These two acronyms refer to European Union (EU) Directives:
The substances identified by the RoHS Directive as hazardous are:
Yes. Pb-free products from Xilinx do not contain any of the substances banned in the RoHS Directive. In any Xilinx documentation, the term Pb-free implies RoHS compliance.
In the semiconductor industry, Pb can be found in the:
Xilinx initiated its Pb-free program in 1999. We have been shipping Pb-free products since 2002.
Xilinx participates in many industry consortiums that advance the semiconductor industry. Specific to Pb-free technology, Xilinx participates in JEDEC/IPC conferences as well as NEMI.
Pb-free packaging is available for all leading product families including Virtex-4, Virtex-II Pro/X, Virtex-II, Virtex-E, Spartan-3, Spartan-3L, Spartan-IIE, CoolRunner-II, XC9500XL, Platform Flash, and RocketPHY and newer generation families.
For more information, see our Pb-free solutions or contact your Xilinx sales representative.
Yes. Pb-free products are specified by adding a "G" character to the package designator portion of the standard part number. For example: XC2S100E-6TQ144C would be XC2S100E-6TQG144C for the Pb-free version. Parts ordered using this nomenclature are appropriately marked on the actual device.
Yes. There are no current plans to discontinue Pb-based products.
As the demand for Pb-free solutions increases, lead times will reach parity with standard products. Contact your Xilinx sales representative for specific availability information.
Pb-free packages from Xilinx are marked with a "G" designator on the device.
For lead frame packages, the plating material for the leads is 100% Matte Sn.
For wire bond BGA packages, the solder balls use a SnAgCu composition.
Flip chip packages utilize a SnAgCu composition on the solder balls and a eutectic SnPb composition for the solder bumps. The SnPb composition used on the solder bumps is RoHS compliant based on an exemption.
Xilinx worked with industry leaders to determine the most reliable and cost-effective material set.
Yes. Xilinx RoHS-compliant flip chip packages became available in 1Q05.
Yes, Xilinx ceramic packages are RoHS compliant, based on exemptions included in the RoHS Directive.
Standard packages from Xilinx are "5 of 6 compliant to RoHS". They do not contain the five non-Pb hazardous substances identified in the RoHS Directive, which include mercury, cadmium, hexavalent chromium, polybrominated biphenels (PBB), and polybrominated diphenyl ether (PBDE).
Yes, all boards and cables are RoHS compliant. They have a "G" designator in the marketing part name to indicate this.
Reliability tests include temperature cycles, temperature humidity, board level reliability, and tin whisker testing. See our Device Reliability Report for more information.
See our Device Reliability Report for data on Pb-free packages.
The Pb-free flip chip packages have a higher MSL (Level 4). All other Pb-free packages have the same MSL as standard packages.
Tin whiskers are needle-like crystals that may spontaneously grow from a pure tin surface (as used on Pb-free lead frame packages). Xilinx works with industry consortia to understand tin whisker mechanisms and develop solutions to mitigate tin whisker. Various tests have been conducted including temperature cycling, storage, and temperature/humidity. Please contact the Xilinx packaging group for additional information.
Yes. Xilinx meets the requirements of the latest JEDEC standard.
The surface finish is 100% Matte Sn over copper lead frame.
Yes. All Pb-free package construction materials such as die attach, substrate, mold compound etc. have been significantly improved to extend their capability to withstand higher reflow temperature requirements during assembly.
Yes. Xilinx applies annealing for one hour at 150 C after plating.
Xilinx Pb-free solutions that are "backward compatible", allow customers to surface mount Pb-free components onto Pb-based PCBs and/or use Pb-free products with non-Pb-free technologies.
Lead frame packages are qualified as backward compatible.
BGA and flip chip packages are not backward compatible and require special processing due to the higher reflow temperature requirements of the BGA Pb-free solutions.
Backward compatibility, as defined by Xilinx, refers only to the soldering process. Pb-free devices from Xilinx have the same form, fit and function as standard Pb-based products. No changes are required for board design when using Pb-free products from Xilinx. However, you may need to adjust board finish materials.
Lead-frame packages (PQG, TQG, VQG, PCG, QFG, etc.) from Xilinx are backward compatible. The component can be soldered with Sn/Pb solder using a Sn/Pb soldering process. Lead-frame packages from Xilinx use a Matte Sn plating on the leads that is compatible with both Pb-free soldering alloys and Sn/Pb soldering alloy.
However, we do not recommended soldering BGA packages (CPG, FTG, FGG, BGG, etc.) with SnPb solder using a Sn/Pb soldering process. The traditional Sn/Pb soldering process usually has a peak reflow temperature of 205 - 220 C. At this temperature range, the SnAgCu BGA solder balls do not properly melt and wet to the soldering surfaces. Reliability and assembly yields will be compromised.
Pb-free lead frame packages are backward compatible.
Pb-free wire bond BGA packages and flip chip packages are not backward compatible.
Optimize the reflow profile depending on your board density, board size, etc.