General Description:
The Data Book contains a short description of "cavity up" and "cavity down", but does not discuss BGA Packages.
Which BGA packages are cavity-up and which are cavity-down?
The BGA packages listed below are assembled cavity-down. These packages are also encapsulated and are thermally-enhanced packages (there is a copper heat sink on top of the packages):
- BG352
- BG432
- BG560
- FG680
- FG860
The following BGA Packages are assembled cavity-up and are plastic molded:
- BG225
- BG256
- FG256
- FG456
- FG676
- FG900
- FG1156
| AR# 9241 | |
|---|---|
| Date | 12/15/2012 |
| Status | Active |
| Type | General Article |