The Xilinx Bare Die program satisfies the need for further SWaP-C requirements beyond small form factor packaging for systems that must have the lowest possible size and weight. Xilinx provides most products families in bare die and in some cases, whole wafer form.
Experienced packaging partners are available to help customers with assembling and processing Bare Die if needed. These assemblies are typically modules based on organic or silicon substrates.
Bare Die products can be procured either through distribution or Xilinx direct sales and in all cases a Minimum Order Quantity (MOQ) applies. Please note that Bare Die products are sold under special terms and conditions. Also, special documentation is available to allow customers to design with and assemble Bare Die.
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