Xilinx Debuts Industry-First Solutions at OFC 2017 and Further Expands High Speed Data Center Interconnect Offerings

Demonstrations include new 400G Ethernet, FlexE 1.0, and MACsec solutions to accelerate time to market and maximize scalability

Mar 15, 2017

SAN JOSE, Calif., March 15, 2017 /PRNewswire/-- Xilinx, Inc. (NASDAQ: XLNX) announced today it will debut a number of industry-first solutions at OFC 2017 thereby extending its lead of high speed data center interconnect (DCI) solutions offering. Targeting DCI applications, these solutions give systems OEMs maximum flexibility and enable migration to next-generation designs, allowing for scalable performance at the lowest risk while ensuring network security. With data center network traffic and bandwidth requirements ever increasing, data centers require cutting-edge solutions for metro and long haul applications that meet rapidly changing high speed networking and security requirements. Xilinx is addressing these issues with off-the-shelf solutions available today. Visit Xilinx at OFC booth #1809, March 21 – 23, in Los Angeles, CA to learn about these demonstrations and more. 

  • Industry-First 400GE Multi-Vendor Network
    This demo features the world's first standards-based 400GE MAC and PCS IP in a Xilinx® Virtex® UltraScale+™ VU9P FPGA. Showcasing the emerging 400GE standard interoperability between multiple vendors, the demo illustrates the Xilinx 400G solution connecting to a Finisar 400GE CFP8 module which in turn connects to a Spirent 400G test module in the Ethernet Alliance booth.
  • FlexE for DCI Transport
    World's first complete FlexE 1.0 solution showcasing bonding, sub-rating and channelization on UltraScale+ FPGAs. This solution demonstrates how multiple clients can be transported using FlexE and highlights the ability of FlexE to carry larger data pipes and match them to transport links for optimal utilization of the link budget. This solution allows network operators to maximize optical performance and lower operating costs over existing infrastructure.
  • Automation and Security Functions for DCI Solutions
    This demonstration shows how LLDP packets can be snooped on transport line cards to allow a SDN controller to build a network topology for automation integral to data center networks. It also shows the use of IEEE compliant MACsec to encrypt and authenticate the link for security. As more and more critical applications and data migrate to the cloud, MACsec provides data encryption and authentication to preserve privacy. Such a solution is mandatory in front of a traditional DSP to provide a complete DCI solution.
  • Optical Technology Abstraction in DCI Transport
    With the emergence of differing optical technologies such as DSPs, PAM-4, coherent, and extended reach LR, customers must abstract such technologies from a system and software perspective. This demo illustrates how Xilinx FPGAs provide the required abstraction from differing technology integration by multiple manufacturers and enables designers to choose or mix optical technologies on a single platform.
  • 56G PAM4 Transceiver Performance
    This demonstration showcases Xilinx's new 56G PAM-4 transceiver test chip in 16nm FinFET delivering optimized performance for backplane and LR applications.

Xilinx Interoperability Demonstrations
Together with its ecosystem, Xilinx enables robust solutions to enable accelerated time to production and rapid customer deployment. The following interoperability demonstrations will be on display at OFC.

  • 400GE Multi-Vendor Network (Ethernet Alliance Booth #3709)
    Showcasing interoperability between multiple vendors, the demo illustrates the Xilinx 400G solution connecting to a Finisar 400GE CFP8 module which in turn connects to an Ixia test set in the Finisar booth.
  • 10GE Aggregation with FlexE for DCI Transport (OIF Booth #3853)
    Demonstration of an OIF FlexE implementation carrying multiple clients. Xilinx 20nm Virtex® UltraScale FPGAs are used to implement the world's first OIF FlexE solution of a channelized FlexE group.
  • 56Gb/s PAM-4 Transceiver Interoperability (OIF Booth #3853)
    Xilinx PAM-4 transceiver interoperating with 3rd party PAM-4 transceivers over industry standard LR backplanes, QSFP28 connectors and copper cables.

Xilinx Presentations at OFC

  • 400GE from Hype to Reality
    • Wednesday, March 22 at 1:30 pm2:00 pm, Expo Theater III, Exhibit Hall A
  • 400G P4 Programmable Packet Processing for NFV/SDN
    • Wednesday, March 22 at 2:00 pm2:30 pm, Expo Theater III, Exhibit Hall A

Xilinx Technology-enabled Demonstrations throughout the OFC Show Floor:

  • Dini Group – Booth #2861
  • EXFO – Booth #2725
  • IP Light – Booth #3826
  • MoSys – Booth #3732
  • Finisar – Booth #2403
  • Precise-ITC – Booth #4141
  • TransPacket AS – Booth #1425
  • Xelic – Booth #2774
  • Viavi – Booth #2303

For more information about Xilinx at OFC 2017, visit www.xilinx.com/about/events/ofc17.

About Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT, and 5G Wireless. For more information, visit www.xilinx.com.

© Copyright 2017 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.

Silvia E. Gianelli
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SOURCE Xilinx, Inc.