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AR# 65463

Zynq UltraScale+ MPSoC - What devices are supported for configuration?

Description

When choosing a flash device to incorporate with Zynq UltraScale+ MPSoC devices, it is important to consider the following logistical criteria:

  • Is the device supported for the Xilinx tools?
  • Will the device work with the Zynq device BootROM?
  • Is the device supported with software like U-Boot and Linux?

In addition, there are design considerations which include:

  • How many pins are required for a configuration method?
  • How much flash memory is required?
  • How fast can the Zynq device be configured?
  • How difficult is it to manage the flash device?

Based on the logistical criteria, there are three categories of flash devices:

  • Xilinx Tested and Supported Flash Devices - These devices meet the logistical criteria listed above.

     

    These devices receive regression testing with Xilinx tools and their use is fully supported by Xilinx Technical Support.

     

  • Known to Work Flash Devices - These devices are not explicitly supported in the Xilinx tools, but have been known to work with Zynq UltraScale+ MPSoC devices.

     

    Many of these devices are programmed using U-Boot as an alternate programming method, but source changes to U-Boot might have to be made by users in order to configure that specific device.

     

  • Unverified Flash Devices - These devices have not been tested in any way by Xilinx with Zynq UltraScale+ MPSoC devices.

     

    There are NO known issues (but possible limitations) for these devices.

    The user will be responsible for validating the flash on Zynq UltraScale+ MPSoC, making necessary changes to U-Boot and configuring the device.

     

  • Incompatible Flash Devices - These devices will not work on Zynq UltraScale+ MPSoC.

     

     

Note: Xilinx Technical Support will not be able to provide assistance with designs using "Known to Work" or "Unverified" flash devices.

Xilinx can only provide assistance for the devices listed as 'Xilinx Tested and Supported'.

Solution

QSPI

Benefits of QSPI:

  • High performance - QSPI is the fastest configuration solution.
  • Low Pin count - QSPI has the lowest pin count of the configuration solution options besides SD.
  • Easy management - QSPI can be accessed as linear memory in Zynq devices. In addition, NO bad blocks management is required.
  • XIP - QSPI is the only mode that supports execute-in-place

Downsides of QSPI:

  • Low memory density

Vendors

VendorQSPI Flash Families
MicronMT25, N25Q
SpansionS25FL,S70FL
MacronixMX25, MX66
WinbondW25Q

Configuration and Specifications

There are two distinct boot modes relative to QSPI:

  • QSPI24: 24-bit addressing
  • QSPI32: 32-bit addressing

The QSPI boot image search limit are listed below.


Memory ConfigurationMIO PinsBoot Image Search Limit
QSPI24 - Single Memory716 MB (Linear Mode)
QSPI24 - Dual Stack Memory8*16 MB (Linear Mode)
QSPI24 - Dual Parallel Memory1332 MB (Linear Mode)
QSPI32 - Single Memory7256 MB
QSPI32 - Dual Stack Memory8*256 MB
QSPI32 - Dual Parallel Memory13512 MB


NOTE(*): In case of Dual Stack Memory, Zynq US+ MPSoC only boots from the "lower" QSPI (Same as "Single Memory").

Xilinx Supported Devices

Flash DeviceModeVendorFlash DensityVoltageSupport
Category

Vivado/SDK

Flash Programmer

U-BootNotes
MT25QU512AQuad Mode - Single - Dual Parallel Micron512 Mb1.8VXilinx
Supported
2016.12016.01
MT25QL512AQuad Mode - Single - Dual Parallel and StackedMicron512 Mb3.3VKnown to Work2016.04Stacked still "Unverified Flash".
MT25Q[UL]01GQuad Mode - Single - Dual Parallel and StackedMicron1024 Mb1.8V/3.3VXilinx
Supported
2016.32016.03
MT25Q[UL]02GQuad Mode - Single - Dual Parallel and StackedMicron2048 Mb1.8V/3.3VKnown to WorkSee Notes.2016.04

Stacked still "Unverified Flash".

UG908 is INCORRECT: This density is planned to be supported in 2017.3 Vivado.

N25Q64Quad Mode - Single - Dual Parallel and StackedMicron64 MbXilinx
Supported
2016.42016.04
N25Q128AQuad Mode - Single - Dual Parallel Micron128 Mb1.8VXilinx
Supported
2016.42016.01
N25Q256Quad Mode - Single - Dual Parallel and StackedMicron256 MbXilinx
Supported
2016.42016.04
N25Q512Quad Mode - Single - Dual Parallel Micron512 Mb1.8VXilinx
Supported
2016.42016.01
N25Q00Quad Mode - Single - Dual Parallel and StackedMicron1024 MbXilinx
Supported
2016.42016.03
S25FL128SQuad Mode - Single - Dual Parallel and StackedSpansion128 MbXilinx
Supported
2016.42016.04
S25FL256SQuad Mode - Single - Dual Parallel Spansion256 Mb3.3VXilinx
Supported
2016.42016.01
S25FL512SQuad Mode - Single - Dual Parallel and StackedSpansion512 MbXilinx
Supported
2016.42016.03
S70FL01GSQuad Mode - StackedSpansion1024 MbXilinx
Supported
2016.42016.03This part is two 512 Mb dies in a single package (Dual Stacked Only).
S70FS01GSQuad Mode - Single - Dual Parallel and StackedSpansion1024 MbUnverified Flash
MX66L1G45GQuad Mode - Single - Dual Parallel and StackedMacronix1024 Mb3.3VKnown to Work2016.04
MX25L25635FQuad Mode - Single - Dual Parallel Macronix256 MbXilinx
Supported
2016.42016.01
W25Q64FVQuad Mode - Single - Dual Parallel Winbond64 Mb3.3VKnown to Work2016.01Stacked still "Unverified Flash".

 

 

NAND
Benefits of NAND:
  • High Memory density - NAND is an inexpensive solution for large density devices.
Downsides of NAND:
  • Lower device performance - Maximum bandwidth is less than QSPI.
  • High pin count - NAND devices require more pins than QSPI.
  • Difficult Management - NAND devices are hard to manage. Bad blocks are a regular concern which require design decisions on how bad blocks will be managed for a particular system setup.
Vendors
VendorNAND Flash Families
MicronMT29F
CypressS34ML

Configuration and Specifications
Memory ConfigurationMIO PinsBoot Image Search Limit
NAND - x817128 MB

Xilinx Supported Devices
Flash DeviceModeVendorFlash DensityClassificationVoltageSupport
Category
Vivado/SDK
Flash Programmer
U-BootNotes
MT29F2G08ABxx8Micron2 Gb1 Die, 1 CE#, 1 RB#1.8 V /3.3 VUnverified Flash
MT29F32G08ABCx8Micron32 Gb1 Die, 1 CE#, 1 RB#3.3 VKnown to Work2015.04
MT29F64G08AECx8Micron64 Gb2 Die, 2 CE#, 2 RB#3.3 VKnown to Work2016.01
S34ML01G1x8Cypress1 Gb1 Die, 1 CE#, 1 RB#3.3 VUnverified Flash
S34ML02G1x8Cypress2 Gb1 Die, 1 CE#, 1 RB#3.3 VKnown to Work2016.03
S34ML08G101TFI200x8Cypress8 Gb2 Die, 2 CE#, 2 RB#3.3 VUnverified Flash
 
SD
Benefits of SD:
  • High density - SD has densities comparable to NAND.
  • Easy Management - Device is generally managed as a file system. Bad blocks do not need to be managed in the user design.
Downsides of SD:
  • Slow performance - SD is slower than QSPI
  • Mechanical considerations - SD cards require a connector.
Configuration and Specifications
Memory ConfigurationMIO PinsBoot Image Search Limit
SD Card (4-bit data)6
8,192 files

 

Xilinx Supported Devices

Any compliant card. See the SD/SDIO Controller Chapter of (UG1085).

eMMC
Benefits of eMMC:

  • High density - eMMC has densities comparable to NAND.
  • Easy Management - Device is generally managed as a file system. Bad blocks do not need to be managed in the user design.
Downsides of eMMC:
  • Slow performance - eMMC is slower than QSPI
Configuration and Specifications

Memory ConfigurationMIO PinsBoot Image Search Limit
eMMC (8-bit data)12
8,192 files
 
Xilinx Supported Devices

Flash Device

VendorFlash Density

JEDEC Version

Support CategoryVivado/SDK
Flash Programmer
U-BootNotes
MTFC4GMVEA-4M ITMicron4 GB4.41Unverified Flash
MTFC8GLVEA-1M WTMicron8 GB4.41Known to Work2016.01
MTFC8GAKAJCN-1M ITMicron8 GB5.0Known to Workn.a.Only Standalone driver was tested.
MTFC32GJDED-4M ITMicron32 GB4.41Known to Work2016.03
MTFC64GJDDN-4M ITMicron64 GB4.41Known to Work2016.03
THGBMFG6C1LBAILToshiba8 GB5.1Known to Work2016.01
EMMC04G-S100-A08UKingston4 GB5.0Known to Workn.a.Only Standalone driver was tested.
AR# 65463
Date 02/17/2017
Status Active
Type General Article
Devices
  • Zynq UltraScale+ MPSoC