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AR# 15037

Virtex-II Pro RocketIO - Does packaging (i.e., wire-bonded or flip-chip) introduce speed limitations?

Description

Does packaging (i.e., wire-bonded or flip-chip) introduce speed limitations?

Solution

Yes. Wire-bonded packages will only operate up to ~2.5 Gb/s, while the achievement of the maximum rate of 3.125 Gb/s requires flip-chip packaging.

AR# 15037
Date Created 09/03/2007
Last Updated 05/14/2014
Status Archive
Type General Article