Xilinx is committed to ensuring the highest levels of compliance across the many standards that govern different industry management systems.
Xilinx offers lead free (Pb-Free) components that comply with the European Union’s RoHS directive (2002/95/EC). RoHS compliant devices are specified by adding the character “G” to the package designator portion of the part number. Under current directive, Xilinx flip-chip packages are exempt from the lead-free requirement under Exemption 15 (Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages). Flip-chip packages that are fully 6 of 6 RoHS compliant without exemption 15 are specified by adding the character “V” to the package designator portion of the part number.
Material declaration data sheets and IPC 1752 forms are posted under Packaging Specifications.
Xilinx offers our standard devices which contain lead but comply with the RoHS Directive limits for mercury, hexavalent chromium, cadmium, PBB and PBDE.
Halogen Free and Green package is per IEC61249-2-21
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