We have detected your current browser version is not the latest one. Xilinx.com uses the latest web technologies to bring you the best online experience possible. Please upgrade to a Xilinx.com supported browser:Chrome, Firefox, Internet Explorer 11, Safari. Thank you!

AR# 14154

PACKAGING - Ceramic Brazed QFP and CGA: Is the package grounded? Which way does the die face in a CB type package?



General Description:

Are ceramic brazed QFP and CGA packages grounded? (Not the heatsink or the pads, but the package itself?)

Which way does the die face in a CB type package?


1. The ceramic is not grounded; rather, it acts as an insulator.

2. On the CB100, CB164, and CB196 packages, the die faces up.

(NOTE: This is a ceramic column grid array package that is used primarily for military/space applications. The ceramic acts as an insulator. However, the back side of the silicon is grounded to the heatsink, as it is attached to the heatsink through some conductive adhesive. Thus, the silicon and heatsink have the same polarity.)

AR# 14154
Date 12/15/2012
Status Active
Type General Article
Page Bookmarked