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XC9500XV Data Sheets

DateName
06/25/2007 DS049 - XC9500XV Family High-Performance CPLD - Obsolete(PDF, ver 3.0, 144 KB )

Family data sheet for XC9500XV 2.5V CPLD. This product is obsolete/under obsolescence.

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06/25/2007 XC95288XV 2.5V High-Performance CPLD - Obsolete(PDF, ver 3.0, 117 KB )

Data Sheet for XC95288XV 288 Macrocell 2.5V CPLD. This product is obsolete/under obsolescence.

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06/25/2007 XC95144XV 2.5V High-Performance CPLD - Obsolete(PDF, ver 3.0, 92 KB )

Data Sheet for XC95144XV 144 Macrocell 2.5V CPLD. This product is obsolete/under obsolescence.

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06/25/2007 DS052 - XC9572XV High-Performance CPLD - Obsolete(PDF, ver 3.0, 84 KB )

Data Sheet for XC9572XV 72 Macrocell 2.5V CPLD. This product is obsolete/under obsolescence.

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06/25/2007 DS053 - XC9536XV High-Performance CPLD - Obsolete(PDF, ver 3.0, 80 KB )

Data Sheet for XC9536XV 36 Macrocell 2.5V CPLD. This product is obsolete/under obsolescence.

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XC9500XV User Guides

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11/27/2007 CPLD I/O User Guide(PDF, ver 1.1, 610 KB )

This document describes the behavior of the I/Os under various operating conditions. It describes how to use the different termination modes, how to understand thresholds, and how loading affects the I/Os.

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09/22/2010 Device Package User Guide(PDF, ver 3.6, 4.89 MB )

This document discusses thermal, electrical, moisture, and soldering characteristics of Xilinx® device packages.

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01/27/2012 Device Reliability Report, Fourth Quarter 2011(PDF, ver 8.1, 2.2 MB )

Summary of the reliability test data and results for Xilinx devices updated four times per year.

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XC9500XV Errata

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XC9500XV Customer Notices

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11/14/2002 XCU2000-03 - Addition of PPT as a Substrate Supplier(PDF, ver 1.0, 22 KB )
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07/16/2007 XCN07012 - License Plate Number (LPN) Added to All Customer Labels(PDF, ver 1.0, 164 KB )

Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product.

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12/25/2006 XCN06016 - New Assembly Partner: STATS ChipPAC Singapore (SCS)(PDF, ver 1.1, 115 KB )

The purpose of this notice is to announce the addition of STATS ChipPAC in Singapore (SCS) as a qualified assembly partner for Plastic Quad Flat Pack (PQFP), Thin Quad Flat Pack (TQFP/VQFP), and Ball Grid Array in wire bond (BGA) packages.

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05/17/2006 XCN06013 - Addition of Kostat Shipping Tray for CS144/CSG144 and CS280/CSG280 Laminate BGA Packages(PDF, ver 1.1, 76 KB )

Xilinx is adding shipping trays produced by Kostat, Inc. for the new CS144/CSG144 and CS280/CSG280 Laminate packages.

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12/21/2007 XCN05018 - Package Substrate Change for Chip Scale (Tape) and Lead-Free Chip Scale (Tape)(PDF, ver 1.0.1, 130 KB )

A package substrate change for Chip Scale (Tape) and lead-free Chip Scale (Tape).

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08/07/2006 XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion(PDF, ver 2.0, 60 KB )

This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.

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07/01/1999 PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families(PDF, ver 1.0, 24 KB )
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12/06/2004 PCN2004-28 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 161 KB )

Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033.

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12/06/2004 PCN2004-05 - New Material Set and Part Marking for Chip Scale BGA Packages(PDF, ver 1.1, 72 KB )
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12/06/2004 PCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material)(PDF, ver 1.1, 72 KB )
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08/19/2003 Advisory 2003-02 - Change in BGA Shipping Trays(PDF, ver 1.0, 43 KB )

Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both Daewon and Kostat.

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06/29/2001 Advisory2001-01 - JTAG Programmer Software Update Needed for XC9572XV and XC95288XV (PDF, ver 1.0, 19 KB )
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04/12/2010 XCN05020 - Discontinue Low-Volume Members of the XC4000XL, XC4000E, XC9500XV, and XC3100A Families(PDF, ver 1.2, 93 KB )

Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families.

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04/26/2010 XCN07010 - Product Discontinuance Update(PDF, ver 1.1, 77 KB )

This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx.

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12/07/2009 XCN09033 - Humidity Indicator Card (HIC) Change(PDF, ver 1.0, 67 KB )

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

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XC9500XV Application Notes

DateName
04/08/2005 XAPP805 - Driving LEDs with Xilinx CPLDs(PDF, ver 1.0, 254 KB )

This application note describes how to drive LEDs using Xilinx CPLDs.

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10/02/2007 XAPP501 - Configuration Quick Start Guidelines(PDF, ver 1.5, 249 KB )

This application note discusses the configuration and programming options for Xilinx Complex Programmable Logic Device (CPLD), Field Programmable Gate Array (FPGA), and PROM families and demonstrates some of the most popular configuration methods used for each family. This document includes configuration quick start guidelines for the Virtex™, Spartan™, XPLA3, XC9500, and XC18V00 families.

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05/25/2006 XAPP440 - Power On Behavior of Xilinx CPLDs(PDF, ver 1.0, 85 KB )

Describes the bahavior of CPLDs during power up.

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08/08/2001 XAPP361 - Planning for High Speed XC9500XV Designs(PDF, ver 1.0, 83 KB )

CPLD design has advanced significantly beyond that of fast PAL design. Today's CPLDs must operate in systems that include microprocessors, memories, I/O devices, buses, multiple power supplies and multiple frequency clocks. The actual logic design is frequently minor with respect to the electrical issues that must be dealt with during debug.

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08/22/2001 XAPP143 - Using Verilog to Create CPLD Designs(PDF, ver 1.0, 377 KB )

This application note covers the basics of how to use Verilog as applied to Complex Programmable Logic Devices. Various combinational logic circuit examples, such as multiplexers, decoders, encoders, comparators, and adders are provided. Synchronous logic circuit examples, such as counters and state machines are also provided.

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08/30/2001 XAPP105 - A CPLD VHDL Introduction(PDF, ver 2.0, 335 KB )

This introduction covers the basics of VHDL as applied to CPLDs. Specifically included are those design practices that translate well to CPLDs, permitting designers to use the best features of this powerful language to extract the best performance from CPLD designs.

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12/20/2007 XAPP104 - A Quick JTAG ISP Checklist(PDF, ver 3.0.1, 55 KB )

Most Xilinx CPLDs, PROMs, and FPGAs have an IEEE Standard 1149.1 (JTAG) port. Xilinx devices with a JTAG port are in-system programmable (ISP) through the JTAG port. The ISP feature is beneficial for fast prototype development. This application note describes a short list of considerations needed to get the best performance from your ISP designs.

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11/15/2007 XAPP070 - Using In-System Programming in Boundary-Scan Systems(PDF, ver 2.1.1, 136 KB )

This application note discusses basic design considerations for in-system programming of multiple XC9500 devices in a boundary scan chain, and shows how to design systems that contain multiple XC9500 devices as well as other IEEE 1149.1-compatible devices.

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12/10/2002 XAPP069 - Using the XC9500 JTAG Boundary Scan Interface  (PDF, ver 3.1, 464 KB )

This application note explains the XC9500™ boundary scan interface and demonstrates the software available for programming and testing XC9500 CPLDs. An appendix summarizes the JTAG programmer operations and surveys the additional operations supported by XC9500 CPLDs for in-system programming.

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05/13/2002 XAPP067 - Using Serial Vector Format Files to Program XC9500 Devices In-System(PDF, ver 2.0, 123 KB )

This application note describes how to program XC9500™ devices in-system, using standard Serial Vector Format (SVF) stimulus files.

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03/06/2009 XAPP058 - Xilinx In-System Programming Using an Embedded Microcontroller(PDF, ver 4.1, 641 KB )

The Xilinx high-performance CPLD, FPGA, and configuration PROM families provide in-system programmability, reliable pin locking, and JTAG boundary-scan test capability. This powerful combination of features allows designers to make significant changes and still keep the original device pin-outs, which eliminates the need to re-tool PC boards.

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XC9500XV Package Specifications

DateName
10/03/2006 TQ144 - Material Declaration Data Sheet (Standard TQFP)(PDF, ver 1.2, 81 KB )

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09/29/2006 TQ100 - Material Declaration Data Sheet (Standard TQFP)(PDF, ver 1.2, 81 KB )

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10/19/2006 PQ208 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.2.1, 109 KB )

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10/03/2006 HQ208 - Material Declaration Data Sheet (Standard Heat Sink PQFP)(PDF, ver 1.2, 85 KB )

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06/18/2004 VQ44/VQG44 - Package Drawing (VQFP)(PDF, ver 1.2, 121 KB )
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06/18/2004 TQ100/TQG100 - Package Drawing (TQFP)(PDF, ver 1.2, 147 KB )
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06/18/2004 PQ44/PQG44 - Package Drawing (PQFP)(PDF, ver 1.2, 154 KB )
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06/18/2004 PQ208/PQG208 - Package Drawing (PQFP)(PDF, ver 1.2, 155 KB )
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10/05/2006 PQG44 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.0, 75 KB )

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10/05/2006 PQ44 - Material Declaration Data Sheet (Standard PQFP)(PDF, ver 1.0, 82 KB )

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10/05/2006 CSG280 - Material Declaration Data Sheet (Pb-free Flex Tape Chip Scale BGA)(PDF, ver 1.0, 75 KB )

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09/29/2006 PC44 - Material Declaration Data Sheet (Standard PLCC)(PDF, ver 1.2, 78 KB )

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09/14/2006 FG256 - Material Declaration Data Sheet (Standard Fine-Pitch BGA)(PDF, ver 1.2, 84 KB )

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09/28/2006 CS144 - Material Declaration Data Sheet (Standard Laminate Chip Scale BGA)(PDF, ver 1.2, 81 KB )

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09/28/2006 CS48 - Material Declaration Data Sheet (Standard Chip Scale BGA)(PDF, ver 1.2, 83 KB )

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10/05/2006 CS280 - Material Declaration Data Sheet (Standard Flex Tape Chip Scale BGA)(PDF, ver 1.0, 78 KB )

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10/19/2006 TQG100 - Material Declaration Data Sheet (Pb-free TQFP)(PDF, ver 1.2.1, 80 KB )

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10/19/2006 PQG208 - Material Declaration Data Sheet (Pb-free PQFP)(PDF, ver 1.2.1, 80 KB )

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09/28/2006 HQG208 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP)(PDF, ver 1.2, 83 KB )

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06/29/2006 FGG256 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA)(PDF, ver 1.1, 91 KB )

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09/28/2006 CSG144 - Material Declaration Data Sheet (Pb-free Laminate Chip Scale BGA)(PDF, ver 1.2, 85 KB )

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09/28/2006 CSG48 - Material Declaration Data Sheet (Pb-free Chip Scale BGA)(PDF, ver 1.3, 86 KB )

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06/18/2004 HT144/HTG144 - Package Drawing (Heat Sink TQFP)(PDF, ver 1.2, 148 KB )
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06/18/2004 HT100/HTG100 - Package Drawing (Heat Sink TQFP)(PDF, ver 1.2, 148 KB )
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06/18/2004 HQ208/HQG208 - Package Drawing (Heat Sink PQFP)(PDF, ver 1.2, 155 KB )
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06/18/2004 PC44/PCG44 - Package Drawing (PLCC)(PDF, ver 1.2, 90 KB )
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04/12/2005 FG256/FGG256 - Package Drawing (Fine-Pitch BGA)(PDF, ver 1.2.1, 97 KB )
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04/12/2005 CS48/CSG48 - Package Drawing (Chip Scale BGA)(PDF, ver 1.2.1, 74 KB )
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12/05/2005 CS280/CSG280 - Package Drawing (Laminate Chip Scale BGA)(PDF, ver 1.0, 62 KB )
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11/29/2005 CS280/CSG280 - Package Drawing (Flex Tape Chip Scale BGA)(PDF, ver 1.2.2, 58 KB )
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05/31/2006 CS144/CSG144 - Package Drawing (Laminate Chip Scale BGA)(PDF, ver 1.1, 69 KB )
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01/15/2007 CS144/CSG144 - Package Drawing (Flex Tape Chip Scale BGA)(PDF, ver 1.3, 49 KB )
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06/18/2004 TQ144/TQG144 - Package Drawing (TQFP)(PDF, ver 1.2, 147 KB )
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10/19/2006 TQG144 - Material Declaration Data Sheet (Pb-free TQFP)(PDF, ver 1.2.1, 80 KB )

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07/29/2011 PCG44 - Material Declaration Data Sheet (Pb-free PLCC)(PDF, ver 1.3, 96 KB )

100% Material Data Declaration Sheet (Pb-free PLCC)

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11/18/2011 VQG44 - Material Declaration Data Sheet (Pb-free VQFP)(PDF, ver 1.3, 93 KB )

VQG44 - Material Declaration Data Sheet (Pb-free VQFP)

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11/18/2011 VQ44 - Material Declaration Data Sheet (Standard VQFP)(PDF, ver 1.3, 93 KB )

100% Material Declaration Data Sheet for VQ44 package

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XC9500XV Characterization Reports

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XC9500XV White Papers

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XC9500XV Board and Kit Documentation

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