilities that are compatible with IEEE Standard 1149.1. This application note describes those facilities in detail, and explains how boundary scan is incorporated into an FPGA design.

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XC5200 Package Specifications

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01/08/2007 BGG352 - Material Declaration Data Sheet (Pb-free Metal BGA Cavity Down)(PDF, ver 1.0.1, 83 KB )

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01/08/2007 BG352 - Material Declaration Data Sheet (Standard Metal BGA Cavity Down)(PDF, ver 1.0.1, 81 KB )

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10/05/2006 TQ176 - Material Declaration Data Sheet (Standard TQFP)(PDF, ver 1.2, 78 KB )

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10/03/2006 TQ144 - Material Declaration Data Sheet (Standard TQFP)(PDF, ver 1.2, 81 KB )

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10/19/2006 PQ240 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 84 KB )

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10/19/2006 PQ208 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 109 KB )

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10/19/2006 PQ160 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 81 KB )

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10/19/2006 PQ100 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.3.1, 82 KB )

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10/03/2006 HQ240 - Material Declaration Data Sheet (Standard Heat Sink PQFP)(PDF, ver 1.2, 82 KB )

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10/03/2006 HQ208 - Material Declaration Data Sheet (Standard Heat Sink PQFP)(PDF, ver 1.2, 85 KB )

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06/18/2004 VQ64/VQG64 - Package Drawing (VQFP) (PDF, ver 1.2, 121 KB )
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02/26/2007 VQ100/VQG100 - Package Drawing (VQFP)(PDF, ver 1.2.1, 99 KB )
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06/18/2004 TQ176/TQG176 - Package Drawing (TQFP)(PDF, ver 1.2, 148 KB )
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06/18/2004 PQ240/PQG240 - Package Drawing (PQFP)(PDF, ver 1.2, 154 KB )
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06/18/2004 PQ208/PQG208 - Package Drawing (PQFP)(PDF, ver 1.2, 155 KB )
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06/18/2004 PQ160/PQG160 - Package Drawing (PQFP)(PDF, ver 1.2, 154 KB )
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10/17/2002 PQ100 - Package Drawing (Standard PQFP)(PDF, ver 1.2, 73 KB )
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10/05/2006 PC84 - Material Declaration Data Sheet (Standard PLCC)(PDF, ver 1.2, 87 KB )

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01/08/2007 BG225 - Material Declaration Data Sheet (Standard Plastic BGA)(PDF, ver 1.2.1, 72 KB )

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09/28/2006 TQG176 - Material Declaration Data Sheet (Pb-free TQFP)(PDF, ver 1.2, 76 KB )

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10/19/2006 PQG240 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 83 KB )

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10/19/2006 PQG208 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 80 KB )

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10/19/2006 PQG160 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 81 KB )

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10/19/2006 PQG100 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.3.1, 81 KB )

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09/28/2006 HQG240 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP)(PDF, ver 1.2, 81 KB )

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09/28/2006 HQG208 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP)(PDF, ver 1.2, 83 KB )

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09/28/2006 PCG84 - Material Declaration Data Sheet (Pb-free PLCC)(PDF, ver 1.2, 88 KB )

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06/18/2004 HQ240/HQG240 - Package Drawing (Heat Sink PQFP)(PDF, ver 1.2, 155 KB )
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06/18/2004 HQ208/HQG208 - Package Drawing (Heat Sink PQFP)(PDF, ver 1.2, 155 KB )
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06/01/2000 PG299 - Package Drawing (Standard Ceramic PGA)(PDF, ver 1.0, 116 KB )
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06/01/2000 PG223 - Package Drawing (Standard Ceramic PGA)(PDF, ver 1.0, 104 KB )
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04/06/2001 PG191 - Package Drawing (Standard Ceramic PGA)(PDF, ver 1.1, 47 KB )
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04/06/2001 PG156 - Package Drawing (Standard Ceramic PGA)(PDF, ver 1.1, 47 KB )
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06/18/2004 PC84/PCG84 - Package Drawing (PLCC)(PDF, ver 1.2, 91 KB )
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04/06/2001 BG352 - Package Drawing (Standard Metal BGA Cavity Down)(PDF, ver 1.1, 50 KB )
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04/06/2001 BG225 - Package Drawing (Standard Plastic BGA)(PDF, ver 1.1, 32 KB )
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09/23/2011 VQ100 - Material Declaration Data Sheet (Standard VQFP)(PDF, ver 1.3, 93 KB )

100% Material Declaration Data Sheet for VQ100 package

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09/23/2011 VQ64 - Material Declaration Data Sheet (Standard VQFP)(PDF, ver 1.4, 94 KB )

100% Material Declaration Data Sheet for VQ64 package

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11/18/2011 VQG64 - Material Declaration Data Sheet (Pb-free VQFP)(PDF, ver 1.4, 93 KB )

VQG64 - Material Declaration Data Sheet (Pb-free VQFP)

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11/18/2011 VQG100 - Material Declaration Data Sheet (Pb-free VQFP)(PDF, ver 1.3, 93 KB )

VQG100 - Material Declaration Data Sheet (Pb-free VQFP)

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XC5200 Characterization Reports

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XC5200 White Papers

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XC5200 Board and Kit Documentation

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