AR# 7830

Packaging - Does Xilinx support rework/reballing of BGA packages?

Description

If a BGA package is removed from a board, can the package be reballed and remounted to the PCB?

Solution

Xilinx does not recommend any rework/reballing for BGAs. Once the part is removed from the board, Xilinx does not guarantee reliability of the part if it is remounted on the PCB.
A maximum of three reflow cycles (including initial assembly, rework and reballing) are allowed.

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AR# 7830
Date	07/30/2014
Status	Active
Type	General Article
Devices	Virtex-II Virtex-II Pro Virtex-II Pro X More Virtex-II QPro/R Virtex-6 CXT Virtex-6 HXT Virtex-6 LX Virtex-6 LXT Virtex-6 SXT Virtex-7 Virtex-5 FXT Virtex-5 LX Virtex-5 LXT Virtex-5 SXT Virtex-5 TXT Virtex-5Q Virtex-5QV Virtex-4 FX Virtex-4 LX Virtex-4 QPro/R Virtex-4 SX Virtex Virtex QPro/R Virtex-E Virtex-E QPro Virtex-EM Less

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AR# 7830

Packaging - Does Xilinx support rework/reballing of BGA packages?

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