UPGRADE YOUR BROWSER

We have detected your current browser version is not the latest one. Xilinx.com uses the latest web technologies to bring you the best online experience possible. Please upgrade to a Xilinx.com supported browser:Chrome, Firefox, Internet Explorer 11, Safari. Thank you!

Versal Prime Series

Broadest Applicability Across Multiple Markets

The Prime series is the foundation and the mid-range of the Versal platform, serving the broadest applicability across multiple markets. These applications include 100G to 200G networking equipment, network and storage acceleration in the data center, communications test equipment, broadcast, and aerospace & defense. The series integrates mainstream 58G transceivers and optimized I/O and DDR connectivity, achieving low latency acceleration and performance across diverse workloads.

Value

Deliverables

Programmable System Integration

  • Up to 2M System Logic Cells for offloading and HW differentiation
  • Integrated Multi-Rate MAC supports 10/25/40/50GE with 1ns accuracy timestamp for eCPRI and TSN applications
  • Integrated, high performance multichannel DMA
  • PCIe Gen4 with CCIX-compliance for up to 252 virtual functions
  • >1Tbps Network-on-Chip for low latency communications and SoC-like ease of use
  • Multicore Arm A72-based processing system with 2x single-threaded performance of previous generation A53’s
  • Multicore Arm R5-based processing for real-time and deterministic processing

System Performance

  • Up to 2X performance/watt vs. previous generation devices
  • Power-optimized 32G 58G PAM4 transceivers for chip-to-chip, chip-to-optics, direct-attach copper interconnect, and 28G backplanes
  • CCIX and PCIe Gen4
  • 3200Mb/s DDR4 and 4,266Mb/s LPDDR4 with integrated DMA controllers

BOM Cost Reduction

  • Cost-optimized transceivers for high density 25G/50G/100G ports in data center and networking
  • Three operating voltages enables precise performance vs. power tuning without sacrificing performance for core applications
  • Advanced lidless packaging for 40% better thermal performance than competing solutions, saving on heat sink costs

Total Power Reduction

  • Up to 40% lower power vs. previous generation devices (when using new features)
  • Power-optimized transceivers for cost and power sensitive smart Network Interface Cards (NIC), Wireless 5G fronthaul switches (eCPRI) and Network Function Virtualization (NFV) functions

Accelerated Design Productivity

  • Software tools optimized for in-line acceleration and diverse workloads
  • Network-on-Chip methodology for simplified design closure
  • Pre-set interfaces with enhanced security, easily integrated into compute infrastructure

Documentation

Default Default Title Document Type Date
Page Bookmarked