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AR# 7830

Packaging - Does Xilinx support rework/reballing of BGA packages?

Description

If a BGA package is removed from a board, can the package be reballed and remounted to the PCB?

Solution


Xilinx does not recommend any rework/reballing for BGAs. Once the part is removed from the board, Xilinx does not guarantee reliability of the part if it is remounted on the PCB.
A maximum of three reflow cycles (including initial assembly, rework and reballing) are allowed.
AR# 7830
Date Created 08/21/2007
Last Updated 07/30/2014
Status Active
Type General Article
Devices
  • Virtex-II
  • Virtex-II Pro
  • Virtex-II Pro X
  • More
  • Virtex-II QPro/R
  • Virtex-6 CXT
  • Virtex-6 HXT
  • Virtex-6 LX
  • Virtex-6 LXT
  • Virtex-6 SXT
  • Virtex-7
  • Virtex-5 FXT
  • Virtex-5 LX
  • Virtex-5 LXT
  • Virtex-5 SXT
  • Virtex-5 TXT
  • Virtex-5Q
  • Virtex-5QV
  • Virtex-4 FX
  • Virtex-4 LX
  • Virtex-4 QPro/R
  • Virtex-4 SX
  • Virtex
  • Virtex QPro/R
  • Virtex-E
  • Virtex-E QPro
  • Virtex-EM
  • Less