Enabling Next Generation Aerospace and Defense Systems

Product Advantages

Defense-Grade UltraScale+ Zynq MPSoC Product Advantages

XQ UltraScale+ Zynq MPSOCs enable designers with a broad selection of devices to advance state-of-the-art integrated Aerospace & Defense solutions, with the industry’s first heterogeneous multi-processor SOC devices with flexible and dynamically reconfigurable high-performance programmable logic and DSP, 16Gb/s and 28Gb/s transceivers, quad-core ARM Cortex-A53, dual-core ARM Cortex-R5 embedded processors, and optional features including ARM Mali-400 GPU, 4k60 H.265/H.264 video codec, 256-bit PUF, and ruggedized-packages with support for -55C to +125C operation.

Integrated MPSoC Device Features Benefits of Integrated Zynq UltraScale+ MPSoC
  • Ruggedized package, fully <97% Sn on all solder points
  • Full junction temperature support  –55°C to +125°C
  • Mil Std 883 Group D environmental characterization
  • Mask set control
  • Anti-counterfeit marking
  • Quad-core ARM Cortex-A53 MPCore up to 1.33GHz
  • Dual-core ARM Cortex-R5 MPCore up to 533MHz
  • Mali™-400 MP2 GPU,
  • H.264 / H.265 (4x60fps) Video Codec
  • 103K–1,143K System Logic Cells
  • 240–1,968 DSP Slices
  • Enhanced security plus available 256bit PUF
  • ECC on all memories
  • Supports DDR4/3/3L, LPDDR4/3, 32/64b with ECC
  • Up to 5X PCIe Gen4x8/3x16 plus 1X PCIe Gen2 x4
  • Up to 44X GTH 16.3Gb/s and up to 28X GTY 28.2Gb/s
  • Robust packaging meeting harsh environmental needs
  • Ease burden to meet DOD anti-counterfeiting requirements
  • Eliminate high-speed chip to chip connectivity
  • Simplified system design with shared Processing and FPGA memory  
  • Reduced programmable logic needs due to eliminated interfaces
  • Simplified design,
  • Reduced size, weight, and power
  • Increased computed density and efficiency
Product Table

Processing System (PS)

Features All Devices
Application Processing Unit Quad-core ARM Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point; 32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Unit Dual-core ARM Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1 Cache, and TCM
Embedded and External
Memory256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3; External Quad-SPI; NAND; eMMC
General Connectivity

214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple Timer Counters

High-Speed Connectivity 4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
Graphic Processing Unit ARM Mali™-400 MP2; 64KB L2 Cache

Programmable Logic (PL)

  ZU3EG ZU5EV ZU7EV ZU9EG ZU11EG ZU15EG ZU19EG
System Logic Cells (K) 154 256 504 600 653 747 1143
Memory (Mb) 7 23 38 23 43 57 70
DSP Slices 360 1248 1728 2520 2928 3528 1968
Video Code Unit (VCU) - - 1 1 - - -
GTH 16.3 Gb/s Transceivers - 16 20 24 32 24 32
GTY 28.2 Gb/s Transceivers - - - - 16 - 16
Maximum I/O Pins 252 252 360 328 512 328 668
Available M-temp -55C to +125C Yes Yes Yes Yes Yes Yes Yes
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Documentation

Documentation

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