Resource Utilization for MIPI DSI Tx Subsystem v2.3

Vivado Design Suite Release 2023.2

Interpreting the results

This page contains resource utilization data for several configurations of this IP core. The data is separated into a table per device family. In each table, each row describes a test case. The columns are divided into test parameters and results. The test parameters include the part information and the core-specific configuration parameters. Any configuration parameters that are not listed have their default values; any parameters with a blank value are disabled or set automatically by the IP core. Consult the product guide for this IP core for a list of GUI parameter and user parameter mappings.

• Resource figures are taken from the utilization report issued at the end of implementation using the Out-of-Context flow in Vivado Design Suite.
• The Out-of-Context IP constraints include HD.CLK_SRC properties as required to ensure correct hold timing closure: these properties are enabled using the Tcl command: set_param ips.includeClockLocationConstraints true
• The frequencies used for clock inputs are stated for each test case.
• LUT figures do not include LUTs used as pack-thrus, but do include LUTs used as memory.
• Default Vivado Design Suite 2023.2 settings were used. You may be able to improve on these figures using different settings. Because surrounding circuitry will affect placement and timing, no guarantee can be given that these figures will be repeatable in a larger design.

Data is provided for the following device families:

• Kintex-7
• Zynq UltraScale+

Kintex-7

Zynq UltraScale+

COPYRIGHT

Copyright 2023 Xilinx, Inc. Xilinx, the Xilinx logo, Alveo, Artix, ISE, Kintex, Spartan, Versal, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. Arm is a registered trademark of Arm Limited in the EU and other countries. All other trademarks are the property of their respective owners.

LEGAL INFORMATION: PLEASE READ

The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES AND CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with, the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential loss or damage (including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such damage or loss was reasonably foreseeable or Xilinx had been advised of the possibility of the same. Xilinx assumes no obligation to correct any errors contained in the Materials or to notify you of updates to the Materials or to product specifications. You may not reproduce, modify, distribute, or publicly display the Materials without prior written consent. Certain products are subject to the terms and conditions of Xilinx's limited warranty, please refer to Xilinx's Terms of Sale which can be viewed at https://www.xilinx.com/legal.htm#tos; IP cores may be subject to warranty and support terms contained in a license issued to you by Xilinx. Xilinx products are not designed or intended to be fail-safe or for use in any application requiring fail-safe performance; you assume sole risk and liability for use of Xilinx products in such critical applications, please refer to Xilinx's Terms of Sale which can be viewed at https://www.xilinx.com/legal.htm#tos.