XC9500XV

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XC9500XV Data Sheets

NameDoc VersionSizeDate
PDFXC9500XV Family High-Performance CPLD (PDF)

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3.0 206 KB 06/25/2007
PDFXC95288XV 2.5V High-Performance CPLD (PDF)

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3.0 133 KB 06/25/2007
PDFXC95144XV 2.5V High-Performance CPLD (PDF)

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3.0 107 KB 06/25/2007
PDFXC9572XV High-Performance CPLD (PDF)

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3.0 98 KB 06/25/2007
PDFXC9536XV High-Performance CPLD (PDF)

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3.0 93 KB 06/25/2007
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XC9500XV User Guides

NameDoc VersionSizeDate
PDFDevice Package User Guide (PDF)

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3.4 4.87 MB 06/10/2009
PDFDevice Reliability Report, Second Quarter 2009 (PDF)

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5.6 2.26 MB 08/03/2009
PDFCPLD I/O User Guide (PDF)

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1.1 610 KB 11/27/2007
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XC9500XV Errata

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XC9500XV Customer Notices

NameDoc VersionSizeDate
PDFXCU2000-03 - Addition of PPT as a Substrate Supplier (PDF)
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1.0 22 KB 11/14/2002
PDFXCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)

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1.0 164 KB 07/16/2007
PDFXCN07010 - Product Discontinuance Update (PDF)

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1.0 50 KB 05/14/2007
PDFXCN06016 - New Assembly Partner: STATS ChipPAC Singapore (SCS) (PDF)

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Design Files: Qualification Report for XCN06016
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1.1 115 KB 12/25/2006
PDFXCN06013 - Addition of Kostat Shipping Tray for CS144/CSG144 and CS280/CSG280 Laminate BGA Packages (PDF)

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1.1 76 KB 05/17/2006
PDFXCN05020 - Discontinue Low-Volume Members of the XC4000XL, XC4000E, XC9500XV, and XC3100A Families (PDF)

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1.1 143 KB 03/10/2006
PDFXCN05018 - Package Substrate Change for Chip Scale (Tape) and Lead-Free Chip Scale (Tape) (PDF)

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Design Files: Qualification Report for XCN05018
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1.0.1 130 KB 12/21/2007
PDFXCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion (PDF)

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Design Files: Qualification Report for XCN05011
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2.0 60 KB 08/07/2006
PDFPDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families (PDF)
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1.0 24 KB 07/01/1999
PDFPCN2004-28 - Humidity Indicator Card (HIC) Change (PDF)

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1.0 161 KB 12/06/2004
PDFPCN2004-05 - New Material Set and Part Marking for Chip Scale BGA Packages (PDF)
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1.1 72 KB 12/06/2004
PDFPCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material) (PDF)
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1.1 72 KB 12/06/2004
PDFAdvisory 2003-02 - Change in BGA Shipping Trays (PDF)

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1.0 43 KB 08/19/2003
PDFAdvisory2001-01 - JTAG Programmer Software Update Needed for XC9572XV and XC95288XV (PDF)
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1.0 19 KB 06/29/2001
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XC9500XV Application Notes

NameDoc VersionSizeDate
PDFXAPP805 - Driving LEDs with Xilinx CPLDs (PDF)

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1.0 254 KB 04/08/2005
PDFXAPP501 - Configuration Quick Start Guidelines (PDF)

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1.5 249 KB 10/02/2007
PDFXAPP440 - Power On Behavior of Xilinx CPLDs (PDF)

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1.0 85 KB 05/25/2006
PDFXAPP361 - Planning for High Speed XC9500XV Designs (PDF)

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1.0 83 KB 08/08/2001
PDFXAPP143 - Using Verilog to Create CPLD Designs (PDF)

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1.0 377 KB 08/22/2001
PDFXAPP105 - A CPLD VHDL Introduction (PDF)

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2.0 335 KB 08/30/2001
PDFXAPP104 - A Quick JTAG ISP Checklist (PDF)

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3.0.1 55 KB 12/20/2007
PDFXAPP070 - Using In-System Programming in Boundary-Scan Systems (PDF)

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2.1.1 136 KB 11/15/2007
PDFXAPP069 - Using the XC9500 JTAG Boundary Scan Interface   (PDF)

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3.1 464 KB 12/10/2002
PDFXAPP067 - Using Serial Vector Format Files to Program XC9500 Devices In-System (PDF)

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2.0 123 KB 05/13/2002
PDFXAPP058 - Xilinx In-System Programming Using an Embedded Microcontroller (PDF)

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Design Files: xapp058.zip
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4.1 641 KB 03/06/2009
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XC9500XV Package Specifications

NameDoc VersionSizeDate
PDFVQ44 - Material Declaration Data Sheet (Standard VQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 10/05/2006
PDFTQ144 - Material Declaration Data Sheet (Standard TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 10/03/2006
PDFTQ100 - Material Declaration Data Sheet (Standard TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 09/29/2006
PDFPQ208 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 109 KB 10/19/2006
PDFHQ208 - Material Declaration Data Sheet (Standard Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 85 KB 10/03/2006
PDFVQ44/VQG44 - Package Drawing (VQFP) (PDF)
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1.2 121 KB 06/18/2004
PDFTQ100/TQG100 - Package Drawing (TQFP) (PDF)
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1.2 147 KB 06/18/2004
PDFPQ44/PQG44 - Package Drawing (PQFP) (PDF)
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1.2 154 KB 06/18/2004
PDFPQ208/PQG208 - Package Drawing (PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFPQG44 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.0 75 KB 10/05/2006
PDFPQ44 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.0 82 KB 10/05/2006
PDFCSG280 - Material Declaration Data Sheet (Pb-free Flex Tape Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.0 75 KB 10/05/2006
PDFPC44 - Material Declaration Data Sheet (Standard PLCC) (PDF)
Design Files: IPC-1752 Form
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1.2 78 KB 09/29/2006
PDFFG256 - Material Declaration Data Sheet (Standard Fine-Pitch BGA) (PDF)
Design Files: IPC-1752 Form
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1.2 84 KB 09/14/2006
PDFCS144 - Material Declaration Data Sheet (Standard Laminate Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 09/28/2006
PDFCS48 - Material Declaration Data Sheet (Standard Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.2 83 KB 09/28/2006
PDFCS280 - Material Declaration Data Sheet (Standard Flex Tape Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.0 78 KB 10/05/2006
PDFVQG44 - Material Declaration Data Sheet (Pb-free VQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 80 KB 09/28/2006
PDFTQG100 - Material Declaration Data Sheet (Pb-free TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 80 KB 10/19/2006
PDFPQG208 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 80 KB 10/19/2006
PDFHQG208 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 83 KB 09/28/2006
PDFPCG44 - Material Declaration Data Sheet (Pb-free PLCC) (PDF)
Design Files: IPC-1752 Form
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1.2 77 KB 09/28/2006
PDFFGG256 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA) (PDF)
Design Files: IPC-1752 Form
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1.1 91 KB 06/29/2006
PDFCSG144 - Material Declaration Data Sheet (Pb-free Laminate Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.2 85 KB 09/28/2006
PDFCSG48 - Material Declaration Data Sheet (Pb-free Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.3 86 KB 09/28/2006
PDFHT144/HTG144 - Package Drawing (Heat Sink TQFP) (PDF)
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1.2 148 KB 06/18/2004
PDFHT100/HTG100 - Package Drawing (Heat Sink TQFP) (PDF)
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1.2 148 KB 06/18/2004
PDFHQ208/HQG208 - Package Drawing (Heat Sink PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFPC44/PCG44 - Package Drawing (PLCC) (PDF)
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1.2 90 KB 06/18/2004
PDFFG256/FGG256 - Package Drawing (Fine-Pitch BGA) (PDF)
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1.2.1 97 KB 04/12/2005
PDFCS48/CSG48 - Package Drawing (Chip Scale BGA) (PDF)
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1.2.1 74 KB 04/12/2005
PDFCS280/CSG280 - Package Drawing (Laminate Chip Scale BGA) (PDF)
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1.0 62 KB 12/05/2005
PDFCS280/CSG280 - Package Drawing (Flex Tape Chip Scale BGA) (PDF)
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1.2.2 58 KB 11/29/2005
PDFCS144/CSG144 - Package Drawing (Laminate Chip Scale BGA) (PDF)
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1.1 69 KB 05/31/2006
PDFCS144/CSG144 - Package Drawing (Flex Tape Chip Scale BGA) (PDF)
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1.3 49 KB 01/15/2007
PDFTQ144/TQG144 - Package Drawing (TQFP) (PDF)
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1.2 147 KB 06/18/2004
PDFTQG144 - Material Declaration Data Sheet (Pb-free TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 80 KB 10/19/2006
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XC9500XV Characterization Reports

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XC9500XV White Papers

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XC9500XV Board and Kit Documentation

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