TEC0330
The Trenz Electronic TEC0330 FPGA board has a PCI Express card form factor and is containing the AMD FPGA-module Virtex 7 XC7VX330T. This high-end FPGA-module is optimized for system performance and is used in applications with high demands on system resources.
This board is designed to fit in computing systems with PCI Express x8 slots (PCIe 2.0 or higher) and has also a SO-DIMM socket to extend the board with DDR3-RAM.
The FMC (FPGA Mezzanine Card) connector provides a high pin count (HPC) and is as an ANSI/VITA 57.1 standard a modular interface to the FPGA for mezzanine expansion cards. Further connectors provide JTAG-interfaces to the FPGA-module and to the on-board System Controller CPLD together with access to high-speed data lanes composed of differential signaling pairs.
All modules produced by Trenz Electronic are developed and manufactured in Germany.
Key Features and Benefits
- AMD Virtex 7 FPGA module XC7VX330T-2FFG1157C
- FMC High Pin Count (HPC) Connector
- 8 MGT-lanes available on PCIe interface
- DDR3 SO-DIMM Socket
- 256 Mbit (32 MByte) Quad SPI Flash memory
- 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
- Programmable quad PLL clock generator
- Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS-pairs possible)
- FPGA board designed as PCIe card is fitting in PCI Express x8 slots (PCIe 2.0 or higher)
What's Included
- Other assembly options for cost or performance optimization plus high volume prices available on request.
