Technology|roadmap

Technology Roadmap

Zynq-7000 Extensible Processing Platform

Technology innovation is the core of Xilinx products and your success. You rely on us to bring new products with state of the art capabilities, product differentiation, and that enable the fastest and most efficient time to market. The Technology Roadmap is designed to help you learn more about our latest technology innovations so that you can deliver leading-edge products to your customers at the right time.

Delivering the Right Technology When You Need It
Agile Mixed Signal Technology

Delivers the industry's most flexible general purpose analog interface that integrates discrete ADCs and replaces complex analog signal processing devices

28Gbps Serial Transceiver Technology

Enables single-FPGA solutions for 400G systems with fastest, lowest jitter serial transceivers that meet the OIF CEI28G specification

Stacked Silicon Interconnect Technology

Delivers breakthrough capacity, bandwidth and power savings using multiple FPGA die in a single package

Zynq™-7000 Extensible Processing Platform

Processor-centric architecture offering flexibility and scalability of an FPGA combined with ASIC-like power and performance and the ease of use of an ASSP

7 Series FPGAs

Industry’s lowest power FPGAs optimized for a complete range of application requirements

Targeted Design Platforms

Accelerate your designs right out of the box

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