The Data Book contains a short description of "cavity up" and "cavity down", but does not discuss BGA Packages.
Which BGA packages are cavity-up and which are cavity-down?
The BGA packages listed below are assembled cavity-down. These packages are also encapsulated and are thermally-enhanced packages (there is a copper heat sink on top of the packages):
The following BGA Packages are assembled cavity-up and are plastic molded: