AR# 11768

Description

1) How do I calculate/find MTBF reliability numbers for devices?

2) What is the expected lifetime of a Xilinx Device?

Solution

1) FIT rates for Xilinx devices are published in the Device Reliability Report:

https://www.xilinx.com/support/documentation/user_guides/ug116.pdf

To calculate mean time between failures (MTBF), use 1/FIT.

Notes:

1. The reliability stress tests are conducted according to the conditions specified at JEDEC Solid State Technology Association's reliability test methods for packaged devices (JESD22), except for Group B and D tests in which DSCC's test methods, MIL-STD-883 are followed.
2. Reliability-based testing and the related published data does not apply to engineering samples (ES parts).

2) Expected lifetime of a Xilinx Device:

1. All products meet >20 year life at 85°C.
2. All XC E/I-grade products meet > 10 year life at 100°C⁽¹⁾.
3. All XA and XQ products meet >10 year life at 100°C, and >3 year life at 125°C.

Notes:

1. The recommended maximum operating temperature for high-bandwidth memory is 95°C.
2. For longer or more accurate prediction of product life specific to your application, please contact your FAE and the Xilinx quality team.