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AR# 10042

Data Book - Radiation-Tolerant Devices: Manufacturing Process and Power Consumption

Description

General Description:

What is the process to make devices Radiation-Tolerant?

Is there any difference in power consumption between a Rad-Tolerant and regular device?

Solution

Our radiation-tolerant parts are manufactured using a special epitaxial wafer fab process. This makes the product immune to latchup. Only devices made with this process are guaranteed to be Rad Hard.

There is no difference in power consumption. Both devices utilize the same geometries, with the difference being the epi layer for Rad-Tolerant devices.

AR# 10042
Date Created 08/29/2007
Last Updated 03/06/2013
Status Active
Type General Article