When I target a Virtex-7 device, MAP reports the following error:
"ERROR:Pack:2938 - The "IOB33" component can not be placed in this particular device. Because there is no bonded sites on the device with the same type as the component. Please select a different device.
ERROR:Map:237 - The design is too large to fit the device. Please check the Design Summary section to see which resource requirement for your design exceeds the resources available in the device. Note that the number of slices reported may not be reflected accurately as their packing might not have been completed."
I do not see any component by this name in my netlist.
What is causing this error?
Only a certain subset of devices/packages in Virtex7 support HR (High Range) I/Ovoltages from 1.2V up to 3.3V. The rest of the packages only have HP( high performance) I/O voltages from 1.2V to 1.8V. If you have assigned an I/O voltage greater than 1.8V to a device that does not support it, this error occurs. Youmust choose a package/device that supports this voltage.
The followingdocument provides information on the devices thatsupport the HR I/Os: http://www.xilinx.com/support/documentation/data_sheets/ds180_7Series_Overview.pdf
ACR has been filed to enhance the message for a future release.