AR# 40691

Packaging Design Assistant - Part Selection and Ordering

Description

During the part selection and ordering process question can arise on topics such as part marking deciphering, material declarations, and other device specific considerations which can be used. This collection of Articles is targeted at these types of issues.

NOTE: This Answer Record is a part of the Xilinx Packaging Solution Center (Xilinx Answer 40687).

Solution

Part Markings

(Xilinx Answer 1067) FPGA/CPLD/PROM - What does the ordering part number of Xilinx devices mean? How can I find the device family from a part number? What do the part top markings for Xilinx devices mean?
(Xilinx Answer 20888) Packaging - What is the purpose of the bar code label?

Material Declaration

(Xilinx Answer 21277) Packages - Where can I find the Materials Declaration Data Sheet for a package?

Device Specific

(Xilinx Answer 36364) Spartan-6 FPGA - What is the -3N speed grade?
(Xilinx Answer 34395) Spartan-6 FPGA Packaging - Why does the Spartan-6 LX45 have more pins than the LX75 in the FG(G)484 package?
(Xilinx Answer 37512) Spartan-6 FPGA - Are LX45 FGG676 and LX75 FGG676 pin-compatible?
(Xilinx Answer 30030) Spartan-3A FPGA - Additional information regarding new package offerings of the VQ100 and the FT256
(Xilinx Answer 20947) Stepping FAQs - What is a silicon stepping level? How do I determine the stepping level of a device? What do I do in the software? How do I order a certain stepping level?

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AR# 40691
Date	12/15/2012
Status	Active
Type	General Article

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