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  3. Board System Design

Versal ACAP Design Process Documentation

Xilinx documentation is organized around a set of user design processes to help you find relevant content for your design needs. The high-level design processes are displayed below. Click on the design process of interest for more information.

Board System Design: Provides guidance for designing a PCB board though schematics and board layout. Also involves power, thermal and signal integrity considerations.

Guided
Page-1 Sheet.157 Schematic Entry Schematic Entry Sheet.183 Circle.527 Sheet.185 Sheet.218 PCB Layout and Si Simulation PCB Layout and Si Simulation Sheet.220 Circle.221 Sheet.222 Sheet.259 Prototype Build and Test Prototype Build and Test Sheet.261 Circle.262 Sheet.263 Sheet.289 Sheet.291 Sheet.297 Power and thermal design Power and thermal design Sheet.300 Transceiver design Transceiver design Sheet.303 ACAP symbol creation ACAP symbol creation Sheet.306 Select IO design (XPIO, HDIO, MIO) Select IO design (XPIO, HDIO, MIO) Sheet.309 Configuration design Configuration design Sheet.312 Power and thermal design Power and thermal design Sheet.315 Transceiver design Transceiver design Sheet.318 Select IO design (XPIO, HDIO, MIO) Select IO design (XPIO, HDIO, MIO) Sheet.321 Configuration design Configuration design Sheet.324 Power validation Power validation Sheet.327 Thermal and mechanical validation Thermal and mechanical validation Sheet.330 Memory validation Memory validation Sheet.333 Transceiver validation Transceiver validation Sheet.336 Configuration Configuration Sheet.338 Overview Overview Sheet.339 Sheet.352 System monitor validation System monitor validation
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