Enabling Next Generation Aerospace and Defense Systems

Product Advantages

Defense-Grade Zynq UltraScale+ RFSoC Product Advantages

XQ Zynq UltraScale+ RFSOCs enable designers with a broad selection of devices to advance state-of-the-art integrated Aerospace & Defense solutions, with the industry’s first heterogeneous multi-processor SOC devices with flexible and dynamically reconfigurable high-performance programmable logic and DSP, 28Gb/s transceivers, quad-core ARM Cortex-A53, dual-core ARM Cortex-R5 embedded processors, and optional features of high-speed 4GSPS ADCs and 6.4GSPS DACs, optional 256-bit PUF, and ruggedized-packages with support for -55C to +125C operation.

Integrated RFSoC Device Features Benefits of Integrated Zynq UltraScale+ RFSoC
  • Ruggedized package, fully <97% Sn on all solder points
  • Full junction temperature support  –55°C to +125°C
  • Mil Std 883 Group D environmental characterization
  • Mask set control
  • Anti-counterfeit marking
  • Quad-core ARM Cortex-A53 MPCore up to 1.33GHz
  • Dual-core ARM Cortex-R5 MPCore up to 533MHz
  • RF/Analog Features:  SD-FEC, 14-bit 6.4 GS/s DAC, 12-bit 4 GS/s ADC
  • 930K System Logic Cells
  • 4,272 DSP Slices
  • Enhanced security plus available 256bit PUF
  • ECC on all memories
  • Supports DDR4/3/3L, LPDDR4/3, 32/64b with ECC
  • Up to 2X PCIe Gen4x8/3x16 plus 1X PCIe Gen2 x4\
  • Up to 16X GTY 28.2Gb/s
  • Integrated high-speed analog eliminates other high-cost components
  • Robust packaging meeting harsh environmental needs
  • Ease burden to meet DOD anti-counterfeiting requirements
  • Eliminate high-speed chip to chip connectivity
  • Simplified system design with shared Processing and FPGA memory
  • Reduced programmable logic needs due to eliminated interfaces
  • Simplified design,
  • Reduced size, weight, and power
  • Increased computed density and efficiency
Product Table

Processing System (PS)

Features All Devices
Application Processing Unit Quad-core ARM Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point; 32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Unit Dual-core ARM Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1 Cache, and TCM
Embedded and External
Memory256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3; External Quad-SPI; NAND; eMMC
General Connectivity

214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple Timer Counters

High-Speed Connectivity 4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII

Programmable Logic (PL)

  XQZU21DR XQZU28DR XQZU29DR XQZU48DR XQZU49DR
System Logic Cells (K) 930 930 930 930 930
Memory (Mb) 60 60 60 60 60
DSP Slices 4272 4272 4272 4272 4272
12-bit, 4.096GSPS ADC - 8 - - -
12-bit, 2.058GSPS ADC - - 16 - -
14-bit, 6.554GSPS DAC - 8 16 - -
14-bit, 2.5GSPS ADC - - - - 16
14-bit, 5GSPS ADC - - - 8 -
14-bit, 10GSPS DAC - - - 8 16
SD-FEC 8 8 - 8
-
GTY 28.2 Gb/s Transceivers 16 16 16 16
16
Maximum I/O Pins 280 347 408 347
408
Available M-temp -55C to +125C Yes Yes Yes Yes Yes
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