ISI designs and manufactures a broad array of advanced electronics packaging and interconnect solutions. Capabilities include PCB/substrate design, advanced SMT, bare die assembly, and custom module interconnect, testing and inspection. Product categories include: Miniaturized FPGA systems, 3D Packaging, High Density Modules, IC Obsolescence, Production BGA Socketing System, Molded Multi-Component Modules, Cost Reduction Modules, IC Footprint Conversion Adapters, Flex Circuit Assemblies, and Bare Die to PCB or Flex.
ISI's subsidiary, Nallatech, is a leading provider of FPGA Network Processing Cards capable of addressing a range of latency-critical applications including encryption/decryption, network monitoring and security, deep packet Inspection, real-time image processing, and high frequency trading. Customers benefit from lower costs, reduction in size, weight and power and improved performance. For further information please visit www.nallatech.com.